1. CERN Rui de OliveiraTS-DEM Rui de Oliveira TS-DEM Large size detectors practical limits based on present knowledge

2. CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

3. CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

4. CERN Rui de OliveiraTS-DEM Process status Standard bi-conical LDI exposure –Misregistration top to bottom Standard bi-conical large glass mask –Large mask bowing problem Electrochemical single cone –10 micron level defects on the metals Chemical single cone –Best results up to now

5. CERN Rui de OliveiraTS-DEM Raw material Single side copper patterning Chemical polyimide etching Chemical copper reduction Chemical conical single mask

6. CERN Rui de OliveiraTS-DEM Quality at the micron level is still better with standard GEM We are working hard to improve this parameter 70um 55um 50um

7. CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

8. CERN Rui de OliveiraTS-DEM 650mm Raw material Roll size 500 mm x 100 meter 50 μm polyimide + 5 μm copper polyimide copper Base material

9. CERN Rui de OliveiraTS-DEM Raw material Resist 600 mm x 100 meter Roll to roll process Resist lamination

10. CERN Rui de OliveiraTS-DEM Raw material Mask Resist Film: up to 2m x 0.6m step by step exposure Roll to roll possibility UV exposure

11. CERN Rui de OliveiraTS-DEM Raw material Resist 600 mm x 100 meter Roll to roll process Development by spray

12. CERN Rui de OliveiraTS-DEM Single side copper patterning Roll to roll process 600 mm x 100 meter Copper etching

13. CERN Rui de OliveiraTS-DEM Chemical Polyimide etching Roll to roll process 600 mm x 100 meter Polyimide etching

14. CERN Rui de OliveiraTS-DEM Chemical copper reduction Roll to roll process 600 mm x 100 meter Microetching

15. CERN Rui de OliveiraTS-DEM GEM Practical limitations 450 mm x 100 meter active area 300 μm dead zone between sectors inside one film 2 mm dead zone between two film exposures

16. CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

17. CERN Rui de OliveiraTS-DEM Read-out board Laminated Photoimageable coverlay Frame Stretched mesh on frame Laminated Photoimageable coverlay Exposure Development + cure Micromegas Bulk

18. CERN Rui de OliveiraTS-DEM Hot roll Mesh Frame RubberPCB Coverlay

19. CERN Rui de OliveiraTS-DEM 0.8mm 0.6mm Read-out board Detail on the sector partitioning Spacer pillar (coverlay) Mesh Mechanical milling 0.6 mm tool diameter 2.4mm dead region

20. CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

21. Mesh 2500 x 1000 Laminator 1200 x … Exposure 2000 x 1000 Development 1200 x … Milling 2000 x 1000 Oven 2000 x 1000 Detector 2000 x 1000 Practical limitations Bulk Micromegas

22. CERN Rui de OliveiraTS-DEM Mesh stretching Mesh 2000 x 1000Tension: from 10Ncm to 15Ncm Glue depositOver mesh cutting

23. CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

24. Raw material CNC drilling Electrodes etching Small rim if needed Copper THGEM production description

25. CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

26. CERN Rui de OliveiraTS-DEM Raw material: 2000mm x 1000mm Drilling area: 2000mm x 600mm (1000mm?) –Drilling speed : 3 to 4 holes per second –Tool life: 10000 drills with 2 sharpenings Small rim etching : 2000mm x 1000mm Electrode patterning: 2000mm x 600mm Possible Detector size: 2000mm x 600mm -28 h drilling time for 1mm pitch with 4 heads drilling machine -111h drilling time for 0.5mm pitch " " " " " Practical limits ThGEMs

27. CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

28. CERN Rui de OliveiraTS-DEM Large volume effect Volume Price/area GEM Micromegas THGEM Depends on initial investments

29. CERN Rui de OliveiraTS-DEM Conclusions Practical limits with investment GEM: 100 meter x 450mm Bulk Micromegas: 2 meter x 1 meter ThGEM: 2 meter x 0.6 meter (1 meter?)