1. ECE4006 Group 6 – Presentation 1 Division of Labor – Vikas Parekh – Group management, project schedule manager, background studies. Gautum Khanna – Analog design and testing for the receiver board. Akil Khamisi Sutton – Part management, link budget, alignment tolerance. Theron Davis – Soldering and chip testing, webmaster. Dominic Saltarelli – Analog design and testing for the transmitter board.

2. Tasks undertaken in the first week Location of the IEEE 803.2z standard.IEEE 803.2z Located specifications for the MAX 3287 High Speed Laser Driver.MAX 3287 High Speed Laser Driver. Supply voltage – 3.0V to 5.0V Optimized data rate – 1.25Gbps Laser modulation current – 2mA to 30mA Maximum input resistance – 980Ω. Maximum output resistance – 58 Ω. MAX 3266 TIA Supply voltage – 3.0V to 5.0V Supply current – 26mA Optimized data rate – 1.25Gbps Bandwidth – 920Mhz MAX 3264 Limiting Amp Supply voltage – 3.0V to 5.0V Supply current – 62mA Jitter – 14ps Maximum Edge speed – 300ps

3. Chart1 – Presenting the initial link budget. The products researched so far include vendors like Honeywell, Optek, SIEMENS and Silicon Photodiode Products. Tentative List of Link Budget, PD and VCSEL Parameters.

4. Gantt chart for project

5. Objectives for next week Extend background research. Soldering practice for all group members by Theron, other groups are invited to attend this session by the master. Start on the receiver board assembly. Familiarize group members with lab equipment. Iron out group management plan. Get a working website.