1. 1 LAPPD Team meeting 6/10/2010 Ossy Siegmund, Experimental Astrophysics Group, Space Sciences Laboratory, U. California at Berkeley Integration of Front-End Electronics with the Ceramic Detector

2. 2 LAPPD Team meeting 6/10/2010 Anode Design for Ceramic Package has Pin Connections 50Ω structure has 3.5mm period Complete ground plane back surface High Voltage connections

3. 3 LAPPD Team meeting 6/10/2010 Anode interface Design for Ceramic Package 0.020” pins with MoMnW - Ni brazed into holes. Spacing easily achieved Reflections and impedence mismatching? Details can be manipulated

4. 4 LAPPD Team meeting 6/10/2010 Electronics interface Design for Ceramic Package Crude concept using J-F Electronics Scheme Attach front end chip array to anode pins using through hole connections. Bond circuit ground planes to back of anode.

5. 5 LAPPD Team meeting 6/10/2010 Electronics interface Design for Ceramic Package Through hole connections on preamp boards allow simple solder connections. Ground plane connection via silver epoxy?

6. 6 LAPPD Team meeting 6/10/2010 High Voltage Connections to Anode on Ceramic Package High voltage resistors Cable to HV supply