Presentation is loading. Please wait.

Presentation is loading. Please wait.

DETECTOR PIXEL CHIP MCM PIXEL BUS COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (1) SDM comp LASER DIODE 0.28 0.50 Space reserved (15mm) for connections.

Published byPaulina Bell Modified over 9 years ago

Similar presentations

Presentation on theme: "DETECTOR PIXEL CHIP MCM PIXEL BUS COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (1) SDM comp LASER DIODE 0.28 0.50 Space reserved (15mm) for connections."— Presentation transcript:

1 DETECTOR PIXEL CHIP MCM PIXEL BUS COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (1) SDM comp LASER DIODE 0.28 0.50 Space reserved (15mm) for connections between Pixel bus & MCM and pixel bus & power supply extender 0.60 0.42 extender

2 COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (2) 1.90 SDM comp 0.50 0.61 FADC (fBGA) Thermal grease 0.22 glue mcm extender LASER DIODE Glob top

3 COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (3) MCM PIXEL BUS POWER SUPPLY EXTENDER D_PILOT (fBGA) 1.60 Thermal grease LASER DIODE

4 Glob top COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (4) MCM PIXEL BUS POWER SUPPLY EXTENDER GOL (fBGA) 1.60 LASER DIODE Thermal grease LASER DIODE

5 Glob top COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (5) MCM PIXEL BUS POWER SUPPLY EXTENDER 3.00 LASER DIODE 0.90 Optical fibers 1.90 LASER DIODE

6 Glob top PIXEL BUS POWER SUPPLY EXTENDER Optical fibers FLAT CABLE 15 PINS ZIF CONNECTOR MCM 0.90 0.25 0.90 0.35 COOLING TUBE Grounding foil to gnd connection LASER DIODE

7 PIXEL BUS AND PILOT MCM CONNECTIONS (7) PIXEL BUS POWER SUPPLY EXTENDER (VDD + GND) Optical fibers COOLING TUBE FLAT CABLE (biases + senses + Temp monitor +mcm PS) LASER DIODE

8 PIXEL BUS AND PILOT MCM CONNECTIONS (8) 9.2mm 10.64 PHOENIX CONTACT 2 PINS MALE CONNECTOR TYPE MC1,5/2-G-3,81 (9.2mm x 10.64 x 9.01) Or PHOENIX CONTACT 2 PINS FEMALE CONNECTOR TYPE MC1/2-STZ-3,81 (23,1mm x 8,7 x 8,41) Cable 1.5mm2 Cable 2.5mm2 LASER DIODE

Download ppt "DETECTOR PIXEL CHIP MCM PIXEL BUS COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (1) SDM comp LASER DIODE 0.28 0.50 Space reserved (15mm) for connections."

Similar presentations

Hybrid pixel: pilot and bus K. Tanida (RIKEN) 06/09/03 Si upgrade workshop Outline Overview on ALICE pilot and bus Requirements Pilot options Bus options.

Hybrid pixel: pilot and bus K. Tanida (RIKEN) 06/09/03 Si upgrade workshop Outline Overview on ALICE pilot and bus Requirements Pilot options Bus options.
ITS-week CERN December 3, 2001 Michel Morel CERN EP/ED.

ITS-week CERN December 3, 2001 Michel Morel CERN EP/ED.
Using three IR sensors, SensingBot can sense the front obstacles so it can avoid them. Sensing.

Using three IR sensors, SensingBot can sense the front obstacles so it can avoid them. Sensing.
Cooling Channel Count Recap Cooling channel components # Engineering? Absorber: temperature 8*3 yes pressure 2*3 yes He temp 2*3 level 8*3 yes length (optical)

Cooling Channel Count Recap Cooling channel components # Engineering? Absorber: temperature 8*3 yes pressure 2*3 yes He temp 2*3 level 8*3 yes length (optical)
Cable Channel tests ____________________________________________________________ 17/Apr/07 Pisa Group Four configurations of insulation has been tested.

