1. 1 Web Site:www.uniplus.com.tw material introduction

2. 2 UP-HTC Tetra-functional Laminate Features 1.Excellent thermal conductivit 2.Lead free compatible FR-4 laminate 3.Excellent thermal resistance 4.UL94-V0 5.Low Water absorption

3. 3 Composition Single sideDouble side Cu foil HTC layer Al,Cu, plate

4. 4 Ability Cu foil 1/3 ~6 oz HTC layer >15 um Metal layer >0.15mm

5. 5 Applications 1.LED substrate 2.High speed PCB 3.High voltage PCB 4.Auto-Mobile PCB 5.Communication PCB

6. 6 Offering CharacteristicMaterialsTYPEAnnotation PRODUCT SIZE405*610mm MetalAl(5052 1050)0.8 1.0 1.5 2.0mm InsulantResin and Fill80 100 150um CircuitCu 1oz 2oz 3oz

7. 7 Properties Test condition UP- HTC Test Method thermal conductivit(w/m-k) C-96/25/652ASTM D5470 Dielectric breakdownD/48/50 40 TM650 2.5.6 Peel strength C-96/25/65 ≧ 10 TM650 2.4.8 Thermal stress 288 ℃ /10sec/cooling ≧ 10 TM650 2.4.13.1 Water absorptionD/24/23 0.08 TM650 2.6.2.1 T260 TMA ≧ 60 TM6502.4.24.1 T288 ≧ 30 T300 ≧2≧2 TGDSC 130 TM6502.4.25 Z-CTE(%) TMA50~260 ℃ 5.0~6.3 TM6502.4.24.5 Dielectric constantC/96/25/65,1Mhz 4.5~5.0 TM650 2.5.5.1 Dissipation factorC/96/25/65 0.021 TM650 2.5.5.1

8. 8 報 告 完 畢 ! 謝 謝 !