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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Irradiation studies of L1 sensors for DØ 2b Regina Demina University of Rochester
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Outline Radiation environment and silicon sensor specs Results on prototypes Conclusions
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Requirements for silicon sensors Main challenge for silicon sensors - radiation Depletion voltage ( ) Leakage current ( ) noise Doses comparable to LHC – use their R&D NB: Uncertainty in estimate– conservative approach: 1.5 safety margin 10 years of CMS at inner radius
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Depletion voltage fb Spec L0, L1 V break >700 V T=-10 o C with warm up periods: 4 months 1 st year, 1month each next year Specification on breakdown voltage derived based on depletion voltage evolution Spec L2-5 V break >350 V Hamburg model
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Signal to noise ratio In present design: S/N> 10 T<-10 o C for L0 S/N> 18 T<-5 o C for L1 Important to test I leak after irradiation on prototype sensors and on test structures during production Total I leak in L0 sensor Corresponds to s/n>10 Noise contributions: Capacitive load: 450+43C(pF) Al strip resistance + analogue cables (L0) Shot noise I leak =I 0 + Ad ( =3E-17A/cm) Thermal noise in R bias
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Irradiation studies at KSU More details in T. Bolton’s talk 10 MeV p, sweep the beam using electrostatic deflector Anneal at 60 o C for 80 min, then keep cold Measure I at 1 o C, extrapolate to 20 o C Single sided low sensors with guard band structure produced by HPK
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Leakage current Raw currents measured at T=1 o C Vbreak>700V (spec) =~19fb -1 at r=1.8 cm
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 I leak vs T Measure at 1 o C, extrapolate to 20 o C Verify temperature dependence
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 I leak vs I= p p p =11.6 10 -17 A / cm for 10 MeV p Hardness of 10MeV protons vs 1 MeV neutrons = (10MeVp) / (1 MeVn)=11.6/4.56=2.54 (compared to3.87 * ) G.P Summers et al., IEEE Trans Nucl. Sci NS-40,6(1993)1372 D. Bechevet et al. NIM A 479(2002)487 At 10 MeV p Montreal N.B. =3.0e-17A/cm for 1 MeV n, if use =3.87 Extrapolated to @-10 o C I leak =140 A in L0 S/n>10
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Depletion voltage vs flux Use 1/c 2 vs V to determine V depl – 30- 50% uncertainty
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 V depl vs full size sensors Parameter: Cgcgc gaga kaka E aa gygy kyky E ay N c0 ef f 0 Value: 1.13E-13 cm -2 1.9E-2 cm -1 1.81E-2 cm -2 2.4E13 s -1 1.09 eV 6.6E-2 cm -1 1.5E15 s -1 1.325 eV 1 - Use Hamburg model with stable damage, short and long term annealing terms Flux in protons/cm 2 main effect on C (scales with 1/ )
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Other properties after irradiation Cint: 3 pF(before) 6 pF (after 9.35E13 = 19 fb -1 ): N C =1680e(before) 1815 (after) S/n>9 No change in R poly after irradiation
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Conclusions Single sided low sensor technology with guard band structure is used for the inner layers L1 sensors produced by HPK were tested up to 9.35E13 10 MeV p/cm 2 Hardness factor was found to be 2.54 instead of theoretically predicted 3.87, but in agreement with a study by Rose collaboration Using this number and 1.5 safety factor we estimate 9.35E13 10 MeV p/cm 2 to be equivalent to 19 fb -1 at r=1.8 cm (L0) After this dose u No break down was observed up to 1000 V u Sensors deplete at 350-400 V in agreement with the hamburg model Based on the observed increase in leakage current we expect I leak =140 A for L0 sensors at operating T of –10 o C s/n=~10 u C int increased from 3 to 6 pF, which will lead to increase in C noise from 1680e 1815e u S/n is expected to be above 9 for L0 after 20 fb -1 We believe that these sensors will perform adequately after 20 fb -1
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Back up slides do not print
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Luminosity profile for damage estimate
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Fluence estimations for Run IIb based on CDF silicon leakage current measurements in Run Ia+b observed radial dependence ~1/r 1.7 measured CDF silicon sensor leakage currents are scaled to DØ sensor geometries and temperatures to give shot noise contributions of leakage currents for depletion voltage calculations, a 1 MeV equivalent neutron fluence is assumed: u 1Mev n =2.19·10 13 r[cm] -1.7 [cm -2 /fb-1] (Matthew et al., CDF notes 3408 & 3937) safety factor 1.5 applied
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 Performance extrapolations for Run IIb S/N extrapolations assume u noise in front end of SVX4: 450+43*C(pF) u total silicon strip capacitance: 1.4pF/cm u L0 analog cable assumed (and measured): 0.4pF/cm u noise due to series resistance of metal traces in silicon ~210e-700e depending on module length u noise due to finite value of bias resistor: ~250e u shot noise due to increased leakage currents: s ~1100e for L0 after 15fb -1 if T=-5C s ~1000e for L2 (20cm long module) after 15fb -1 if T=0C
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Production Readiness Review of L0/L1 sensors for DØ Run IIb R. Demina, August, 2003 V depl vs Test diods
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