1. V i t a l i s ECE 477 - Spring 2013 TEAM 13 Wireless Biometric Sensor Design Review

2. Team Members Paste a photo of team members here, annotated with names of team members. Shantanu Joshi /Aakash Lamba / Di Mo / Yi Shen

3. PCB Layout: Overall PCB (3.8 x 3.25) Power Board Main Board

4. PCB Layout: Top Copper

5. PCB Layout: Bottom Copper

6. PCB Layout: Silk Layer

7. Trace Size for 3.3 V, 5 V and GND is 0.032 PCB Layout: Overall PCB (2.9 x 1.15) (GND Highlighted)

8. PCB Layout: Overall PCB (2.9 x 1.15) Power Connect 5 V Step Up Fuel Gauge Charger/Booster Decoupling Capacitors (C1,C2) for Power Traces

9. PCB Layout: Main PCB (2.8x 3.25) (GND Highlighted) Trace Size: 3.3 V, 5 V and GND - 0.032 Others – 0.012 Hole Size (Diameter): Power - 0.04330709 Others – 0.02362205

10. PCB Layout: Main PCB (2.8x 3.25) Decoupling Capacitors for Micro: C3,C7,C9 (Size:0805) 9 7 8 6 10 4 5 3 Decoupling Capacitors for VCC/GND: C10 Decoupling Capacitors for Accelerometer : C4 Decoupling Capacitors for OLED : C5,C8 Decoupling Capacitors for Wi-Fi : C6 (Size:1210) *All passive components are surface- mounted

11. PCB Layout: Main PCB (2.8x 3.25) (Debugging Connectors Highlighted) Power SPI RESET JTAG

12. PCB Layout: Main PCB (2.8x 3.25) (Sensor Connectors and Others Highlighted) Accelerometer BUTTON Temperature Sensor POWER Wi-Fi SPO2 LED OLED