1. How the Future of Signal Processing Will Affect Us Gene A Frantz Principal Fellow Texas Instruments

2. Agenda A bit of history A look into the future Summary

3.  C, C++, MatLab Programming Languages  Pocket size development tools 2000’s  Up to 1GHz/5760 MMACS  Multiple processors on chip  Higher quality of MIPs DSP RISC processor HW accelerators Peripherals  Assembly language ZAC, LTD, MPY 1980’s TMS320C10  3 Microns  55K transistors  5 MIPS  kHz  4 kRAM

4. Gene’s Law DSP Power Power Dissipation Trends 1,000 100 10 1 0.1 0.01 0.001 0.0001 0.00001 mW/MMACs 1982 1984 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 2010 Year

5. FIRST WAVE… TELECOM - Digitizing the phone system - Modem data rates accelerating - 1.2Kbps to 56Kbps - DSL, Cable modems, 802.11 - Digital cell phones WHAT IS THE THIRD WAVE? SECOND WAVE… ENTERTAINMENT - More performance - Power dissipation issue - Combined with telecom to create streaming media - More personal more portable Waves of DSP Innovation

6. Agenda A bit of history A look into the future Beyond

7. Communications:  Telecom  Wireless Infrastructure Entertainment:  Video Infrastructure  Client Video So...what’s next? Transportation Wide Range of Applications Set to Benefit from Increased Performance

8. Automotive: The Drive to Autonomous Cars Parking Assist Lane Departure Warning Adaptive Cruise Control Pedestrian Detection Blind Spot Detection Night Vision Drowsiness Detection  Real-time image processing and analysis  Compatible with CCD/ CMOS imagers, lidar and infrared sensor-based systems  AEC-Q100 qualified with CAN bus interface

9. Communications:  Telecom  Wireless Infrastructure Entertainment:  Video Infrastructure  Client Video So...what’s next? Transportation Quality of Life Wide Range of Applications Set to Benefit from Increased Performance

10. 1000 pixels: Allows mobility and face recognition Bringing New Quality-of-Life to Applications Such as Artificial Vision 16 pixels: Provides the ability to see the difference between night and day Today Tomorrow

11. Communications:  Telecom  Wireless Infrastructure Entertainment:  Video Infrastructure  Client Video So...what’s next? Transportation Quality of Life Security Wide Range of Applications Set to Benefit from Increased Performance

12. Video Analytics: the Key to Safety and Privacy  Too many cameras, not enough people!  People are ineffective at monitoring video for extended periods of time  Video analytics needed to help operators do their job more effectively  Without intelligence, video surveillance is a passive tool

13. Communications:  Telecom  Wireless Infrastructure Entertainment:  Video Infrastructure  Client Video So...what’s next? Transportation Quality of Life Green Security Wide Range of Applications Set to Benefit from Increased Performance

14. Digital Signal Processing Makes Green a Reality Macro energy harvesting  Solar  Wind  Wave Micro energy harvesting  Piezoelectric  Kinetic  Thermoelectric

15. Digital Motor Control Advanced Sensing Digital Power Supplies Digital Signal Controllers Make Green a Reality

16. Communications:  Telecom  Wireless Infrastructure Entertainment:  Video Infrastructure  Client Video And...what’s beyond? Transportation Quality of Life Green Security Wide Range of Applications Set to Benefit from Increased Performance

17. Agenda A bit of history A look into the future Beyond

18. Two Interesting Emerging Areas  Energy harvesting (scavenging)  Moving to the third dimension  Heterogeneous multi-processing  Stacked die

19. Perpetual Devices  Power scavenging will be the source of energy  Solar  Heat  Vibration  Integrated batteries will backup the source of energy  Ultra-low powered devices will include the  Digital circuits  Analog circuits  RF circuits  Sensors

20. Heterogeneous Multi-processor SoCs  As we drive toward hundreds of processors on chip with more performance and less power, the possibilities are limitless  With the ability to integrate Billions of transistors on a circuit, the rest of the system will find its way onto the SoC  Integration will next take on the third dimension

21. Thank You Gene A Frantz Principal Fellow Texas Instruments