1. Sugon I840-G25 Server Post-sale training v1.0 Product Center 2014.10 Computing creates future

2. 2 Contents 1 Introduction of product specifications 2 Introduction of product technology architecture 3 Introduction of product external interface 4 Fault information capture judgment

3. Introduction of product specifications Processor Intel E7-4800V2/8800V2 Series of processor Number of processor2 or 4 ChipsetIntel C602J Buffer memory controller Intel Jordan Creek C104 Memory 8 memory boards, supporting 96 memories(max) Maximum 6TB DDR3-1600/1333/1066 RDIMM/LRDIMM Network controllerIntegrated 2 10-Gigabit Ethernet interfaces RJ-45 (Intel X540) PCI I/O expansion slot Maximum supporting 11 PCI-E slots 4 PCI-E3.0 x16 slots 7 PCI-E3.0 x8 slots When configuring 4 CPUs and installing 1 to 4 memory boards, it can support 11 PCI-E devices(max). When configuring 4 CPUs and installing 8 memory boards, it can support 8 PCI-E devices(max). When configuring 2 CPUs, it can support 5 PCI-E devices(max). For more detailed configuration, please refer to appendix A. Storage Support at most 24 2.5’’ hot-plug SATA/SAS/SSD disks Backboard SAS 12G backboards, supporting 2G/6Gprotocol Other ports 1 x VGA interface (ASPEED 2400) 2 x USB2.0 interface (rear) + 1 x USB2.0 interface (inside) 2 x 10-Gigabit interface RJ-45 1 x COM port (rear) 1 x SFP IPMI Management interface

4. Continued the table above GPU computer card Maximum supporting 4 full-high double wide GPU card (Only the GPU with power can be open in the back.) (NVidia Tesla/ Intel Phi) Note ： When configuring GPU, additional cooling fan will be used. For the detailed configuration condition, please refer to appendix A. VGA TV coder Supporting 1 VGA TV coder (Only the GPU with power can be open in the back.) RAID supporting RAID 0/1/5/6/10/50/60 ( supporting configuration super capacitor) CD-ROM device No supporting embedded CD-ROM device and configuring USB drive can be used. Power Supply Maximum supporting 4 power modules with 1620W/920W Supporting N + N or N + 1 redundancy according to diverse load. Platinum level power supply, 94% conversion efficiency. Note ： The current module can only support AC input. BMC management Supporting iKVM /IPMI protocol Supporting SNMP V2/SMTP Supporting critical parts such as Processor/Memory/Fan/Mainboard/Power Supply etc. Supporting chassis intrusion alarm. Supporting upgrading BIOS through BMC. For the monitoring contents, please refer to appendix B. HDD Expender nonsupport Monitoring screen nonsupport Others Support TPM Introduction of product specifications Continued table L,W & H 795mm x 437mm x 178 mm Net weight 68kg Operating temperature 10°C to 35°C Non-operating environment temperature -40°C to 70°C

5. 5 Contents 1 Introduction of product specifications 2 Introduction of product technology architecture 3 Introduction of product external interface 4 Fault information capture judgment

6. Introduction of product technology framework ---Main Board architecture Bus nameParameters QPIUp to 8.0 GT/s SMI2Up to 2.66GT/s PCIE Gen38.0 GT/s USB 2.0480Mbps

7. Introduction of product technology architecture-- Processor number and interconnection Each CPU has 3 QPIs with CPUs connected with each other. The fastest connection speed for each QPI is 8.0 GT/s. Each CPU has 4 SMI2 for connecting Jordan Creek. The fastest transmission speed for each SMI2 is 2.66 GT/s. Processor Number E7-4890V2E7-4880V2E7-4870V2E7-4860V2E7-4850V2E7-4830V2E7-4820V2E7-4809V2 # of Cores15 12 1086 Clock Speed2.8 GHz2.5 GHz2.3 GHz2.6 GHz2.3 GHz2.2 GHz2 GHz1.9 GHz Cache37.5 MB 30 MB 24 MB20 MB16 MB12 MB System Bus8 GT/s7.2 GT/s6.4 GT/s Memory TypesDDR3-1066/1333/1600 DDR3- 1066/1333

