1. D3 Engineering define ● design ● develop Ruggedized Camera Module P13571 Project Review May 10, 2013

2. D3 Engineering define ● design ● develop Project Description Design and develop a camera system that can capture, package, and transmit image data in a small form factor which may be subjected to adverse conditions. MechanicalsElectricalComputer Jose PortugalStephen BrownStephen Goss Cameron StaunchAndy AnthonyPeter Hood

3. D3 Engineering define ● design ● develop Customer Needs

4. D3 Engineering define ● design ● develop Engineering Specifications

5. D3 Engineering define ● design ● develop Concept Summary Heat Dissipation IP64 weatherproofing Ruggedized Mechanical Engineers High-Speed Printed Circuit Board Design System Integration Physical Layer Implementation Electrical Engineers FPGA Programming Frame Grabber CoaXPress Implementation Computer Engineers

6. D3 Engineering define ● design ● develop Electrical System Architecture Image Sensor Image Data Capture Image Sensor Image Data Capture FPGA Transceiver Architecture FPGA Transceiver Architecture Power Power Management Power Power Management Coax Data Transmitter Coax Data Transmitter

7. D3 Engineering define ● design ● develop Mechanical System Architecture Heat Dissipation Cold Finger Fins Aluminum Body Heat Dissipation Cold Finger Fins Aluminum Body Water Tight Seal O-ring Seals Flat Gasket Water Tight Seal O-ring Seals Flat Gasket Ruggedized Anodized Gorilla® Glass Ruggedized Anodized Gorilla® Glass

8. D3 Engineering define ● design ● develop Software Architecture

9. D3 Engineering define ● design ● develop Pixel Capture Synthetic Data Working

10. D3 Engineering define ● design ● develop Transmitter Working

11. D3 Engineering define ● design ● develop Future Stage 1 Implementation

12. D3 Engineering define ● design ● develop Electrical Design Summary System Testing Results Voltage and Short Checks Short on FPGA-to-Power Board connector Power over CoaXPress JTAG functionality Flash programmable I2C communication with sensor I2C clock on input pin Transceiver signal integrity

13. D3 Engineering define ● design ● develop Mechanical Design Summary Testing Results Assembly - Material Selection for high temperatures/oil temp. -PCBs and Hardware assemble together without interference. -Thermal pads compress effectively reducing contact resistance. -Tolerance Analysis provided an effective connector engagement. Thermal - Experimental Data was 20% lower than Simulated - Factor of safety of 1.0 - Connecting to a stand of any type allows conduction and only increases F.S. Sealing - Distributor provided CAD was not exact, o-rings under compressed (Lens Holder) - O-rings designed to 20 - 40% compression, difficult to assembly - Updated CAD provides up to 15% compression and used measured dimensions from Lens Holder

14. D3 Engineering define ● design ● develop Software Design Summary

15. D3 Engineering define ● design ● develop Objective Project Evaluation Successes  Assembly fits together with no interference  Properly sinks heat  Imager works  Programmed FPGA  Transceiver works Remaining  Image display  Frame grabber implementation  Verification of transceiver signal integrity

16. D3 Engineering define ● design ● develop Opportunities / Suggestions For Future Work Finish CoaXPress protocol Design frame grabber system Upgrade FPGA to Cyclone V GX Auto-focus capability using M3F Focus Module CNC current release of CAD with tighter tolerance and modified O-ring grooves Different housing designs (UAV application) Incorporate video analytics Include image processing filter on FPGA

17. D3 Engineering define ● design ● develop Acknowledgments  D3 Engineering (sponsor) Scott Reardon Jason Enslin Jim McGarvey Alex Sojda Ben McGee David Collins  Lightforce Technology Peter Hammond  Dr. Antonio Mondragon  Altera Corporation Bill Jenkins Bob Spurr  Arrow Electronics, Inc. Gary Fredericks  RIT Machine Shop Personnel