1. Page 1 Active MEMS for Wireless and Optical Space Communications Principal Investigators: Frank Merat, Stephen Phillips Task Number: NAG3-2578 Case Western Reserve University September 18, 2002 NASA Space Communications Symposium

2. Page 2 Active MEMS for Communications Project Overview Design MEMS focusing mirrors with electrostatic actuated pointing mechanisms. Develop batch microfabrication processes. Produce and test devices. start date 12/01/01. 100  m

3. Page 3 Active MEMS for Communications Enterprise Relevance and Impact Enterprise Relevance: This technology has applications in access and proximity networks. Planetary exploration missions are the primary targets where: 1. Access networks are used for communications between satellites and surface vehicles. 2. Proximity networks are used for communications between surface vehicles. Impact: Mass produced MEMS based transmitters and receivers for optical links in proximity and access networks promise: 1. Reduced manufacturing costs 2. Reduced system mass

4. Page 4 Active MEMS for Communications Milestones - Technical Accomplishments and Schedules Due DateMilestone DescriptionTech Accomplishments 1April 2002Characterize MultiPoly for mirror design 1mm radius of curvature achieveable Schedule StatusSchedule Deviation Completednone Film Thickness (µm, from SiO 2 interface) Film Stress (MPa) 615 C 570 C             -300 -200 -100 0 100 200 300 700800900100011001200 tensile compressive as-deposited Annealing Temperature (C) Stress (MPa) 570 615 MultiPoly

5. Page 5 Active MEMS for Communications Milestones - Technical Accomplishments and Schedules Due DateMilestone DescriptionTech Accomplishments 2June 2002Verify MultiPoly fabrication for device fabrication Multilayers with prescribed curvatures demonstrated Schedule StatusSchedule Deviation Completednone

6. Page 6 Active MEMS for Communications Milestones - Technical Accomplishments and Schedules Due DateMilestone DescriptionTech Accomplishments 4December 2002Verify actuated devices with electrodes and doped structures Devices in process Schedule StatusSchedule Deviation In progress none Due DateMilestone DescriptionTech Accomplishments 3September 2002Develop deposition and etch processes for doped Multipoly Wafers processed, Verification in progress Schedule StatusSchedule Deviation In progressNear schedule

7. Page 7 Active MEMS for Communications Risks RiskImpactResolution Plan 1Poor doped device etching Delays schedule Delays demonstration Modify etch process. Process new wafers 2Unexpected doped device curvature Delays schedule Delays demonstration Modify device design Process new wafers 3Doped devices do not actuate Delays demonstrationIsolate failure source Redesign devices/processes Process new wafers

8. Page 8 Active MEMS for Communications Funding Issues Phase one funding ended on budget. Phase two funding through March 2003. Student funding (1 graduate assistant) budgeted. Processing fees are thin.

9. Page 9 Active MEMS for Communications Future Plans EventGoals 1Doped device verificationSuccessful release of devices Achieve desired curvature 2Active device demonstrationElectrical actuation demonstration Achieve desired steering angles

10. Page 10 Active MEMS for Communications Papers and Awards Provide a list of all papers published and awards received.