1. NEWATLASPIX: Development of new pixel detectors for the ATLAS experiment upgrade Giulio Pellegrini

2. 2 CNM-IMB Overview Clean Room 1.500 m2 Class 10 to 10.000 50 staff members Suitable for VLSI Laboratories Packaging Test and Characterization Reverse Engineering Silicon Micromachining Simulation CAD Nanotechnology Belongs to CSIC Devoted to microelectronics 175 staff members Departments: Micro and Nano systems Electronic System Design Clean room for full microelectronics fabrication Instituto de Microelectrónica de Barcelona – IMB Centro Nacional de Microelectrónica – CNM

3. 3 Personnel at CNM-IMB Dr. Giulio Pellegrini (IP) Dr. Celeste Fleta Corral Daniela Bassignana, PhD student JuanPablo Balbuena Valenzuela, PhD student Total EDP= 4 Radiation Detector Group at CNM-IMB. Clean room staff will support the fabrication of silicon devices.

4. 4 Objectives Contribute to various aspects of the development of pixel sensors for the upgraded ATLAS Inner Detector 3D sensors 3D thin sensors Planar sensors (active edges or slim edges) Planar thin sensors

5. 5 Background on 3D Detector Structure Invented in 1997 - S. Parker, C. Kenney, J. Segal - First produced in 1999 - Stanford Nanofabrication facility Recent development: R&D towards experimental use -Improvements in micromachining make larger-scale, reliable production more feasible -Simplified structure: Double Sided, G. Pellegrini et al. CNM-IMB was the second Institute in the world succeeding to fabricate 3D detectors Nucl. Instr. Meth. A, vol. 395, 328, 1997 IEEE Trans. Nucl. Sci, vol. 54, no. 4, Aug. 2007 N- and p-type columns etched from opposite sides of substrate Columns do not pass through full substrate thickness 250μm deep in 300μm substrate.

6. 6 Production Objectives: In this project we propose the fabrication of 3D pixel detectors in the CNM-IMB clean room facilities for the Atlas collaboration. The pixel detectors will be bump bonded to the FI3 and the new FI4 read out electronics. The successful fabrication will open the possibility for CNM-IMB together with IFAE to participate in the supply of the detectors and complete modules for the atlas b-layer.

7. 7 Thin and edgeless detectors Thin detectors fabricated in SOI wafers. Development of the bump bonding for thin pixel detectors. New active edge detectors, pixel and strip configuration. New trenched detectors.

8. 8 Other applications CNM-IMB in the framework of CERN RD50 collaboration has fabricated the first 3D detectors coupled to Medipix2 read out electronics. In collaboration with University of Glasgow and Diamond light source we have obtained the first images using the synchrotron test beam facilities available at Diamond. Future applications for 3D detectors: Medipix3 for medical imaging. Other experiments: FP420, TOTEM, CMS and future accelerators.

9. 9 Work Plan The fabrication of 3D detectors and planar detectors with active edges is longer that standard planar ones. This means that one year is insufficient to fabricate, bump bond, irradiate and test the devices.

10. 10 CNM collaborations CNM-IMB is participating in 3 collaborations for the Atlas upgrade: ATLAS 3D Sensor collaboration Rd50- 3D group Planar Pixel Sensor collaboration, Atlas CNM-IMB is also collaborating with different institutes: University of Liverpool – UK Detector development and characterization Radiation hardness studies University of Glasgow – UK 3D detectors Diamond light source Test beam with X-rays, active edges Brookhaven National Laboratory – USA Stripixel, 3D Helsinki Institute of Physics Thin 3D detectors

11. 11 CNM-IMB budget Execution costs = 126.000 € Wafers = 11.000€ Fabrication in the clean room= 55.000€ Mask sets= 50.000€ Others= 10.000€ Travels and conferences = 42.000 € Small equipments (Keithley, etc.)= 20.000 € Other costs= 3.500 € Total=191.500€ Personnel (1 engineer x 2 years) 73.500 €.

12. Thanks for your attention Giulio Pellegrini