1. Research activities at ITA for future accelerator M. C. Esteban

2. 1 Outline Introduction ILC:FTD detector –Activities –Projects & contributions SLHC: CMS Tracker upgrade detector –Activities –Projects & contributions SuperKEKB: DEPFETdetector –Activities –Projects & contributions ITA HEP group

3. 2 Introduction ITA has been working in HEP since 2008 Two main working areas: –Electromagnetic compatibility issues EM noise characterization of new technologies for HEP –Power supply distribution systems Several topologies has been studied –Serial powering & DC-DC powering (SLHC) –Power pulsing (ILC) Both issues (EMC & PS) have been tackle at the same time to ensure the correct integration of electronics at system level –It will help to implement a robust system by design

4. 3 Introduction Our work has been focused on three future accelerators: –ILC: Sub-detector FTD (ILD) –SLHC : Sub-detector Tracker upgrade (CMS upgrade) –SuperKEKB: Sub-detector DEPFET (Belle II)

5. 4 ILC: FTD detector The mstrip-FTD system is a silicon strip tracker located in the innermost part of the tracker region of the ILD. It constitutes of 10 disks.

6. 5 ILC: FTD detector Main working areas : A. Power supply distribution design: Power estimation B. Analysis of power pulsing effects in the power supply distribution system: Transients EMI The analysis of both powering aspects will define the optimal power supply topology

7. 6 ILC: FTD detector - Main Power design parameters A. Power consumption : –The total number of strips is higher than a million Non –uniform distribution –Total current consumption of FTD is around 650 A Currents consumption of FTD per power group MIDDLE PITCH FTDFTD3FTD4FTD5FTD6FTD7 TOPBOTTOPBOTTOPBOTTOPBOTTOPBOT I2.5 (A) per PG10.24 11.2011.68 I1.25 (A) per PG4.72 5.365.68 Power Groups44444 TOTAL FTD Power groups 40

8. 7 ILC: FTD detector - Main Power design parameters B. Analysis of power pulsing effects in the power supply distribution system: The ILC accelerator has a duty cycle of 0.5% –1 ms bunch train every 200ms If the power demanded by the FEE is synchronized to the bunch train, it helps to save energy – Energy dissipated will be lower However several important issues have to be considered during the design of the power system: –Transient phenomena –EMI phenomena All these phenomena have an impact in the design of the power supply distribution system –Topology –Cooling and material budget

9. 8 ILC: FTD detector - Main Power design parameters Transients Voltage Voltage compensation may be required –Cable resistance Over-voltages and Voltage dips may be present –Cable inductance Power consumption 1 ms bunch train every 200ms V= 1,25 V; I= 12 A

10. 9 ILC: FTD detector - Main Power design parameters EMI The synchronization of the FEE power operation with the bunch crossing introduces a current periodic signal with a spectra content in the power supply system. The spectra content varies between few Hz up to several hundreds of kHz LF- Problematic due near field : Magnetic field –Every 5 Hz a pulsing magnetic field higher than 0.2 A each Itotal = 40 x 0.2 A = 8 A –It may cause mechanical problems Vibrations – wire bounding degradation

11. 10 ILC: FTD detector - Power supply topology There are several topologies that may be implemented in the FTD. –DC-DC based power distribution –Local LV RAD-hard regulators –Remote power supply Each of them has advantages and disadvantages We consider DC-DC as the first option of analysis: –To absorb transients associate to power pulsing system. Keep transients locally at FEE level. Low currents before DC-DC due to converter ratio –Low transients –Synergy with SLHC and new DC-DC hard-rad design. HF noise & Rad issues

12. 11 ILC: FTD detector - Power supply topology

13. 12 ILC: FTD detector – Projects & Contributions FTD detector studies since 2011 Projects –I+D en Detectores para Futuros Colisionadores: FPA2010- 22163-C02-01 (Ip: I.Vila) 2011- 2013 Estudios de EMC en nuevos detectores –ITA HEP activities (2008-2011) Contributions –Linear Collider Power Distribution and Pulsing workshop May 9 -10 in Paris (LAL Orsay). “Powering requirements and constraints of the Mstrip-FTD detector” –Oral presentation

14. 13 SLHC: CMS Tracker upgrade New FEE requirements forces to install DC-DC converters close to FEE (inside sub-detector modules). –The high current demanded by each power channel Low voltage : 2.5 V change to 1.1 V (Power is ≈ constant) It is defined by chip technology (250nm → 130 nm) However DC-DC converters are a very noise source –It is necessary minimize the noise coupling between FEE – DC-DC units –It is necessary to minimize the total noise inside sub-detector volume A large R&D effort is planned and taking place to develop a DC-DC switching converter to operate under high magnetic field with low noise emissions inside tracker volume –However a EM noise studies at system level are required Today Upgrade / Future detectors

15. 14 SLHC: CMS Tracker upgrade Main working areas : Electromagnetic compatibility issues (EMC) Grounding & shielding issues (G&S) Power aspects (PS) –Serial & DC-DC converters evaluation

16. 15 SLHC: CMS Tracker upgrade Working line details –Study and analysis of noise generation and distribution at the system level and define critical points of the system integration strategy. Power network impedance effects on noise emissions of DC- DC converters Study of noise propagation effects in power network. Noise immunity test in FEE prototypes. –Definition of FEE immunity levels »New and/or old FEE Radiation effects on EM noise emissions of DC-DC converters The main goal of these studies is to establish the EMC rules to be applied during the design and integration of the tracker sub-system up-grade. –Define a robust topology of Tracker upgrade system by design

