2.  In digital devices there are only two values, usually referred to as 0 and 1. 1 means there is a voltage (usually 5 volts) and 0 means the voltage is 0 volts  In the 1960s, microelectronics got another boost with the creation of the integrated circuit, or IC for short.

3.  Integrated Circuit- an electrical lay-out etched on thin, small, layers of semiconductor materials, incorporating or integrating various components inside, with the result of having a single device perform a particular function.

5.  1. Integrated circuits incorporate several functions and circuitry in one small, thin rectangular-shaped object.  2. Integrated Circuits have low power consumption

6.  1. When an IC is damaged, you cannot repair it  2. Ics that are sensitive to static electricity can easily be damaged by it  3. The sensitivity of the IC makes it important to provide the proper packaging and storage for it.

7.  Integrated circuits can be classified into many groups, and these are some of the groupings of the various integrated circuits:  1.Number of components  2. Packaging  3. Purpose

8.  1. SSI(Small Scale Integration)- For ICs with only a few transistorized components, mostly less that twenty.  2. MSI(Medium Scale Integration)- This group includes ICs with 20 to a few hundred transistorized components. It can be also composed of several SSI components  3. LSI (Large Scale Integration) – This involves ICs which have components numbering in the thousands  4. VLSI(Very Large Scale Integration) – This comprises about 1000,000 to as high as several million miniaturized components in one chip

9.  1. SIP( Single In-Line Package)- contain pins aligned only one side  2. DIP(Dual In-Line Package)- The pins are arranged only on two sides of the package and are arranged in a single line.  3. QIP(Quad In-Line Package)- The pins are arranged on all four sides of the packages which is square shape  4. PGA(Pin Grid Array)- This is similar to QIP but it runs in sevral layers deep  5. TSOP(Thin-Small-Outline Package- A special quad package, but for smaller ICs like memory components

10.  1. General Purpose Integrated Circuits  2. Hybrid Integrated Circuits  3. Application Specific Integrated Circuits (ASIC)