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Wafer Edge Exclusion Kevin Fisher
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Outline What is Edge Exclusion? Motivation for reducing edge exclusion
ITRS Roadmap Problems on the Edge Example: Copper Deposition
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What is Edge Exclusion? Edge of wafer considered unusable for a variety of reasons Chips entirely on wafer but too close to edge are still invalidated
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Yield Loss on the Edge Current edge exclusion is 3mm
Reduces usable area of wafer by 2% 300mm wafer: mm2 total area 297mm usable area: mm2 Area loss: 1406 mm2 Athlon 64 die size: 144 mm2
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Increasing Yield 300mm Pentium 4 Processor wafer (130nm)
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ITRS on Edge Exclusion Two references in 2003 Yield Enhancement report
Wafer Type 2003 2004 Patterned 2mm 1mm Unpatterned 3mm
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Problems on the Edge Chips, cracks, identification notches
Slurry/photoresist residue Cleaning contaminants Peeling films
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Copper Interconnects Two problems affect edges of wafers with copper metal layers Barrier, seed layer residue Copper islands
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Barrier/Seed Residue
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Copper Islands
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One Solution: Wet Processing Chambers
Apply film in liquid-filled chamber Chemical breaks film’s surface tension
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