8. Introduction of product technology architecture —memory control unit Each CPU supports 8 DDR3 channels Each CPU maximum supports 24 DDR3 LR-DIMMs. Intel SMI Gen2 maximum broadband 2.66 GT/s Memory controller supports two modes ： Performance Mode (High I/O, B/W) Lockstep Mode (Highest DDR3 Speed)

9. Introduction of product technology architecture ---- memory configuration and working frequency Terms explanation ： SR ： Single Rank DR ： Dual Rank QR ： Quad Rank SG ： Stretch Goals DDR3 RDIMM Support on Ivy Bridge-EX/Jordan Creek - 3SPC (Performance Mode) Slot0Slot1Slot2Frequency @1.5V drams (MT/s)Frequency @1.35V drams (MT/s) SRempty 1333 DRempty 1333 QRempty 1066 SR empty13331066 DR empty13331066 SR 1066 DR 1066 DDR3 RDIMM Support on Ivy Bridge-EX/Jordan Creek - 3SPC (Lockstep Mode) Slot0Slot1Slot2Frequency @1.5V drams (MT/s)Frequency @1.35V drams (MT/s) SRempty 1333 DRempty 1333 QRempty 1066 SR empty13331066 DR empty13331066 SR 1066 DR 1066 The actual memory working frequency is related with parameters below. Memory Rank quantity Memory working voltage Memory location on the memory board Note ： The memory working voltage of current mainstream is 1.35 V.

10. Introduction of product technology architecture --- The installation of the memory board and memory. The system can maximum support 8 memory boards and 96 DDR3 DIMMs. Memory board specifications ： Including 2 Jordan Creek C104 chips Maximum supporting 12 DIMMs 4 memory channels Memory installation order ： Blue slot is priority (DIMMA1  DIMMB1  DI MMC1  DIMMD1)

11. Introduction of product technology architecture --- The corresponding relation of memory and CPU CPU#Corresponding DIMM Modules No. of card(s) for Each CPU One(1) Memory Card for each CPU Installed on the baseboard Two(2) Memory Cards for each CPU Installed on the baseboard CPU1SMI Slot P1M2SMI Slot P1M1 + SMI Slot P1M2 CPU2SMI Slot P2M1SMI Slot P2M1 + SMI Slot P2M2 CPU3SMI Slot P3M2SMI Slot P3M1 + SMI Slot P3M2 CPU4SMI Slot P4M1SMI Slot P4M1 + SMI Slot P4M2 When configuring 4 CPUs and 4 memory boards ， recommend using P1M2/P2M1/P3M2/P4M1 (Maximum IO utilization) (supporting 11 PCIe Slots) Each CPU supports 2 memory boards ， 4 Jordan Creek, 8 Channel and 24 DDR3 DIMMs.

12. Introduction of product technology architecture - -- The corresponding relation of PCIE Slot and CPU PCI-E Expansion Slots CPU1 supports Slot1 PCI-E 3.0x8, and Slot2 PCI-E 3.0x16 CPU2 supports Slot3 PCI-E 3.0 x8, Slot4 PCI-E 3.0 x16, and Slot5 PCI-E 3.0 x8 CPU3 supports Slot6 PCI-E 3.0 x8, Slot7 PCI-E 3.0 x8, and Slot9 PCI-E 3.0 x16 CPU4 supports Slot8 PCI-E 3.0 x8, Slot10 PCI-E 3.0 x8, and Slot11 PCI-E 3.0 x16 Note ： Please pay special attention to SLot5, Slot6 and Slot7. Because the three slots have relations with the memory board quantity. For the detailed configuration, please refer to appendix A.

