1. FVTX Wedge Assembly WBS 1.4.1.3.3, 1.4.1.3.4, 1.4.1.3.5, 1.4.1.3.6, 1.4.1.3.7, 1.4.1.3.8 David Winter Columbia University FVTX Wedge Manager

2. Winter FVTX Review November 2008 2 Talk Outline Scope –WBS 1.4.1.3.3 Attach HDI/Backplane –WBS 1.4.1.3.7 Bond Chips –WBS 1.4.1.3.8 Test Chips and HDI –WBS 1.4.1.3.4 Attach Sensor –WBS 1.4.1.3.5 Wire bond Assembly –WBS 1.4.1.3.6 Test Assembly Wedge Schedule Prototyping –Assembly Procedure –Assembly Fixtures QA Testing and Manpower Summary HDI Detector FPHX Chips Backplane Thermally conductive adhesive Thermally and electrically conductive adhesives ~10 cm

3. Winter FVTX Review November 2008 3 Scope Prepare assembly lab(s) Develop assembly procedure Receive backplanes, high-density interconnects (HDIs), sensors –All components arrive tested and qualified –HDIs populated with passive components Assemble received components into wedges Execute QA and testing procedures Enter QA/Test results into database Store assembled units Deliver assembled wedges to detector assembly facility at BNL

4. Winter FVTX Review November 2008 4 Wedge Schedule Highlights of Dates Important to Assembly Prototyping and design of components, fixtures: In progress Procure and Test sensors:2/11/099/8/09 Procure HDI: 1/2/093/12/09 Fabrication of backplanes: 20/2/096/19/09 Procure Wedge Assembly fixtures: 9/26/0811/6/08 FNAL testing of production run of FPHX: 4/1/106/23/10 Wedge assembly: 6/22/093/04/11 –WBS 1.4.1.3.3 Attach HDI to Backplane: 6/22/091/15/10 –WBS 1.4.1.3.7 Bond FPHX chips: 6/24/101/19/11 –WBS 1.4.1.3.8 Test chips and HDI: 7/1/101/26/11 –WBS 1.4.1.3.4 Attach sensor: 7/8/102/2/11 –WBS 1.4.1.3.5 Wire bond: 7/12/102/4/11 –WBS 1.4.1.3.6 Testing Assembly: 8/9/103/4/11 Endcap assembly (into cage structure): 9/6/106/1/11 Important dependencies Critical path components: FPHX, HDI prototype Sensor development and production

5. Winter FVTX Review November 2008 5 Prototype Assembly Sidet at FNAL has been contracted to do prototype assembly –Provide feedback to develop assembly procedure and assembly fixtures –Build prototype wedge with mockup parts –Mount sample FPHXs to test boards for testing –Assemble prototype HDI + sample of FPHX chips for testing –Build full prototype wedge –Gain knowledge of tolerances and adhesives needed Ultimate goal is estimate of preproduction and production costs and schedule

6. Winter FVTX Review November 2008 6 Prototype Assembly Procedure 1.Bond HDI to backplane 2.Inspect assembly and test HDI 3.Bond FPHX readout chips to HDI 4.Wire bond FPHX output pads to HDI 5.Inspect assembly and test HDI + FPHXs 6.Bond sensor to HDI 7.Wire bond sensor output pads to FPHX input pads 8.Inspect and test assembly 9.Encapsulate wire bonds Additional technical details: –Arclad 8026 adhesive tape for non-conducting bonds –Sensor bonded in two ways: Arclad for baseline bonding Silver epoxy for sensor bias connection –Assembly includes traveler documents for each module Mock FPHXs diced for prototype assembly

7. Dummy Mockup @ Sidet Blank Si sensor, chips 4 mil Kapton tape for mock HDI Winter FVTX Review November 2008 7 Getting a feel for what the wedge will look like

8. Winter FVTX Review November 2008 8 Prototype Assembly Fixtures Prototype fixtures have been designed by HYTEC incorporating feedback from Sidet Order cut to fabricate by shop near HYTEC Two sets costing $9144/total Expecting delivery at beginning of Dec

9. Winter FVTX Review November 2008 9 Assembly fixtures: Backplane and HDI Carbon fiber backplane positioned on fixture HDI positioned on backplane, bonded Dowel-pin placement used

