1. From Nanoscience to Nanomanufacturing STM manipulation of atoms 1989 AFM 1986 AFM manipulation of a SWNT 1999 Source: IBM Molecular logic gate 2002 Manipulation of few atoms and SWNTs Past and present: 2004 200 6 200 7 Informed public and workforce Environmentally benign processes STM 1981 Templates Reliability and Accelerated Test Manipulation of billions of atoms and SWNTs Future: Biosensor Memory device High rate High volume

2. Reliability, Accelerated Test, Properties Monitor reliability of materials, interfaces, and systems to ensure manufacturing readiness. –Changes in material or contact properties with environmental exposure, stress, temperature … Accelerated testing for reduced manufacturing risk. –Rapid mechanical, electrical, and thermal cycling with measurement capability. –Example: MEMS devices to rapidly cycle strain or temperature while measuring resistance and imaging in SEM or STM. UHV compatible. Nanoscale material and interface property monitoring. –Example: Measure adherance force and friction between functionalized nanoelements and functionalized substrates. –Example: Measure Young’s modulus and yield strength of nanoelements. MEMS Device for Accelerated Test Interaction of AFM Cantilever with Suspended Nanotube

3. MEMS Testbed for Accelerated Test and Properties Measurement Innovative MEMS devices characterize nanowires (also nanotubes, nanorods and nanofibers) and conduct accelerated lifetime testing allowing rapid mechanical, electrical, and thermal cycling during AFM/SEM/UHV SPM observation.

4. MEMS Nanoscale Accelerated Testing, Hot Plate with Nanowire Au, Ru, and RuO 2 nanowires tested.

5. MEMS Nanoscale Accelerated Testing, Hot Plate with Nanowire Ru, before testing. Ru, after testing. RuOx, after testing. Ru lasts longer in N 2. RuO x fails more quickly than Ru. RuO x shows more pronounced surface diffusion.

6. MEMS Nanoscale Material Properties Measurements, Nanoscale Pull Test

7. Process Test Mask for Characterization of Reliability and Interface Properties Purpose: Monitoring of nanoelement assembly processes.

8. Type II CHN Nanotube Switch for Non-Volatile Memory Schematic of state I and II. Type II Switch has two symmetric non-volatile states. Simple process. CNTs assembled directly on chip using dielectrophoresis or using template transfer. Measurements in progress. CNT/Surface interaction critical, measurements in progress.

9. Directed Assembly of a Single SWCNT by Dielectrophoresis

10. AFM Measurement of CNT-Surface Interaction RMS and A-B Data Plotted for a 100 nm Z-Piezo Displacement Below the Substrate F/d On Suspended CNT F/d On neighboring Substrate What: Development of technique for measurement of interactions between functionalized nanotubes and functionalized surfaces. Purpose: Process control for single nanotube switch process.

11. Goal and Desired Outcome Develop Generally Applicable Tools and Testbeds for: 1.Accelerated test of Nanoelements, Interfaces, and Systems. 2.Measurements of Reliability of Nanoelements, Interfaces, and Systems. 3.Measurements of properties of nanoscale elements. These tools will help to ensure manufacturing readiness and will help to reduce the time for technology transition to manufacturing.