13. Introduction of product technology architecture - IO module backplane specifications LocationConnectorDescription AJVGA1VGA Port1 BJLAN2LAN Port2 CJLAN1LAN Port1 DJLAN3(BMC) IPMI_LAN ESW1UID Switch FJVGA2VGA Port2 GJCOM1Debug

14. 14 Contents 1 Introduction of product specifications 2 Introduction of product technology architecture 3 Introduction of product external interface 4 Fault information capture judgment

15. Introduction of product external interface----- Front panel functions 24 x 2.5” SAS/SATA HDDs Front panel Front panel iconsIntroductions Power button Reset button Power LED Onboard HDDs Activity LED LAN1 status LED LAN2 status LED Power/Fan/tempe rature Fault LED HDD Stents icons Introductions HDD Fault LED Location/Activity LED

16. Introduction of product external interface----Back panel functions 4 PSU modules,available 920W/1620Wp ower supply, supporting 2+2 redundancy 2 x USB Port + 1 x COM port 1 x VGA+ 2 x 10G RJ-45 NIC Port + 1 x IPMI LAN + 1 x UID Installation position of GPU cooling fan. When configuring GPU, it can make additional cooling fans. 11 x PCI-E Slot, 3 external fan modules can be removed.

17. The internal structure of the chassis CPU and Heatsink Front Panel HDDs System Fans Primary Air Shroud Memory Board

18. Connection UIO slots: IO board is used to connect devices (VGA * 1 / 10Gb LAN * 2 / IPMI LAN * 1) Onboard SATA connector: SATA0 ~ 5

19. Connection 1.Motherboard power connector ： JPW1/JPW2/JPW3/ JPW4/JPW5/JPW6/JPW7

20. I840-G25 structure declaration – Removing Chassis cover 1.Depress the two release buttons on both sides of the cover. 2.Slide the cover toward the rear of the chassis. 3.Lift the cover off the chassis.

21. I840-G25 structure declaration—Removing the Air Shroud Removing Primary Air Shroud 1 Removing the Secondary Air Shroud 2

22. I840-G25 structure declaration—Replace the system fan As shown in the picture, lift the fan housing up and out of the chassis and gently push the fan upwards from underneath the fan housing to remove it.

23. I840-G25 structure declaration—Replace the rear system fan As shown on the right picture, press the rear fan at the upper end of the buckle and remove the fan.

24. I840-G25 structure declaration—Replace system power supply module As shown on the right, push and hold the release tab on the back of the power supply, grasp the handle and pull the power supply out of its bay. Handle Release Tab

25. I840-G25 structure declaration—Memory Board installation 1.As shown on the right, install the memory board into guide groove. 2.And then locking the memory board on the Main Board. Fixed lock

26. 26 Contents 1 Introduction of product specifications 2 Introduction of product technology architecture 3 Introduction of product external interface 4 Fault information capture judgment

27. Fault information retrieve ----BMC Event Log Event log order Log record time Alarm device name Alarm equipment category Log detailed information description BMC Event Log Information format decomposition

28. Component monitoring status information ----BMC Sensor Reading Health status for devices Devices name Monitoring equipment failure description monitored equipment operation data Intrusion alarm reset button BMC Sensor Reading Information format decomposition

29. Monitoring of power source status ----BMC Power Consumption Power consumption monitoring ， collecting power consumption status under three conditions. last hour Last week Last day

30. Monitoring of power source status ----BMC Power Supplies Monitoring parameters of power supplies parameter name of power supply status Power Supply working status overview AC input voltage/current DC output voltage/current Power Supply module temperature monitoring Power Supply fan speed DC output power consumption AC output power consumption Power supply SN No. data of power supply status

31. ADDRESS ： Sugon Building, No. 36 Zhongguancun Software Park, No.8 Dongbeiwang West Road Haidian District, 100094, Beijing, P.R.China TELEPHONE ： 86-10-56308000 Weibo ： http://weibo.com/zksugon WWW ： http://www.sugon.com