Cable Channel tests ____________________________________________________________ 17/Apr/07 Pisa Group Four configurations of insulation has been tested.
NA62 GTK Cables & Patch Panels. TCC8_GTK1 TCC8_GTK2_GTK3.

NA62 GTK Cables & Patch Panels. TCC8_GTK1 TCC8_GTK2_GTK3.
SPD general meeting Pixel bus and Pilot MCM Integration CERN October 8, 2002.

SPD general meeting Pixel bus and Pilot MCM Integration CERN October 8, 2002.
Chapter 10 Optical fiber measuring instruments and testing single-mode fiber networks.

Chapter 10 Optical fiber measuring instruments and testing single-mode fiber networks.
15-pin monitor male cable connects to... 15-pin female monitor port.

15-pin monitor male cable connects to pin female monitor port.
1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder mm mm Pixel chip Michel Morel EP/ED 09/ x 425µ 256 x 50µ Decoupling capacitors
External hardware examples. External hardware examples Flat-panel, Monitor, and LCD Keyboard Microphone Mouse Printer Projector Scanner Speakers USB thumb.

External hardware examples. External hardware examples Flat-panel, Monitor, and LCD Keyboard Microphone Mouse Printer Projector Scanner Speakers USB thumb.
Performance of the DZero Layer 0 Detector Marvin Johnson For the DZero Silicon Group.

Performance of the DZero Layer 0 Detector Marvin Johnson For the DZero Silicon Group.
1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder mm mm Pixel chip Michel Morel EP/ED 09/ x 425µ 256 x 50µ Decoupling capacitors
SVX4 chip 4 SVX4 chips hybrid 4 chips hybridSilicon sensors Front side Back side Hybrid data with calibration charge injection for some channels IEEE Nuclear.

SVX4 chip 4 SVX4 chips hybrid 4 chips hybridSilicon sensors Front side Back side Hybrid data with calibration charge injection for some channels IEEE Nuclear.
18-Jan-021W. Karpinski System Test 2002 1.Design verification of petals and interconnect boards and control links without detectors a)mechanics b)electrical.

18-Jan-021W. Karpinski System Test Design verification of petals and interconnect boards and control links without detectors a)mechanics b)electrical.
Ladder QA manual. Check items 1 Interlock - Temperature of NOVEC. ✓ Check the difference from the value where the QA in RIKEN was performed is less than.

Ladder QA manual. Check items 1 Interlock - Temperature of NOVEC. ✓ Check the difference from the value where the QA in RIKEN was performed is less than.
CVD PCB, first steps. 15 mm 25 mm Chip area. No ground plane underneath the chip. Bulk isolated => only one ground line Power lines Connector: 11,1mm*2,1mm:

CVD PCB, first steps. 15 mm 25 mm Chip area. No ground plane underneath the chip. Bulk isolated => only one ground line Power lines Connector: 11,1mm*2,1mm:
NA62 GigaTracKer Working Group meeting Integration and GTK-carrier PCB design April 9, 2013 Michel Morel.

NA62 GigaTracKer Working Group meeting Integration and GTK-carrier PCB design April 9, 2013 Michel Morel.
PHENIX Silicon Pixel Detector Construction, Operation, and the first Results Atsushi Taketani RIKEN Nishina center RIKEN Brookhaven Research Center Outline.

PHENIX Silicon Pixel Detector Construction, Operation, and the first Results Atsushi Taketani RIKEN Nishina center RIKEN Brookhaven Research Center Outline.
Off Detector Electronics System [LNF-INFN] 1 Off Detector Electronics System Fan Unit ODEODE 1 ODEODE 2 ODEODE 3 ODEODE 4 ODEODE 5 ODEODE 6 ODEODE 7 ODEODE.

Off Detector Electronics System [LNF-INFN] 1 Off Detector Electronics System Fan Unit ODEODE 1 ODEODE 2 ODEODE 3 ODEODE 4 ODEODE 5 ODEODE 6 ODEODE 7 ODEODE.

Similar presentations

Ads by Google