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Design and Implement a Electro thermal Compliant

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Presentation on theme: "Design and Implement a Electro thermal Compliant"— Presentation transcript:

1 Design and Implement a Electro thermal Compliant
Course Project Design and Implement a Electro thermal Compliant ETC : Electro-thermal actuator -provide electric energy -convert to heat -thermally actuated (motion) Conventor Design (Layout and simulation) -Familiar with Co-ventor tools -Basic 3D model construction -Meshing/naming entities/setup BC/simulation -Feedback and optimize your design Mask Fabrication (Done by MFF) Device Fabrication

2 Course Project Process
SOI wafers Box Oxide 1mm Device Silicon ( Ω-cm) 15mm Mask ETC: pattern ETC structure Device doping : POCl3 Device release : Isotropic Etch

3 Course Project Specification
Dimension : Less than or equal to 500m * 300 m Design rule : Electrode (Probe pad) >= 100*100 m2 Devices Feature size >=3 m Max Width of beam <=30 m Maximum applied voltage : <100V Structure : No constrain on the geometry of device. ***REMARKS*** You should take care of the device release process, which is an isotropic etch of 1m oxide. If your anchor area is too small, your device may leave off during the release process.

4 Course Project Remarks
It is suggested to keep 50% (in area) of the oxide under anchor in order to provide sufficient mechanical support. Cross Section Before etch Blanket area oxide removal Horizontal etch Device released 100% Over-etch Anchor Width Max Width to be released Top view If the oxide under anchor has been etched too much, your device may “peel off” Anchor Device Oxide

5 Course Project Competition
Competition Rules -Max force between two groups’ structures (Student should point the contact part of the shuttle, TA will do the joint part) -Only Pull type is allowed. -Vapplied is unrestricted, but the max voltage we support is 99V. -The details: pls see the examples next slides.

6 Course Project Competition
Example1: Group 1 Group1 win 20 mm 8mm 8mm We do it 20 mm Group 2 Group2 win

7 Course Project Competition
Example2: Group1 win Group 1 20 mm 8mm 8mm 20 mm We do it Group 2 Group2 win

8 Course Project Example

9 Coventor Example ETC Simulation -Material definition
-Fabrication (Process flow design) -Layout (Structure design) -Device fabrication (Meshing and Naming Entities) -Analyzer setting (Boundary conditions) -Simulation (Finite State Analysis) -Viewing result

10 Coventor-Process : Create Substrate

11 Coventor-Process : Oxide Formation

12 Coventor-Process : Si Formation

13 Coventor-Process : Beam Patterning

14 Coventor-Process : Cavity Opening

15 Coventor Example ETC Simulation -Material definition
-Fabrication (Process flow design) -Layout (Structure design) -Device fabrication (Meshing and Naming Entities) -Analyzer setting (Boundary conditions) -Simulation (Finite State Analysis) -Viewing result

16 Coventor – Create a New Layer

17 Coventor – Edit Your Layout
Edit by input co-ordinate Standard drawing tools Other useful functions

18 Coventor – +/- Photoresist
Be careful when choosing +/- PR

19 Loading the models into your Coventor directory
HW1 Loading the models into your Coventor directory Create a directory titled ”hw1” in project selection view

20 Click the model/mesh browser icon in the design tab

21 Click the import icon

22 Select the model you want to import (in the directory you unzip the files

23 You will now see a model in your empty directory

24 You can open the model and check it’s dimensions and start doing your hw1

25 Coventor Example ETC Simulation -Material definition
-Fabrication (Process flow design) -Layout (Structure design) -Device fabrication (Meshing and Naming Entities) -Analyzer setting (Boundary conditions) -Simulation (Finite State Analysis) -Viewing result

26 Coventor – Select Layer for Meshing
Mesh the layer(s) to be stimulated Hide unused layer(s)

27 Coventor –Meshing Mesh setting Naming Entities

28 Coventor –Meshing

29 Coventor Example ETC Simulation -Material definition
-Fabrication (Process flow design) -Layout (Structure design) -Device fabrication (Meshing and Naming Entities) -Analyzer setting (Boundary conditions) -Simulation (Finite State Analysis) -Viewing result

30 Coventor –Analyzer setting
Boundary conditions Anchor : Position fixed Anchor : Temp=300k Anchor : Potential difference=5V

31 Coventor Example ETC Simulation -Material definition
-Fabrication (Process flow design) -Layout (Structure design) -Device fabrication (Meshing and Naming Entities) -Analyzer setting (Boundary conditions) -Simulation (Finite State Analysis) -Viewing result

32 Coventor –Result Viewing
Displacement Current density Simulation successful (no error generated in simulation) Potential Heat flux Real-time Simulation Progress/health Monitoring

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