1. David Nelson SQP E-board November 4, 2010 1 Pixel nSQP E-board Presented by David Nelson djn@slac.stanford.edu

2. David Nelson SQP E-board November 4, 2010 Status Arrangement of wires on board Determined during board layout. Bundle organization/wire gauges Base line is 28 CCAL for data & 36 Cu for Cmd&Clk Hopefully can migrate to 34AWG for all signals More studies needed on wire selection PP1 penetration and connector to opto- boards No progress – need help from opto-chassis folks 2

3. David Nelson SQP E-board November 4, 2010 Layout of current opto-board 3 VDCs & DORICs 80 pin connector Mounting holes

4. David Nelson SQP E-board November 4, 2010 E-board Wire bond LVDS chips 8 chips on connector side 4 8 LVDS buffers Wire surface mount interface

5. David Nelson SQP E-board November 4, 2010 LVDS Chip wire bond diagram 5 Received 12 LVDS die LVDS die