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THEMIS SCM PDR CETP 10/10/2003 1 Parts and materials Christophe Coillot 1)Parts Preliminary definition of part list 3D+ modules appear as a component Most.

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Presentation on theme: "THEMIS SCM PDR CETP 10/10/2003 1 Parts and materials Christophe Coillot 1)Parts Preliminary definition of part list 3D+ modules appear as a component Most."— Presentation transcript:

1 THEMIS SCM PDR CETP 10/10/2003 1 Parts and materials Christophe Coillot 1)Parts Preliminary definition of part list 3D+ modules appear as a component Most of components for calibration function Passive components are not presented FunctionReferenceProviderQuantity/ModelControl Spec PreamplifierPROMETHEE13D+3PID qualified by ESA Voltage regulatorPROMETHEE23D+1PID qualified by ESA Voltage regulatorLM117H/883 1MIL-STD-883 Voltage regulatorLM137H/883 1MIL-STD-883 SwitchADG612/883 1MIL-PRF-38535 Operational Amplifier LM108 2MIL-STD-883 Connectors8630-15P NM B 1 Connectors8630-15S NM B 1

2 THEMIS SCM PDR CETP 10/10/2003 2 Parts and materials Christophe Coillot 2) Materials Material for THEMIS SCM is divided in three parts : -materials used for sensors, -materials used for sensor structure, -materials used for preamplifier (PCB and preamplifier housing)

3 THEMIS SCM PDR CETP 10/10/2003 3 Parts and materials Christophe Coillot 2) Materials a) materials used for sensors FunctionMaterial designationProviderReference Wire for windingCopperThomsonTHOMREX 165 Polyurethane Winding InsulationMakrofol (polycarbonate)Technopoint Disc 1 & 2 (Hollow or not) Epoxy EPOXY FR4 Disc conductive surfaceCopper Glueglue3M2216 Lamellas assembly for Magnetic core Ultraperm 65µmVAC Lamellas assembly for Magnetic core Kapton3M

4 THEMIS SCM PDR CETP 10/10/2003 4 Parts and materials Christophe Coillot 2) Materials a) materials used for sensors FunctionMaterial designationProviderReference Magnetic core pottingSolitane Mandrel 1Epoxy DIUAEPOXY FR4 Mandrel 2EpoxyDIUA EPOXY FR4 Winding pottingPotting material TechnopointSTYCAST1090 Electrostatic shieldingConductive surface in copper on Mandrel 2 and disc 2 Conductive scotch tape3M9703 SolderSN-PB 60/40 Harness sensor to connector Three wires shieldedFILECA

5 THEMIS SCM PDR CETP 10/10/2003 5 Parts and materials Christophe Coillot 2) Materials b) materials used for sensors structure FunctionMaterial designationProviderReference StructureKetron peek Fixation screws of sensors Inox screws A2LEVRAT Electrostatic shielding Conductive paint : copper (Tbc) Fixation structure on interface Inox screws A2LEVRAT

6 THEMIS SCM PDR CETP 10/10/2003 6 Parts and materials Christophe Coillot 2) Materials c) materials used for preamplifier FunctionMaterial designationProviderReference PCBEpoxyInessysFR4 Fixation of PCB (screws & others) Inox screws A2LEVRAT Preamplifier HousingAluminiumGDTECH ALLOY 2618A Solder for componentsSn-PbSREE Solder PCB to connectorSn-PbSREE Wire PCB to connectorInsulated wire AWG26 (Tbc) SREE


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