17. 16 de 27 SLHC: CMS Tracker upgrade – EMC characterization of FEE SIMULACION MEDIDAS MATLAB COMSOL 16 EMC characterization of FEE Old Tracker

18. 17 SLHC: CMS Tracker upgrade – PN impedance effects Power network impedance effects on noise emissions The aim is to define and characterize the impedances connected to the DC-DC power converter It defines the noise (conducted and radiated) levels emitted by the DC-DC power converters AT SYSTEM LEVEL Characterization of the electromagnetic environment –Impedances ( FEE & Power Bus) –Multiple units

19. 18 Introducción SIMULACION MEDIDAS MODELO REAL SLHC: CMS Tracker upgrade – PN impedance effects

20. 19 SLHC: CMS Tracker upgrade – Project & Contributions S LCH detector upgrade studies since 2008 Projects –I+D en Detectores para Futuros Colisionadores: FPA2010- 22163-C02-01 (Ip: I.Vila) 2011- 2013 –EMC immunity studies for CMS tracker upgrade - CMS9.04: Ip (F.Arteche e I.Vila) – (2010-2012) –I+D en detectores y estudios fenomenológicos para el colisionador Lineal Internacional : FPA2007 – 66387 (Ip: I Vila) - (2007-2010) –ITA HEP activities (2008-2011)

21. 20 SLHC: CMS Tracker upgrade – Project & Contributions Conferences TWEPP 2008, September, Naxos (Greece) –“Detector noise susceptibility issues for the future generation of High Energy Physics Experiments”. TWEPP 2009, September, Paris (France) –“Interference coupling mechanisms in Silicon Strip Detector – FEE - CMS tracker “wings”: A learned lesson for SLHC”. –“DC-DC switching converter based power distribution vs Serial power distribution: EMC strategies for tracker upgrade TWEPP 2010, September, Aachen (Alemania) –EMC studies for CMS tracker upgrade.Status & Plans JCR paper –Global noise studies for CMS Tracker upgrade, Journal of Instrumentation Dec. 2010 Workshops –CMS power task force meetings –ATLAS & CMS upgrades meetings –Tracker upgrade meeting – Power group

22. 21 SuperKEKB : DEPFET detector – Belle II FEE (Sensor, DCD,DHP,DHH) –It may be sensitive to EM noise –It may radiates ( HF clocks and signals) Power supplies –It emits EM noise Cable & connectors –It may propagate EM noise inside/outside FEE area

23. 22 SuperKEKB : DEPFET detector – Belle II Main working lines are: –To systematically approach the grounding design –To quantify the immunity /emission of the electronic systems. The main goal is: –Conduct studies and measurements to establish a map of EM emissions and susceptibilities of sensitive electronics. Safe DEPFET electronics integration. This is the first time that this kind of mapping will be implemented in a pixel detector –Studies conducted previously in Trackers and calorimeters

24. 23 SuperKEKB : DEPFET detector – Belle II Main activities: –Grounding and shielding strategy for DEPFET: Coordination & Policy –Immunity issues of DEPFET FEE: Susceptibility curves of DEPFET system. –Noise emissions of PS units: FEE noise immunity and PS noise emission coordination –Noise coupling path characterization between FEE and Power units: Noise propagation issues

25. 24 SuperKEKB : DEPFET detector – Immunity issues of DEPFET System The main goal of this activity is to define the susceptibility level of DEPFET FEE to –Radio frequency perturbation –Transient perturbation. A set of test will be performed in an EMC unit –Immunity test to RF disturbances –Transients immunity test

26. 25 SuperKEKB : DEPFET detector – Immunity issues of DEPFET system This EMC unit is defined by the minimum structure that may obtain good results to extrapolate results for the whole detector (same topology) CMS Tracker: 1Petal (6000 channels) CMS HCAL: 1RBX (12 channels) …¿¿DEPFET ??... 1 Module /half ? Power supply DAQ system.. Test set –up preparation complex

27. 26 SuperKEKB : DEPFET detector–Projects & Contributions DEPFET project since 2010 Projects –I+D en Detectores para Futuros Colisionadores: FPA2010- 22163-C02-01 (Ip: I.Vila) 2011- 2013 –EMC studies for DEPFET pixel detector, Research project – Max-Planck Institute & ITA (2011-2013) –ITA HEP activities (2008-2011) Contributions –4th International Workshop on DEPFET Detectors and Applications, Ringberg Castle,- 2-5 May 2010 Grounding & Shielding: Main issues (Oral presentation) –7th International Workshop on DEPFET Detectors and Applications, Ringberg Castle,- 9-10 May 2011 EMC DEPFET Project: A general overview (Oral presentation)

28. 27 ITA - HEP group The HEP studies at ITA are carrying out by Electrical engineering group. –Electromagnetic compatibility characterization & electronics integration. –Developing new solutions to optimize the energy efficiency and performance of systems mixing new technologies. Team coordinator: –Dr. Fernando Arteche Close collaboration with other groups involved in HEP detectors designs –SPAIN CNM & IFCA –Abroad Max-Plank Institute, CERN, Aachen, FERMILAB & SLAC

29. 28 ITA - HEP group EMC - Facilities –Faraday cage –One semi-anechoic chamber –Spectrum analyzers –Current probes & Antennas –Surge & Burst & ESD generators –Amplifiers (kHz-GHz) Electronic Lab - Facilities –Boards designs –Power supplies –Programming controllers Sofware –Pspice –Matlab –COMSOL

30. 29 ITA - HEP group FUTURE …. New 10m Semi- Anechoic Chamber !!!! (Inves. 1.5 M€- 2012) – APPROVED