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Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10.03.2003 The PADOVA.

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Presentation on theme: "Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10.03.2003 The PADOVA."— Presentation transcript:

1 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Study of glues for the assembly of the ALICE Silicon Pixel Detectors Status at 10.03.2003 The PADOVA Gluing Team: Daniela Fabris 2 Marcello Lunardon 1,2 Francesca Soramel 3,4 1 Dept. of Physics of the University of Padova 2 INFN Sezione di Padova 3 Dept. of Physics of the University of Udine 4 INFN Sezione di Trieste-Gruppo collegato di Udine for the ALICE collaboration

2 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003  Assembling the SPD  Test protocol for glue selection  First results  What next INDEX

3 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 The Gluing Tasks for the SPD HALF STAVE CFSS TASK 1: ASSEMBLING THE HALF STAVE ( BARI ) TASK 2: ASSEMBLING THE HALF STAVES ON THE CARBON FIBER SECTOR SUPPORT ( PADOVA )

4 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Assembling the Silicon Pixel Detectors (I) TOP VIEW BOTTOM VIEW GROUNDING FOIL WITH WINDOWED KAPTON LAYER BACK SIDE OF THE CHIP

5 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Assembling the Silicon Pixel Detectors (II) Carbon Fiber Sector Support Cooling Duct

6 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Assembling the Silicon Pixel Detectors (II) THERMAL ADHESIVE PADS

7 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Assembling the Silicon Pixel Detectors (II) Half Stave UV GLUE

8 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Assembling the Silicon Pixel Detectors (II) Carbon Fiber Clips UV GLUE

9 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 Assembling the Silicon Pixel Detectors (III) Main problems to be studied: thermal contact mechanical stability with UV glue The two problems are independent in the new mounting scheme

10 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 TEST PROTOCOL (I) TC.a) preliminary adhesion tests how glues look like TC.b) thermal conductivity measurements measurements for about 0.1 mm adhesive thickness used in working conditions  first reduction of candidates TC.c) glue spreading tests spreading the thermal adhesive on windowed kapton-glass samples fixed above the cooling duct with UV glue and with pressure control  glue spreading procedures TC.d) thermal contact reliability tests w.r.t. thermal cycles test of thermal contact after many thermal cycles (about 5 – 50 °C ) with best candidates and best glue spreading procedures  best candidate(s) selection and definition of the gluing procedure Thermal compound tests

11 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 TEST PROTOCOL (II) UV.a) UV glue basic tests - test the gluing strength with kapton-glass samples to be glued on CFSS - tests of ungluing - tests of clip mounting  UV glue quantity and curing time UV.b) irradiation tests - test the UV glue before and after irradiation Mechanical assembly with UV glue TC.e) test of compatibility with Bari glue (ECCOBOND 45) verify the compatibility between the thermal compound and the adhesive used to glue the grounding foil on the bottom side of the half stave TC.f) irradiation tests with best candidate(s) thermal contact reliability test of best candidate(s) after irradiation  final selection of thermal compound

12 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 GlueVendorTypeThermal cond. [W/m°K] Sample quantity Comments Staystik 541Cookson Electronics Thermoplastic adhesive film 3.0Mhigh temperature for curing Micro Faze KAOSFilm 150 micron1.8Mhigh pressure SE 4486Dow CorningSilicon 1 comp.1.59Mshort workability time CGL7018AI Tech.Epoxy4.1MATLAS study SE 4445Dow CorningSilicon 2 comp.1.26MATLAS study AOS 52032AOSNon sil. Grease0.7Svery soft AOS 52029AOSNon sil. Grease1.68Sless soft AOS 54012AOSSil. Grease2.58SMigration problems? AOS 52022AOSNon sil. Grease0.7Sless soft LIST OF THERMAL COMPOUNDS tested and rejected testing not yet tested

13 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 FIRST TEST RESULTS TC.a) Preliminary adhesion tests test of adhesion for thermoplastic adhesive  easy to handle, but very difficult to get a good contact in working conditions (low pressure, air ). Problems to reach the polymerization temperature  rejected TC.b) Thermal conductivity measurements Measurement of thermal conductivity of a 0.1 mm thick adhesive layer for glues and greases  see next slides UV.a) UV glue basic tests first trial of assebly and unassembly with UV glue  see next slides

14 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 THERMAL CONDUCTIVITY TESTS (I) Let be: DISC 1 at T1 DISC 2 at T2 R dissipating a power W x the thickness of the glue A the area of the glue W = k A (T1 -T2) / x k = x W / (T1 - T2)A T from R(PT100) and tables (0.387  /  K) Corrections for power dispersion and thermal resistance between PT100 sensors applied

15 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 THERMAL CONDUCTIVITY TESTS (II) Glue k nominal [W/°Km] Thickness [micron] k measured [W/°Km]  T/W [°K/W] Comment MICRO FAZE K with 0.1 psi pressure 1.8 150 ± 10 0.29 ± 0.027 need high pressure SE 4486 1.59 95 ± 9 0.59 ± 0.063.4 short work time SE 4445 1.26 36 ± 6 190 ± 10 0.27 ± 0.06 0.56 ± 0.07 3.6 ATLAS meas.: 0.5 CGL 7018 4 60 ± 8 110 ± 11 0.66 ± 0.15 0.74 ± 0.11 3 ATLAS meas.: 0.6 AOS 52032 0.7 125 ± 13 0.68 ± 0.132.9 non sil. AOS 52029 1.68 130 ± 15 175 ± 15 1.28 ± 0.20 1.26 ± 0.20 1.6 non sil. AOS 54012 2.58 130 ± 15 1.44 ± 0.201.4 siliconic expected  T/W for 100 micron thickness assuming a chip with 4 x 12.5 = 50 mm 2 thermal contact window tested and rejected testing

16 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 FIRST UV GLUE TESTS (I) The tooling for UV gluing tests in Padova is almost ready...

17 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 FIRST UV GLUE TESTS (II)... meanwhile, some hand-made trial:

18 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 TC.b) thermal conductivity measurements: completed TC.c) glue spreading tests: mechanics for tests just completed; starting soon UV.a) UV glue tests: first assembly and unassembly trials with clips done; mechanics for tests just completed; starting soon more quantitative tests TC.d) thermal contact reliability tests w.r.t. thermal cycle: mechanical setup and heaters defined, to be realized TC.e) test of compatibility with Bari glue: setup to be defined TC.f/UV.b) irradiation tests with best candidate(s): setup for both thermal adhesive and UV glue: to be defined WHAT NEXT

19 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 THE END

20 Marcello Lunardon - ALICE Gluing Meeting 010/03/2003 INVENTARIO More electronics and mechanics for tests Glue dispenserI&J Fisnar mod. DD305arrived and tested UV glue and UV source Norland Prod. Inc. mod. Opticure 3 arrived and tested CF clipsINFN PDfirst version ready Heaters INFN PD – simple circuit with thin FR4 substrate design finalized, to be realized CFSS raw support INFN PDready XY automated movement for glue dispenser INFN PD ready, computer control ready soon Arm for dispenser INFN PDready Vacuum support for blades INFN PDalmost ready

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