1. Tonto B

2. 22 Full field – 3 dies in a field Structure repeated Die #2 Structure repeated Die #3 Die #1 (0,0) (19340,6420) 6420um

3. 33 Single die 1000um 3700um Shadow mask for the R/W material. Dimension 1mmx1mm Shadow mask for the top electrode material. Dimension 2.8mmx3.7 mm 2800um 500um

4. 44 Electrical modules in the die n We typically use mod 009 or mod019 (blue circle) to access the 0.5umx0.5 um device. 123 456 789 131211 161514 191817 10

5. 55 Different resistors available in the testchip 1234567891011121314151617 18192021222324 200 K  400 K  100 K  50 K  25 K  1 K  TiN Bottom Electrode Top Electrode Metal Oxide Active Devices Pads 1-18 Pads 19-24

6. 66 Description of mod009 and mod019 n Typically the bottom electrode is either pads 2 or 3 or 4 and the top electrode is any one from pad 19 to 24 depending on what current limit you need.

7. Tonto C

8. 88 Full field 0.5um BC0.35um BC 0.13um BC 0.15um BC Structure repeated (0,0) (15320um,6080um) Resistor Top electrode contact 5080um 3000um 650.4um 648.8um

9. 99 Test structure – 1/2 Zoom in next slide Top electrode contact

10. 10 Test structure – 2/2 Single isolated BC structure.

11. 11 Tonto C shadow mask 400um 1000um 250um 1800um 400um 2000um Shadow mask for the R/W material. Dimension 1mmx1mm Shadow mask for the top electrode material. Dimension 1mmx2mm

12. 12 Test structure schematic 112 7181617192021 35 K  25 K  43 K  400 K  650 K  Bottom wiring Top Electrode Metal Oxide Active Device Pads 7,16,17,18,19,20,21 Pads 1 or 12 Assumed X1 sheet rho=1.5ohms/sq