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1
Welcome to ChipMOS Quality Laboratory
Laboratory instrument introduction-----1:30~2:00 SAT instrument operation :00~3:00 COF defect sample inspection (OM/Decapsulation/SEM) :00~3:30 COF electrical measurement :30~4:00 COF mechanical test (die strength) --- 4:00~4:30
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Failure Analysis Procedure
SAT Picture XRM Image SEM Photo LCM Photo Hot Spot (Defect)
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Scanning Acoustic Tomograph Inspection
Die Surface Delamination Mode TSOPII 50L Die Crack Mode mBGA 70B 2 1
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COF Defect Location and Decapsulation
COF (48mm) Peeling from tape after decapsulation Fuming Nitric Acid (100%) Room temperature 30mins Rinse by acetone
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Optical Microscope (OM) Inspection after Decapsulation
50X Stereo OM 200X 500X
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Scanning Electron Microscope (SEM) Inspection and
Energy Dispersive X-ray (EDX) Detection SEM
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Electrical Measurement (COF/Chip)
Probe station Curve tracer I (mA) I (mA) I (mA) Short Pass Open V (v) V (v) V (v)
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Mechanical Test (Die Strength)
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