1. Package Substrate Jan. 2010

2. 2 Business Confidential Top Metallization 18.30 mm 18.30 mm Bottom Metallization Beryllium Oxide OR Alumina We should see the multiple vias on the back also, for the Option 1

3. 3 Business Confidential Top Metallization 18.30 mm 18.30 mm Bottom Metallization Beryllium Oxide Now, with this design is possible to have less than 300 vias total and then the price in 50k quantity may be $11.00/ea. Please see my message Dec.17, 09

4. 4 Business Confidential Option 1 - Ceramic Substrate with Vias 100 Signal Vias 6 mil Beryllium Oxide OR Alumina 13 mil 750 Ground Vias 6 mil In the case of ROGERS material, that has low thermal conductivity, it was necessary to have as many copper vias as possible; However, when switching to BeO substrate, so may vias are no longer necessary. Since we still need to connect back of the die to the ground plane, we accomplish this with a reduced number of vias. Please see next slide.

5. 5 Business Confidential Option 1A - Ceramic Substrate with LESS Vias 100 Signal Vias 6 mil Beryllium Oxide ONLY, NOT Alumina 13 mil Fewer Ground Vias 6 mil In the case of ROGERS material, that has low thermal conductivity, it was necessary to have as many copper vias as possible; However, when switching to BeO substrate, so may vias are no longer necessary. Since we still need to connect back of the die to the ground plane, we accomplish this with a reduced number of vias. See next slide.

6. 6 Business Confidential Option 2 - Ceramic Substrate with Conductive buttons 13 mil Copper Button 100 Signal Vias 6 mil

7. 7 Business Confidential Sub. FRAME (Stiffener) Can you cut the Ceramic substrates out of a panel and put them on an adhesive plastic foil (same as sawed wafer) in a matrix of 2 x 5 or 2 x 10 ? Adhesive plastic foil (same as sawed wafer) Yes. It is a common practice for USM. We call this –FF, i.e. Film Frame.; HOWEVER, our standard is a 5inch or 6inch diameter or more, circular frame. Does it have to be rectangular frame? Please provide info about minimum spacing between Substrates.

8. 8 Business Confidential General Info: Application: Communication device Ambient Temp: -45 to 85 °C Number of Layers2 General Requirements: RoHS Compliant Operating temperature 125 °C Flammability UL94 V-0