1. Power System 9-36V -12V -5V -3.3V -2.5V -1.8V -1.2V Vin Distribution

2. Power Requirements of Devices Voltage Line (Volts) DSP (Amps) FPGA (Amps) SATA (Amps) DDR2 (Amps) INS (Amps) Cameras (Amps) SPI (Amps) Total Current/Voltage (Amps) 12004.50000 50.504.500.42005.42 3.300.54.50000.1045.104 2.50TBD00000 1.80100.27600.7101.986 1.201000001 Total Current/Device (Amps)0.52.513.50.2760.420.710.104 18.01 MAX POWER= 102.78W

3. Chip Selection Process Buck Converter Selection WeightLTM4612LT3500LTC1624LTC1876L4964LM34910SDBD9702TPM6681ATRTLE6389GVLT3433 Vin55555555555 Vout53555135423 Iout45334514440 Op Temp35544244455 #Outputs14545454544 Price10443455555 Type33355333355 Complexity45342433344 Total 108107113109898710810410695

4. Chip Selection Process (cont.) Monitor Selection WeightLTC2938LTC2930LTC2932MB3771Max16063 Vsupply555524 Applications355534 Op Temp345545 Price144453 RESET353555 Options353333 Total 8677836074

5. Power Flow Diagram

6. Power Block Diagram

7. Power Schematic -Single Regulator -Vout = 1.19*(1 + R2/R1)

8. Simulation Results

9. Analysis

10. Risk Assessment

11. Hard Drive Selection Process WeightToshiba SSDMicron SSDSamsung SSD Max Seq. Rd5120250200 Max Seq. Wr570100160 SSD Type3444 Total 1396217621812