1. GBT Project Status Paulo Moreira Mini Workshop of the Joint ATLAS CMS Opto Working Group 4 th – 5 th March 2010, CERN http://cern.ch/proj-gbt

2. GBT – People Luiz Amaral – CERN, Switzerland Sophie Baron – CERN, Switzerland Sandro Bonacini – CERN, Switzerland Jean-Pierre Cachemiche – CPPM, France Bruno Checcucci – INFN, Italy Jorgen Christiansen – CERN, Switzerland Ozgur Cobanoglu – CERN, Switzerland Federico Faccio – CERN, Switzerland Philippe Farthouat – CERN, Switzerland Tim Fedorov – SMU, USA Rui Francisco – CERN, Switzerland Alessandro Gabrielli – INFN, Italy Tullio Grassi – University of Maryland Ping Gui – SMU, USA Paul Hartin – SMU, USA Kostas Kloukinas – CERN, Switzerland Gianni Mazza – INFN, Italy Mohsine Menouni – CPPM, France Alessandro Marchioro – CERN, Switzerland Frederic Marin – CPPM, France Stefano Meroli – INFN, Italy Paulo Moreira – CERN, Switzerland Christian Paillard – CERN, Switzerland Nataly Pico – SMU, USA Antonio Ranieri – INFN, Italy Giuseppe De Robertis – INFN, Italy Angelo Rivetti – INFN, Italy Sergio Silva – CERN, Switzerland Csaba Soos – CERN, Switzerland Filipe Sousa – CERN, Switzerland Jan Troska – CERN, Switzerland Francois Vasey – CERN, Switzerland Ken Wyllie – CERN, Switzerland Bryan Yu – SMU, USA http://cern.ch/proj-gbtPaulo.Moreira@cern.ch2

3. Outline  Radiation Hard Optical Link Architecture GBTX-TO-FRONTEND: GBT Link Bandwidth Parallel Modes E-Link Modes  The GBT Chipset: Gigabit Laser Driver (GBLD) Gigabit Trans-Impedance Amplifier (GBTIA) Gigabit – Serializer/De-serializer (GBT-SERDES)  E-Links E-Port SLVS Transceiver Macrocell Scalable Low-Voltage Signalling (SLVS)  GBT on FPGAs  GBT Specifications  GBT project schedule http://cern.ch/proj-gbtPaulo.Moreira@cern.ch3

4. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch4 Radiation Hard Optical Link Architecture Defined in the “DG White Paper”  “Work Package 3-1” Objective: Development of an high speed bidirectional radiation hard optical link Deliverable: Tested and qualified radiation hard optical link Duration: 4 years (2008 – 2011) Radiation Hard Optical Link:  Versatile link project: Opto-electronics Radiation hardness Functionality testing Packaging  GBT project: ASIC design Verification Functionality testing Packaging On-Detector Custom Electronics & Packaging Radiation Hard Off-Detector Commercial Off-The-Shelf (COTS) Custom Protocol

5. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch5 GBT Link Bandwidth  Bandwidth: User: 3.36 Gb/s Line: 4.8 Gb/s  Dedicated channels: Link control: 80 Mb/s Data/Slow control channel: 80 Mb/s  DC balance: Scrambler No bandwidth penalty  Forward Error Correction and Frame Synchronization Efficiency: 73% To be compared with 8B/10B: 80% no error correction capability  Link is bidirectional  Link is symmetrical:  Down-link highly flexible: Can convey unique data to each frontend device that it is serving “Soft” architecture managed at the control room level Other schemes would require dedicated topologies that will be difficult to accommodate on a generic ASIC like the GBTX  Line code and frame structure compatible with modern FPGAs

6. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch6 GBTX-TO-FRONTEND: Parallel Modes  P-Bus Mode: Simple parallel interface 40-bit wide bus Bidirectional Double Data Rate (DDR)  B-Bus Mode: A byte-bus mode is also available Up to five independent buses can be used simultaneously  Electrical levels: SLVS electrical level: 100  termination 400 mV differential 200 mV common mode I LOAD = ± 2 mA JEDEC standard, JESD8-13 Scalable Low-Voltage Signalling for 400 mV (SLVS-400) http://www.jedec.org/download/search/JESD8-13.pdf JEDEC standard, JESD8-13 Scalable Low-Voltage Signalling for 400 mV (SLVS-400) http://www.jedec.org/download/search/JESD8-13.pdf

7. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch7 GBTX-TO-FRONTEND: E-Link Modes SEU tolerant  GBT/Frontend interface: Electrical links (e-link) Serial Bidirectional Up to 40 links  Programmable data rate: Independently in five groups Independently for up/down links 80 Mb/s, 160 Mb/s and 320 Mb/s  Lanes: To achieve > 320 Mb/s Two or more e-links can be grouped forming a “lane”  Slow control channel: 80 Mb/s  E-Link: Three pairs: D OUT /D IN /CLK SLVS  E-Links will be handled by E-ports: Electrically “Protocol”  Package (preliminary): BGA: 361 – PINS 16 mm x 16 mm, 0.8 mm pitch

8. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch8 The GBT Chipset  Radiation tolerant chipset: GBTIA: Transimpedance optical receiver GBLD: Laser driver GBTX: Data and Timing Transceiver GBT-SCA: Slow control ASIC  Supports: Bidirectional data transmission Bandwidth: Line rate: 4.8 Gb/s Effective: 3.36 Gb/s  The target applications are: Data readout TTC Slow control and monitoring links.  Radiation tolerance: Total dose Single Event Upsets GBTIA GBLD GBTX GBT-SCA Frontend Electronics Data Clock Control

9. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch9 GBLD Main specs: Bit rate 5 Gb/s (min) Modulation: current sink Single-ended/differential Laser modulation current: 2 to 12 mA Laser bias: 2 to 43 mA “Equalization” Pre-emphasis/de-emphasis Independently programmable for rising/falling edges Supply voltage: 2.5 V Die size: 2 mm × 2 mm I2C programming interface  Packaging: Part of the versatile link project Engineers : Gianni Mazza – INFN, Italy Ping Gui – SMU, USA Angelo Rivetti – INFN, Italy Ken Wyllie – CERN, Switzerland Status: Chip fabricated and tested A re-spin was necessary: Chip submitted for fabrication: 16-Feb-2010

10. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch10 GBLD – Test Results  GBL tests: Chip is “functional” however the bandwidth falls short of specifications! Fortunately the pre-emphasis circuit is working fine, allowing to partially recover the bandwidth!  The problem was identified: Parasitic capacitance evaluation Layout symmetry  New version: Submitted for fabrication: 16-Feb-2010 Pre-driver load resistance halved Cascode transistors bulks connected to a reference voltage Metal stack : LM → DM Single layer aluminum inductors (higher series resistance but lower parasitic capacitance) Voltage regulator: Single supply voltage PW modulation circuit removed Pre-emphasis added on both outputs Full symmetry I2C controller: ARM std cells → IBM std cells Package: QFN 24-pin 4 mm x 4 mm Design database : CDB → OA 2.5 Gb/s 5 Gb/s

11. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch11 GBTIA Main specs: Bit rate 5 Gb/s (min) Sensitivity: 20 μA P-P (10 -12 BER) Total jitter: < 40 ps P-P Input overload: 1.6 mA (max) Dark current: 0 to 1 mA Supply voltage: 2.5 V Power consumption: 250 mW Die size: 0.75 mm × 1.25 mm Packaging: Part of the versatile link project Engineers : Ping Gui – SMU, USA Mohsine Menouni – CPPM, France Status: Chip fabricated and tested Chip fully meets specifications! Radiation tolerance proven! Work has started to encapsulate the GBTIA + PIN-diode in a TO Package (Versatile link project)

12. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch12 GBTIA – Test Results -18 dBm (specs: -17 dBm) -6 dBm

13. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch13 GBT-SERDES Engineers: Ozgur Cobanoglu - CERN, Switzerland Federico Faccio - CERN, Switzerland Rui Francisco – CERN, Switzerland Ping Gui – SMU, USA Alessandro Marchioro - CERN, Switzerland Paulo Moreira - CERN, Switzerland Christian Paillard - CERN, Switzerland Ken Wyllie - CERN, Switzerland  Submitted for fabrication: 26-Nov-2009  Currently being packaged.

14. GBT-SERDES

15. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch15 Slow Control & Monitoring ASIC: GBT - SCA GBT-SCA Main specs: Dedicated to slow control functions Interfaces with the GBTX using a dedicated E-link port Communicates with the control room using a protocol carried (transparently) by the GBT Implements multiple protocol busses and functions: I2C, JTAG, Single-wire, parallel-port, etc… Implements environment monitoring functions: Temperature sensing Multi-channel ADC Engineers: Alessandro Gabrielli – INFN, Italy Kostas Kloukinas – CERN, Switzerland Alessandro Marchioro – CERN, Switzerland Antonio Ranieri – INFN, Italy Giuseppe De Robertis – INFN, Italy Filipe Sousa – CERN, Switzerland Status Specification work undergoing: 1 st Draft already available RTL design undergoing Tape-out: 2010

16. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch16 E-Links: e-port No protocol added on data stream No overhead No frame/word alignment Fixed latency Two protocols are available as possible additional MAC wrappers:  7B/8B Balanced, fixed latency, suitable for trigger commands links RTL code under development  High-Level Data Link Control (HDLC) Packet oriented data, high bandwidth efficiency (~96%) Non-fixed latency, suitable for slow control and data links RTL code ready To be specified Lanes support The FE interfaces with the GBTX through an e-port The e-port handles: The physical interface; The multiple data rates; The lanes (for bandwidth > 320 Mb/s) Line coding: Clock recovery (if required) AC coupling (if required) The user application does not have to care about the frame formats in full detail: It s done through a well defined interface! An E-Link Port Adaptor (EPA) “macro” will be available for integration in the front-end ASICs Engineers: Sandro Bonacini – CERN, Switzerland Kostas Kloukinas – CERN, Switzerland

17. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch17 SLVS Transceiver  Receiver Power Supply: 1.2V to 1.5V Power Dissipation: 150uW @ 320Mbs, 1.2V supply <1uW @ power down  Transmitter Power Supply: 1.2V to 1.5 V Power Dissipation: 3.1mW @ 320Mbs, 1.2 V supply <10uW @ power down  Engineer Sandro Bonacini – CERN, Switzerland Status: Chip currently under testing Electrical Specifications Programmable Output Current

18. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch18 SLVS Tests  Tests on SLVS-RT chip 1 driver 1 receiver  Various types of transmission media tested: Kapton PCB Ethernet cable  Test equipment Bidirectional link FPGAs perform pseudo-random data generation and checking  SLVS (Scalable Low Voltage Standard)  JEDEC standard: JESD8-13  Main features:  2 mA Differential max  Line impedance: 100 Ohm  Signal: +- 200 mV  Common mode ref voltage: 0.2V (*) PRELIMINARY

19. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch19 GBT on FPGAs  GBT-SERDES successfully implemented in FPGAs: Scrambler/ Descrambler + Encoder/ Decoder + Serializer/CDR  FPGA Tested: XILINX Virtex-4FX ALTERA StratixII GX  Ongoing work: Optimization of use of resources Detailed implementation is device dependent Fixed and “deterministic” latency  Firmware: “Starter Kit” is now available for download. Available for: StratixIIGx and Virtex5FXT Available soon for: StratixIVGx  Engineers: Sophie Baron – CERN, Switzerland Jean-Pierre Cachemiche – CPPM, France Frederic Marin– CPPM, France Csaba Soos – CERN, Switzerland Altera + opto TRx - 4.8 Gb/s Xilinx - 4.8 Gb/s

20. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch20 GBT Specifications Link specification group:  Formed in 2008  Members: Electronics coordinators of: ALICE, ATLAS, CMS and LHCb Five members of the Radiation Hard Optical Link (RHOL) project  “Mandate”: Identify the “GBT” needs of each experiment for the SLHC upgrade Discuss the specification documents (before they are distributed within the collaborations).  Meetings: 1 st meeting (CERN – 2008/04/17) ALICE, ATLAS, CMS and LHCb electronics coordinators presented outlooks of their requirements for SLHC. 2 nd meeting (CERN – 2008/11/14) GBT system proposal was presented to the electronics coordinators. 3 rd meeting (CERN – 2009/05/05) Link specification feedback Documents:  Share point web site created (2008): http://cern.ch/proj-gbt  Specification documents: GBTX specifications (V1.0, January 2009) GBTIA specifications (V1.7, May 2008) GBLD specifications (V2.0, July 2008) GBT-SCA specifications (V1.5, June 2008) E-Port IP 7B8B specifications (V0.1, December 2008) E-Port IP Core specifications (V0.2, January 2009) E-Port IP HDLC specs (V0.2, January 2009)

21. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch21 Project Schedule  2008 Design and prototyping of performance critical building blocks: GBTIA, GBLD, Serializer, De-Serializer, Phase Shifter First tests of optoelectronics components SEU tests on PIN receivers Proceed with the link specification meetings General link specification  2009 Design/prototype/test of basic serializer/de-serializer (GBT-SERDES) chip GBT-SERDES (“Tape-out” 9 th of November) Design/prototype/test of optoelectronics packaging GBTIA + PIN on TO CAN  2010 GBLD re-spin GBT-SERDES testing Detailed link specification document Full prototype of optoelectronics packaging Prototype of “complete” GBTX chip  2011 Extensive test and qualification of full link prototypes System demonstrator (s) with use of full link Schedule of the final production version is strongly dependent on the evolution of the LHC upgrade schedule ? !

22. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch22 Additional slides  Additional slides

23. GBT Chipset – Power Consumption

24. GBTX – Power Consumption

25. GBLD – Power Consumption

26. GTIA – Power Consumption

27. http://cern.ch/proj-gbtPaulo.Moreira@cern.ch27 Forward Error Correction (FEC)  High rates of Single Event Upsets (SEU) are expected for SLHC links: Particle “detection” by Photodiodes used in optical receivers. SEUs on PIN-receivers, Laser-drivers and SERDES circuits  Experimental results confirmed that for Error- rates below 10 -12 Error Correction is mandatory! Upsets lasting for multiple bit periods have been observed  Proposed code: Interleaved Reed-Solomon double error correction 4-bit symbols (RS(15,11)) Interleaving: 2 Error correction capability: 2 Interleaving × 2 RS = 4 symbols  16-bits Code efficiency: 88/120 = 73% Line speed: 4.80 Gb/s Coding/decoding latency: one 25 ns cycle  GBT frame efficiency: 70% A line code is always required for DC balance and synchronization For comparison, the Gigabit Ethernet frame efficiency is 80% (at the physical level) At a small penalty (10%, when compared with the Gigabit Ethernet) the GBT protocol will offer the benefits of Error Detection and Correction BER A. Pacheco, J. Troska, L. Amaral, S. Dris, D. Ricci, C. Sigaud, F. Vasey, P. Vichoudis, "Single-Event Upsets in Photoreceivers for Multi-Gb/s Data Transmission,” Nuclear Science, IEEE Transactions on, vol.56, no.4, pp.1978-1986, Aug. 2009