1. Fabrication Process for Micro Structures
Prepared for ESS 4810 微系統製造與實驗 Si
Lab 1:
1. Wafer cleaning
2. Thermal Oxide
Wet Oxide
Lab 2-1:
1. Lithography
(PR AZ 5214, mask #1
for bulk etching window) Si
PR AZ 5214 (positive) Si
Lab 2-2:
Break wafer into A, B
BOE wet etching B, RIE dry etch A
PR strip,wafer cleaning
Part A
Part B
Dry etch
wet etch
Lab 3:
E-beam evaporate Cr/Ni 0.05/0.15m on A
TMAH bulk etch B Si
Cr/Ni Si
Lab 4-1:
Lithography patterning Ni by wet etching (mask #3)
Lab 4-2
AZ4620 lithography
Plating Si
AZ4620 Ni
Lab 5:
1. PR strip and Oxide sacrificial etching (surface micromachining)
Fan-Gang Tseng
9/9/02

2. Part B Part A Wafer Layout Over View Bulk micromachining
Surface micromachining
Bulk micromachining
Part A
Part B

3. Alignment Mark and Letters

4. Part A
Surface micromachining
Wing Structures
Cantilever Beams

5. Part B Bulk micromachining Bridges Cantilever beams Long Slots
Different Shapes