1. Lead Free SMD Film Capacitors - Munich 15/11/2006 1 Lead Free SMD Film Capacitors November 2006 Francesco Bergamaschi - Product Manager f.bergamaschi@arcotronics.com

2. Lead Free SMD Film Capacitors - Munich 15/11/2006 2 Outline - Lead Free status: reflow process main trends and Arcotronics choice - Arcotronics Lead Free SMD series overview - Lead Free processes / Hybrid processes

3. Lead Free SMD Film Capacitors - Munich 15/11/2006 3 Lead Free status Reflow process main trends -Reflow alloy : Sn – Cu (0.7%) – Ag (1.5% – 3.5%) -T max during reflow = 245 – 260 °C -Hybrid processes: soldering with Lead Rich solder alloy and Lead Free components is widespread in this transition period towards a totally Lead Free process.

4. Lead Free SMD Film Capacitors - Munich 15/11/2006 4 Arcotronics has developed a complete range of Lead Free SMD Film capacitors, not only general purpose but also specific capacitors. This was possible thanks to the availability of different dielectrics. Lead Free status Arcotronics choice

5. Lead Free SMD Film Capacitors - Munich 15/11/2006 5 Arcotronics choice was to develop SMD Lead Free Film Capacitors in PEN (LDE series) and PPS (LDB series). These plastic dielectrics have the best features to design components able to withstand the Lead Free reflow soldering temperatures (melting point). Lead Free status Arcotronics choice

6. Lead Free SMD Film Capacitors - Munich 15/11/2006 6 SMD Lead Free series manifacturing process was designed to have components not only able to withstand the high reflow process temperatures but also to have good solderability performances: New thermal treatment Terminations milling Lead Free status Arcotronics choice

7. Lead Free SMD Film Capacitors - Munich 15/11/2006 7 Nickel barrier and pure tin (100%) on end terminations Lead Free status Arcotronics choice

8. Lead Free SMD Film Capacitors - Munich 15/11/2006 8 Arcotronics Lead Free SMD series LDE series – PEN dielectric -Available sizes: 12.06 to 60.54 -Capacitance values: 1000 pF to 4.7 µF -Rated voltage: 50 Vdc to 1000 Vdc (new series)

9. Lead Free SMD Film Capacitors - Munich 15/11/2006 9 Arcotronics Lead Free SMD series LDE series – new 1000 Vdc series -Available sizes: 22.20 to 60.54 -Capacitance values: 1000 pF to 0.1 µF -250 V AC withstanding -ITU K20 & K21 compliant

10. Lead Free SMD Film Capacitors - Munich 15/11/2006 10 Arcotronics Lead Free SMD series LDB series – PPS dielectric -Available sizes: 12.06, 12.10 and 18.12 -Capacitance values: 3300 pF to 0.1 µF -Rated voltage: 16 and 50 Vdc -2% tolerance available

11. Lead Free SMD Film Capacitors - Munich 15/11/2006 11 Soldering recommendations -Max. time over 217°C = 150 sec -Max. temperature ramp rate = 3 °C / sec (heating) 6 °C / sec (cooling) -T max on the component body = in line with JEDEC 020C July ‘04 with some limitations -Max. time between T max and T max – 5 °C = 40 sec (T max up to 250 °C) 10 sec (T max > 250 °C) Arcotronics Lead Free SMD series

12. Lead Free SMD Film Capacitors - Munich 15/11/2006 12 Lead Free processes / Hybrid processes Lead Rich reflow process was well standardized Lead Free reflow process is definitely not standardized The Lead Free components have to meet in the best possible way all the different process characteristics

13. Lead Free SMD Film Capacitors - Munich 15/11/2006 13 In the Lead Free reflow process, the following designs are not standardized: landing areas materials reflow alloy reflow profiles PCB material Lead Free processes / Hybrid processes

14. Lead Free SMD Film Capacitors - Munich 15/11/2006 14 The choice of a pure tin deposition was made by Arcotronics as it was found to be the best compromise between all these different processes. Furthermore, the Lead Free reflow is still not so widespread. Hybrid process are implemented most of the times. Lead Free processes / Hybrid processes

15. Lead Free SMD Film Capacitors - Munich 15/11/2006 15 Not all active neither passive components are ready for the Lead Free process (mainly because of the higher T max with respect to the Lead Rich process). The choice of a pure Sn deposition has shown to be compatible with the Hybrid processes that are running (Lead Rich solder alloy with Lead Free and Lead Rich components). Lead Free processes / Hybrid processes