32. 谢谢！ Appendix A: Memory board/maximum memory number GPU NumberSurplus available PCIe Slot specification (2 CPUs) Surplus available PCIe Slot specification (4 CPUs) 1/1202 PCIe x16 + 3 PCIe x84 PCIe x16 + 7 PCIe x8 11 PCIe x16 + 2 PCIe x83 PCIe x16 + 6 PCIe x8 20 PCIe x16 + 1 PCIe x82 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 3 PCIe x8 2/2402 PCIe x16 + 3 PCIe x84 PCIe x16 + 7 PCIe x8 11 PCIe x16 + 2 PCIe x83 PCIe x16 + 6 PCIe x8 20 PCIe x16 + 1 PCIe x82 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 3 PCIe x8 3/3602 PCIe x16 + 3 PCIe x84 PCIe x16 + 7 PCIe x8 11 PCIe x16 + 2 PCIe x83 PCIe x16 + 6 PCIe x8 2NA(no supporting 2 GPU configuration ) 2 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 3 PCIe x8

33. 谢谢！ Continued table: Memory board/maximum memory number GPU NumberSurplus available PCIe Slot specification (2 CPUs) Surplus available PCIe Slot specification (4 CPUs) 4/4802 PCIe x16 + 3 PCIe x84 PCIe x16 + 7 PCIe x8 1NA(no supporting 1 GPU configuration ) 3 PCIe x16 + 6 PCIe x8 2NA(no supporting 2 GPU configuration ) 2 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 3 PCIe x8 5/600NA4 PCIe x16 + 7 PCIe x8 1NA3 PCIe x16 + 6 PCIe x8 2NA2 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 2 PCIe x8 6/720NA4 PCIe x16 + 7 PCIe x8 1NA3 PCIe x16 + 6 PCIe x8 2NA2 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 3 PCIe x8 4NA0 PCIe x16 + 0 PCIe x8

34. 谢谢！ Continued table: Memory board/maximum memory number GPU NumberSurplus available PCIe Slot specification (2 CPUs) Surplus available PCIe Slot specification (4 CPUs) 7/840NA4 PCIe x16 + 6 PCIe x8 1NA3 PCIe x16 + 5 PCIe x8 2NA2 PCIe x16 + 4 PCIe x8 3NA1 PCIe x16 + 1 PCIe x8 4NANA(no supporting 4GPU configuration ) 8/960NA4 PCIe x16 + 4 PCIe x8 1NA3 PCIe x16 + 3 PCIe x8 2NA2 PCIe x16 + 2 PCIe x8 3NANA(no supporting 3GPU configuration ) 4NANA(no supporting 4 GPU configuration )

35. Appendix B Memory Installed ① The main board has 8 memory board. ② Each memory board supports 12 DIMMs. ③ DIMM specific installation following the right table LED light

36. Memory work frequency corresponding table 1

37. Memory work frequency corresponding table 2

38. I840-G25 Analysis of FAQ 1.The following information is required when the Front Panel alarm LED is on: a) Login BMC, view Sensor Event log and Sensor Reading Interface to view current alarm log and Sensor status, whether there are abnormal contents, view alarm information corresponding module LED status. b) Use ipmitool capture detailed alarm information, using command “ipmitool sel elist” to save the logs, and check the sensor value for the alarm. c) Check user manual for the recording of the front panel LEDs. d) Collecting the system logs: /var/log/messages; /var/log/McElog; dmesg 2.System crash on the POST: a) Capture the snapshot of the screen and record the information if have. b) When there is no VGA output, you need to see 80 code LEDs on the motherboard. And record the value. c) Check the failure information with the user manual, you can try to find out the root cause. 3.BIOS Recover Operation : a) Download the latest FW BIOS, rename it to "Super.ROM", copy it to the USB Key. b) Insert USB Key and power on the system, when the system boot up, press Ctrl+Home until you hear two short beeps c) Follow the screen prompts to finish the Recover BIOS process d) After the completion of upgrading, power off the system and remove the power cord. e) Then insert the power cord and power on, press Del key to enter the BIOS, load default settings via pressing F3 key, and finally press F4 to save settings and exit. 4. BMC FW upgrading (if can not upgrading the FW via web, you need upgrade the FW via DOS): a) Download the latest BMC FW, and extract the files to the bootable USB key. b) Insert the USB Key, power on the system and enter the DOS, run the Flashbmc.bat to upgrading the FW. c) After the completion of upgrading, waiting 3 minutes, and then power off the system (remove the power cord) d) Waiting 2 minutes, and then insert the power cord and power on the system.