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Matt Waldersen (Presenting) TJ Strzelecki Rick Schuman Krishna Jharjaria.

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Presentation on theme: "Matt Waldersen (Presenting) TJ Strzelecki Rick Schuman Krishna Jharjaria."— Presentation transcript:

1 Matt Waldersen (Presenting) TJ Strzelecki Rick Schuman Krishna Jharjaria

2  The proposed project is a mobile brain-computer interface.  Consists of 3 major subsystems  An EOG system to navigate a head-mounted display  An EEG to interact with applications on a head-mounted display  A single-board computer to generated the augmented reality environment  Each subsystem varies in complexity and has it’s own unique power requirements which results in a variety of safety and reliability constraints to account for.

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4  dsPIC Microcontroller (dsPIC33EP512MU810)  Most complex component that did not come on a premade board (unlike the FPGA, Single-Board Computer Processor and the Neurosky TGAM1 Module)  Switch-Mode Buck Regulator (LT1374)  Has more extensive performance requirements than any other regulator in our entire system  Analog-to-Digital Converter Module (ADS1210)  Most complex component in the EOG subsystem

5 ParameterDescriptionValueComments C1C1 Die Complexity Constant0.2816-Bit Microcontroller πTπT Temperature Coefficient3.10T J = 125° C C2C2 Pin Number Constant0.052 Nonhermetic Seal; N p = 100; C 2 = (3.6x10 -4 )(N P ) 1.08 πEπE Environmental Constant4.0Mobile Ground Environment πQπQ Quality Factor10.0 Other Commercial or Unknown Screening Levels πLπL Learning Factor1.0Greater than 2 years in production λpλp 10.76 MTTF 10.61 Years Monolithic Bipolar and MOS digital Microprocessor Devices λ P = (C 1 π T + C 2 π E )π Q π L

6 ParameterDescriptionValueComments C1C1 Die Complexity Constant0.04Assumed 301-1000 Transistors πTπT Temperature Coefficient58.0T J = 125° C C2C2 Pin Number Constant0.0026Hermetic Seal; SMT; N p = 8 πEπE Environmental Constant4.0Mobile Ground Environment πQπQ Quality Factor10.0 Other Commercial or Unknown Screening Levels πLπL Learning Factor1.0Greater than 2 years in production λpλp 23.3 MTTF 4.9 Years Monolithic MOS Digital and Linear Gate/Logic Array Devices λ P = (C 1 π T + C 2 π E )π Q π L

7 ParameterDescriptionValueComments C1C1 Die Complexity Constant0.2832-Bit Microcontroller πTπT Temperature Coefficient0.98T J = 85° C C2C2 Pin Number Constant0.0064Hermetic Seal; SMT; N p = 18 πEπE Environmental Constant4.0Mobile Ground Environment πQπQ Quality Factor10.0 Other Commercial or Unknown Screening Levels πLπL Learning Factor1.0Greater than 2 years in production λpλp 3.0 MTTF 38.05 Years Monolithic Bipolar and MOS digital Microprocessor Devices λ P = (C 1 π T + C 2 π E )π Q π L

8  High: Could potentially injure the user  Medium: Renders the system inoperable (no longer fulfills all of the PSSC’s)  Low: Inconvenience to the user, but the system still fulfills all of the PSSC’s

9 1) An ability to encode/decode data packets from a NeuroSky EEG. 2) An ability for a user to select applications based on signals from a NeuroSky EEG. 3) An ability for a user to navigate between different applications on a display using EOG signals. 4) An ability for the system to interactively train the user to effectively operate the device. 5) An ability to display a live video stream from an external camera module, and integrate applications into the video system.

10 Failure No.failure ModePossible CausesFailure Effects Detection Method Criticality A1Failure of GPIO Incorrect installation of the FPGA Complete loss of EOG Signal Analysis EOG Watchdog; Visual inspection of FPGA Medium A2 Failure of First SPI Module Logic Level Translator Failure; Horizontal EOG Connection Failure; ADC Module Failure Loss of Horizontal Navigation Capabilities; Potential overheat power components if soldered in reverse EOG Watchdog; Visual inspection of Horizontal EOG Connection; Regulator indicator LED High A3 Failure of Second SPI Module Logic Level Translator Failure; Vertical EOG Connection Failure; ADC Module Failure Loss of Vertical Navigation Capabilities; Potential overheat power components if soldered in reverse EOG Watchdog; Visual inspection of Vertical EOG Connection; Regulator indicator LED High A3 Failure of Third SPI Module Logic Level Translator Failure; Physical Connection Failure Complete Loss of Communication with the Single Board Computer System Watchdog Timer Medium A4 Failure of UART Module Incorrect dongle "hack" Complete loss of communication with NeuroSky EEG EEG WatchdogMedium

11 Failure No. failure ModePossible CausesFailure EffectsDetection MethodCriticality B1VIN > 14VBattery Failure Incorrect positive voltage output; Perminant damage to Linear Regulator and ADC EOG Watchdog; Indicator LED High B20V < VIN <5VBattery Failure Incorrect positive voltage output; ADC Failure; Op- Amp Saturation will cut off EOG signal EOG Watchdog; Indicator LED Low B3VIN < 0VIncorrect EOG Connection Perminant Damage to Linear Regulator, ADC, and Voltage Inverter Indicator LEDHigh B4C100 Short Component Failure; Incorrect component Installation Loss of positive voltage output; PCB Damage InspectionHigh B5 C100 Open Circuit Component Failure; Incorrect component Installation Less Regulated OutputInspectionLow B6C200 Short Component Failure; Incorrect component Installation Loss of positive voltage output; PCB Damage Inspection; Indicator LED High B7 C200 Open Circuit Component Failure; Incorrect component Installation Less Regulated OutputInspectionLow B8R28 Short Component Failure; Incorrect component Installation Indicator LED Damage Indicator LED Inspection Low B9 R28 Open Circuit Component Failure; Incorrect component Installation Loss of Indicator LED Functionality Indicator LED Inspection Low B10LED1 Short Component Failure; Incorrect component Installation; R28 Failure No indicator of Regulator Error Indicator LED Inspection Low B11 LED1 Open Circuit Component Failure; Incorrect component Installation; R28 Failure No indicator of Regulator Error Indicator LED Inspection Low

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