1. Working Group 1 Technological Aspects and Developments of New Detector structures WG1 Geometry and Interactions

2. WG1: Technological Aspects and Developments of New Detector Structures Objective: Detector design optimization, development of new multiplier geometries and techniques. Task 1: Development of large-area Micro-Pattern Gas Detectors (large-area modules, material budget reduction). Task 2: Detector design optimization including fabrication methods and new geometries (Bulk Micromegas, Microbulk Micromegas, single-mask GEM, THGEM, RETGEM, MHSP, charge-dispersive readout, Ingrid). Task 3: Development of radiation-hard and radio-purity detectors. Task 4: Design of portable sealed detectors.

3. How will we work? Obviously, the work has to start from the Applications. There will be meetings on the various tasks to compare findings, exchange experience from the applications Example : Thick-GEMS are developed for various applications: photon detection for Cherenkov, calorimetry, muon systems… RD51’s goal is to make these work together. Another example : large bulk Micromegas are developed for sLHC muon chambers, neutrino long baseline experiments, calorimetry. Here also cross-fertilization between applications would be productive. The first step was to ask, end of May 2008: - What is your preferred technology?(GEM, Micromegas, THGEM, RETGEM, MHSP, Cobra, PIMS, Microgroove, microwell, microdots…) - What are your main applications? (calorimetry, TPC, photon detection, medical, imaging,… - What is your timescale (small prototyping, scale 1 prototyping, delivery of detector, …) GEOMETRY OF WG1

4. Geometry of WG1 38 institutes out of 54 expressed interest in tasks of Working Group 1 28 on Large Area Detectors (task 1) 9 on Design optimization (task 2, strong overlap with WG2) 20 on Radiation hard and high radiopurity (task 3) 3 on sealed detectors (task 4, recently added) Large area detectors in various technologies are studied for various applications : SLHC muon chambers (tracking and triggering) SLHC forward tracking ILC-TPC Cherenkov counters neutrino long baseline experiments

5. Read-out board Laminated Photo-image- able cover lay frame Stretched mesh on frame Laminated Photo- image-able cover lay Raw material Single side copper patterning Polyimide etching Copper reduction Development of large-area Micro-Pattern Gas Detectors Bulk Micromegas Single mask GEM

6. Development of large-area Micro-Pattern Gas Detectors (as of September 22) Bulk Micromegas Single mask GEM

7. Development of resistive anodes

8. Task/Milestone Reference Participatin g Institutes DescriptionDeliverable Nature Start/Deliver y Date WG1-1/Development of large-area Micro-Pattern Gas Detectors - Micromegas CEA Saclay, Demokritos, Napoli, Bari, Athens Tech. U., Athens U., Lanzhou, Geneva, PNPI, Thessaloniki, Ottawa/Carlet on Development of large area Micromegas with segmented mesh and resistive anodes First prototype (1x0.5m 2 ) m1/m12 SLHC full sizem13/m60 CEA Saclay, Ottawa/Carlet on Demokritos, Athens Tech. U., Athens U. ILC full sizem13/m36 WG1-1/Development of large-area Micro-Pattern Gas Detectors - GEM Bari, CERN, Pisa-Siena, Roma, Arlington, Melbourne, TERA, PNPI, MPI Munich, Argonne GEM R&DReport, small size prototypes m1/m18 Bari, CERN, Pisa-Siena Full scale prototype m6/m18 Development completed m19/m30 Arlington Medium-size prototype m1/m6 1 m 2 prototypem13/m18 1 m 3 stackm19/m30 Roma, Bari JLab HallA full scale prototype m18/m30 Task & Milestones: Development of large- area Micro-Pattern Gas Detectors (large-area modules, material budget reduction).

9. 200  m MESHES Electroformed Chemically etched Wowen PILLARS Deposited by vaporization Laser etching, Plasma etching… Many different technologies have been developped for making meshes (Back-buymers, CERN, 3M-Purdue, Gantois, Twente…) Exist in many metals: nickel, copper, stainless steel, Al,… also gold, titanium, nanocristalline copper are possible. Can be on the mesh (chemical etching) or on the anode (PCB technique with a photoimageable coverlay). Diameter 40 to 400 microns. Also fishing lines were used (Saclay, Lanzhou)

10. drilling + chemical rim etching without mask Mask etching + drilling; rim = 0.1mm Detector design optimization, fabrication methods and new geometries 6 keV X-ray 10 4 pitch = 1 mm; diameter = 0.5 mm; rim=40; 60; 80; 100; 120 mm THGEM Example

11. RTGEM: resistive electrode THGEM 3÷10 G  / copper oxide layer Gain of RETGEM in various gases: resistive foil glue pads PCB mesh Resistive anode: Charge dispersion readout 1 M  / plastic foil Discharge studies and spark-protection developments for MPGDs

12. Applications : ILC-TPC, DM, SLHC vertex detector, polarimetry in Astrophysics… Techniques: GEM, Micromegas Gas + Pixel detectors 55  m 14111  m 16120  m 14080  m (pixel array) 11 2233 44 55 55 μ m μ m Preamp/shap er TH L dis c. Configuration latches Interface Counter Synchronizat ion Logic TimePix 65000 pixels per chip Counting, time, time over threshold modes adressable pixel by pixel.

13. TimePix + Micromegas InGrid: grid deposition by post-processing on the chip Ultimate resolution: charged tracks and X-rays are reconstructed e- by e-

14. TimePix + Micromegas Electron counting in X rays and Fano factor direct measurement. Déliverable EUDET par Saclay: endplate 8-chips

15. Interactions of WG1 WG2 WG1 Production Electronics Test beams Characterization, basic studies on performance, aging Simulations New materials, new geometries Protection