1. Bulk CMOS Process Description
N-well process
Single Metal Only Depicted
Double Poly
Prepared by Randy Geiger, September 2001

2. Components Shown n-channel MOSFET p-channel MOSFET Poly Resistor
Doubly Poly Capacitor

3. D C A A’ B’ B C’ D’

4. Consider Basic Components Only
Well Contacts and Guard Rings Will be Discussed Later

5. A A’ B B’

6. A A’ B B’

7. A A’ S D B G D B S B’
n-channel MOSFET G

8. A A’ S D B G B B’ W L

9. A A’
Resistor
Capacitor
p-channel MOSFET B B’
n-channel MOSFET

10. N-well Mask A A’ B B’

11. N-well Mask A A’ B B’

12. Detailed Description of First Photolithographic Steps Only
Top View
Cross-Section View

13. Implant ~ ~ Blank Wafer n-well Mask Photoresist A A’ p-doped Substrate
Develop
Expose B’ B

14. Develop
Exposure
N-well Mask
Photoresist
A-A’ Section
B-B’ Section

15. Implant
A-A’ Section
B-B’ Section

16. N-well Mask
A-A’ Section
n-well
B-B’ Section

17. Active Mask A A’ B B’

18. Active Mask A A’ B B’

19. Active Mask
Field Oxide
A-A’ Section
Field Oxide
Field Oxide
Field Oxide
B-B’ Section

20. Poly1 Mask A A’ B B’

21. Poly1 Mask A A’ B B’

22. A A’
Resistor
Capacitor
P-channel MOSFET B B’
n-channel MOSFET

23. Poly 1 Mask
A-A’ Section
Gate Oxide
Gate Oxide
B-B’ Section

24. Poly 2 Mask A A’ B B’

25. Poly 2 Mask A A’ B B’

26. Poly 2 Mask
A-A’ Section
B-B’ Section

27. P-Select A A’ B B’

28. P-Select A A’ B B’

29. P-Select Mask – n-diffusion
A-A’ Section
n-diffusion
B-B’ Section

30. P-Select Mask – p-diffusion
A-A’ Section
p-diffusion
B-B’ Section

31. Contact Mask A A’ B B’

32. Contact Mask A A’ B’ B

33. Contact Mask
A-A’ Section
B-B’ Section

34. Metal 1 Mask A A’ B B’

35. Metal 1 Mask A A’ B B’

36. Metal Mask
A-A’ Section
B-B’ Section

37. A A’ B B’

38. A A’
Resistor
Capacitor
P-channel MOSFET B B’
n-channel MOSFET

39. D C A A’ B’ B C’ D’

40. That’s all folks!