1. DSSD update

2. 2Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Outline DSSD design in Vienna: How it is done First test batch of SVD DSSDs Status of the purchase Responses from the vendors Construction of a prototype ladder Status of the trapezoidal DSSD design

3. 3Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 DSSD design in Vienna ICstudio by Mentor Graphics Inc.: commercial software for design of integrated circuits. ICstudio can be steered by a script program written in AMPLE to draw a design automatically.

4. 4Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 DSSD design in Vienna The sensor design is defined by a list of parameters, which are used by the AMPLE program at runtime. This way, one can account for the design rules of the vendor quickly by changing the parameter in question and rerun the program.

5. 5Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Status of test batch purchase Two commercial vendors have been selected to produce one DSSD test batch each: (Norway) (UK) Due to KEK rules, purchase requires official bidding procedure carried out in Japan: Both vendors can be contacted via Micron prefers

6. 6Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Comparison of vendors SINTEFMicron Commencing6 months Wafer Procurement10 weeks- Completion30 weeks=7.5 months9 months Contingency+/- 1 month Masks, Testing8.0 M¥5.1 M¥ Administration1.6 M¥- Processing13 M¥ (23 pcs)2.5 M¥ (first 10 pcs.) 5 M¥ (next 20pcs.) Total Sum22.5 M¥ (178 k€)15 M¥ (120 k€) Sensors received2330 Cost per sensor~1 M¥ (8k €)~0.5 M¥ (4k €)

7. 7Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Status of test batch purchase While official purchase procedure is ongoing and carried out by KEK (Tsuboyama-san knows more), we started the technical discussion with the companies. They each got a preliminary DSSD design as basis for discussion of design rules: –rectangular sensor for layer 3 122.8x38.4mm² active area, 160/50µm pitch – rectangular sensor for layer 4 122.8x57.6mm² active area, 240/75µm pitch

8. 8Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Response from Contact person: Colin Wilburn (Boss) Few answers to technical questions: Lower bias resistor value will improve tolerance control. Proposes as japanese agency, KEK has already worked with them. Manufacturing could take 6-12 months, maybe even longer.

9. 9Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Response from Contact person: Thor-Erik Hansen (Chief scientist) Technical discussion started, we already received valuable hints: We need two additional masks for inclusion of silicon nitride in the polysilicon resistors Strip numbering, labels and alignment markers have to be mirrored on the backplane to appear correctly on the device The vias have to be larger to avoid the “risk of spiking” … Thor-Erik Hansen is on vacation from July 13 until beginning of August.

10. 10Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Construction of a prototype ladder Prototype of ladder 4: –including Origami modules –including trapezoidal sensor Plan for the purchase: –Order rectangular sensors at –Order wedge sensors at Little time left, design of wedge sensors has started.

11. 11Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Construction of a prototype ladder Layer# Ladders Rect. Sensors [50μm] Rect. Sensors [75μm] Wedge Sensors APVs 61706817850 51404214560 41002010300 381600192 Sum:4916130411902

12. 12Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Status of the trapezoidal design The existing AMPLE script used for sensor design is not capable of drawing wedge- shaped sensors. Rewriting necessary, started two weeks ago. Status: –AC strips of frontplane ready –AC strips of backplane including p-stop ready To do: –Implement bias ring, guard ring, edge ring –Implement labels, strip numbering, alignment markers

13. 13Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Status of the trapezoidal design

14. 14Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Status of the trapezoidal design Note: This is not a sensor design, it’s just a proof of concept! Frontplane: p + strips in n bulk material (p-side, junction side)

15. 15Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Status of the trapezoidal design Note: This is not a sensor design, it’s just a proof of concept! Backplane: n + strips in n bulk material surrounded by p-stop atolls (n-side, ohmic side)

16. 16Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Restart of production at Hamamatsu Good news: (Japan) will restart the production of 6” DSSDs. But the first testable devices will be available in one year minimum. So they are not eligible for the production of a test batch. However, they could be back in the game for the final production.

17. 17Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 Summary Both companies and have been contacted to start the discussion, even without official quotation. Rectangular sensor design ready for discussion, wedge design under construction. What are the next steps? –Will KEK request quotations directly from the vendors? –Do we have to wait for the official bidding to take place?

18. 18Manfred Valentan, 3 rd Open Meeting of Belle27-9 July 2009 The End