1. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island The CALICE –ECAL Silicon - V. Vrba Very FE - S. Manen Readout/DAQ - P. Dauncey Mechanics … - Myself Presentation on the hardware R&D Tungsten-silicon sampling calorimeter OUTLINE  status on the physics prototype (mechanics)  status of the technological R&D on the new design

2. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island The mechanics for the physics prototype  Tungsten metrology  Detector slab design  W-Carbon fiber structure The LLR mechanics group participating M.Anduze, A.Busata, P.Maritaz, D.Pineihro, P.Poileux,etc…

3. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island Physics Prototype – global presentation VME HCAL Movable table Silicon wafer Electronics Beam monitoring Movable table ECAL Detector slab 1 st structure (1.4mm of W plates) 2 nd structure (2×1.4mm of W plates) 3 rd structure (3×1.4mm of W plates) 370 mm 180 mm from Marc Anduze ( LLR ) The CALICE-ECAL physics prototype beam

4. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island The first 3 tungsten plates measured at LLR measured at LLR It confirms the good quality of the plates As measured at IHEP and ITEP. Assuming no strong Geometrical correlation Like for the first 3 plates Marginal impact on the energy resolution for single particle* * Following MOKKA and GEANT4 Tungsten metrology

5. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island Front End electronics (CFi / W) structure type H PCB Silicon wafer Prototype configuration : using PCB solution + external Frond End Shielding Detector slab schematic view

6. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island Tungsten 1.4 mm thick Carbon fiber Structure type H Piece of the first structure Structure W-Cfi 5 alveoli (10 layers)

7. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island Structure type H with its aluminum shielding

8. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island DONE  The production of a sample of 40 tungsten plates starts. it corresponds to the first technological test and first stack of prototype  Production of the final set of masks for the silicon wafers and successful processing of the first 25 silicon wafers (DC coupled) at MSU  The design of the front-end chip is fixed. First batch for test in September. Fall 2002  Processing and test of about 100 silicon wafers (PRAGUE, MSU, LLR)  Final submission of the VFE chip for the prototype (LAL)  Construction of the first 1/3 of the W-CFi structure of the prototype (LLR) Summary on the ECAL prototype

9. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island Pad Silicon wafer PCB Aluminium Cooling tube VFE chip 1.3 mm 1.0 mm 0.5 mm Thermal contact Gluing for electrical contact AC coupling elements ? power line command line signal out A design with electronics inside detector R&D on the new design of the full scale detector

10. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island  A priori, all processes are uncorrelated (Si wafer, VFE chip, PCB,...) we could expect a good Industrial Yield  A priori, all processes are (quasi-)industrial  The mounting of the detector slab is a classical job for electronics industrial  Probably easier access to VFE board (not so trivial argument)  Technically, There are interesting challenges, BUT there are no orders of magnitude to gain  Almost feasible today  What is the behaviour of a VFE chip when a 400 GeV e.m. Shower goes through ??  Thermal studies to design of a ``realistic’’ cooling system Advantages Drawbacks Advantages and drawbacks

11. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island 1 – Analytic calculation SPICE 2 – First simple test with SPICE software SPICE 3 – A PCB prototype to validate SPICE SAMCEF 4 – Very small grid size with SAMCEF software 5 - ``Realistic’’ PCB with cooling circuit SAMCEF-SPICE validation Thermal studies Participation at LLR M.Anduze, J.Badier, A.Karar ….

12. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island What we simulate The analytic result for 6 ``VFE chips’’ Note the asymmetric Temperature peak Heat points (VFE chip) One of the 7 points of measurements Simulated cooling tube PCB 1mm thick

13. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island The way to simulate SPICE with SPICE The results Point numbers Degree K Here different level of cooling on the border is applied V=Temperature I=Caloric quantity

14. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island The time constant Is very large  Average calculation Is good enough SPICE REAL PROTO. The prototype is not exactly simulated since it is not inside a W-Cfi structure… And other ``small’’ differences It will be improved in the future FIRST TEST on the time constant

15. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island SPICE  SPICE is tested with the PCB prototype and use for the test of the dynamic of the system SPICE  When SPICE is validated, it is used to give the condition SAMCEF at the limit for a more sophisticated software : SAMCEF SPICE  Try to find reasonable agreement between SPICE SAMCEF and SAMCEF and the measurement with the prototype SAMCEF  Use SAMCEF for the simulation of the full scale detector - heat source not pointlike - different caloric capacitance (PCB,VFE,strips,…) - very small grid size The proposed strategy

16. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island First simulation with SAMCEF SAMCEF software Note the asymmetric behavior

17. CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island New design of the detector slab  Thermal studies begin ….  The behavior of the VFE with 400 GeV e.m. shower ??? Volunteers !!! The prototype  More or less in the scheduled time (ready for beam at the end of 2003)  Carbon-fiber and tungsten have good behavior … Conclusion Beam 5<P<50 GeV/c Pion/electron beam in 2004 –2005 ????? Same problem for SLAC/Oregon design !!!