10. Winter FVTX Review November 2008 10 Assembly Fixtures: FPHX chips Chips positioned on positioning fixture, held in place with vacuum Transfer fixture placed over chips –Held with vacuum –Positioning vacuum released –Clear acrylic to enable optical inspection throughout process Transfer fixture placed onto assembly fixture, chips bonded Positioning Transfer Placement

11. Winter FVTX Review November 2008 11 Assembly Fixtures: Sensor Sensor placed on positioning fixture, held in place with vacuum Transfer fixture placed on sensor –Held on with vacuum –Vacuum released from positioning fixture –Clear acrylic to enable optical inspection throughout process Transfer fixture placed onto assembly fixture, bonded Positioning Transfer Placement

12. Winter FVTX Review November 2008 12 Proposed QA and Testing of Wedge Units Procedure includes (but is not limited to): Power up to verify low voltage and bias channels are operational Download of configuration to the FPHX chips Read back of configuration from the FPHX chips Threshold and noise measurements of the FPHX chips Injection of test pulses and test patterns. Readout of strips in response to external source (laser diodes and/or radioactive sources) Record results in database Plan also for testing at various stages of assembly Exact test details will be developed as assembly procedure is understood Final qualification to be perform after assembly completed and before shipping List of tests will evolve as we gain experience with prototype wedges

13. Winter FVTX Review November 2008 13 Proposed Manpower Needs Assembly performed by Sidet senior technicians and technicians –As production proceeds, manhours will shift from senior to junior individuals –Level of expertise chosen (by Sidet) to optimize the tradeoff between successful assembly and cost of manhours FVTX collaborators: –Subsystem managers in charge of assembly and Physicist liaisons –Perform testing (on location) at required times –Graduate students and Postdocs available from several institutions to perform on-site testing –Subsystem manager stationed on-site to oversee production Assembly steps to be identified that can be assigned to FVTX collaborators in order to reduce cost –Most likely steps are the initial lamination (Backplane and HDI)

14. Winter FVTX Review November 2008 14 Facilities Requirements –Clean room/tent at Class 10k level –Room for 2-3 people to work –Storage for components and completed units (dry enclosures/shelving) Identified labs –SIDET –Others Nevis: 300 sq ft of self-contained clean room UNM: Clean room and tent (similar total size) LANL Required equipment –High-precision positioning equipment –Assembly fixtures –Adhesive dispensing system –Testing Dark boxes (i.e.. Enclose units for response tests) Low- and Bias-voltage supplies Mini-DAQ (e.g. turnkey version of FVTX readout) On-project funds are allocated for equipment –Up to $100k budgeted –Wherever possible borrow equipment

15. Summary Wedge assembly comprises WBS items 1.4.1.3.3 –1.4.1.3.8 Production schedule: 6/22/09 to 3/4/11 Prototyping in progress –Fixtures designed and in process of procurement –Sidet developing procedure with mockups Winter FVTX Review November 2008 15

16. Backup slides Winter FVTX Review November 2008 16

17. Silicon Detector Center @ FNAL Primier facility for building and testing vertex detectors for HEP experiments Five large-scale clean rooms for assembly and testing Several wirebonding stations Wide expertise with Silicon and CCD technology –CDF, D0, CMS, SNAP among others Winter FVTX Review November 2008 17

18. Winter FVTX Review November 2008 18 Summary: WBS 1.4.1.3.3/4/5/6 - Cost and Schedule Cost (AY$) 1.4.1.3.3 $ 32k 1.4.1.3.4 $ 32k 1.4.1.3.5 $ 208k 1.4.1.3.6 $ 38k R&D needed Assy fixtures, adhesives, procedures Cost Basis vendor and engineering quotes Cost Contingency 1.4.1.3.322% 1.4.1.3.4 22% 1.4.1.3.5 26% 1.4.1.3.6 22% Schedule Start and Complete 6/22/09 - 3/4/11 Schedule Contingency FPHX, HDI is critical path Risk Low

19. Winter FVTX Review November 2008 19 Summary: WBS 1.4.1.3.3/4/5/6 – Technical Specification Document TDR, Draft Doc Prototype status Draft Number of wedges 110 small, 330 large Spares 8 small, 25 large Manpower(on-project) $100k (FY07$), 1.0 FTE Institutions Involved Columbia, NMSU, UNM, LANL Infrastructure Defined Draft QA procedures in place Done