1. Pressure Cure Oven (PCO)

2. Introduction
Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
PCO pressurizes air into a rigid vessel and heats & cools with forced convection
Heaters, heat exchangers and blowers are internal to the pressure vessel
When the curing process is complete, the pressure oven automatically relieves its pressure to 1atm and cools

3. (for primary industry)
PCO Introduction
Viable applications for PCO
PCO
[Autoclave]
Semi.
Glass
Display
Food & etc
Medical
Test/
Lab.
Composite forming
(for primary industry)
Die attach curing
Wafer laminating
Thermal compress bonding
Underfill curing
Via filling
Film & Tape bonding

4. Introduction
Air bubbles
Solder ball
Substrate
PCO is applied for curing die attach adhesive and removing voids in adhesive or already soldered products

5. Process Specification
Process time: Generally 120 min or User’s spec
Operating temp: 60oC ~ 200oC
Maximum temp: 220oC
Operating pressure: 1 bar – 10 bar
Capacity: 24 Magazines (typical)
Cooling method: PCW (17oC - 23oC)
Cooling water pressure: 25 – 40 psi
Representative Pressure/Temp Profiles (User Configurable)
200℃
60℃
Temp.
30min
90min
120min
Time
10 bar
20min
110min
Cooling process
Curing process
Rising process
Pressure.

6. System Dimensions
1,700㎜
2,200㎜
※ Wight: About 2.7 Ton
1,700㎜

7. Chamber Dimensions
199.5mm
440mm
189mm
716.5mm
608mm

8. Chamber with Shelves Extended

9. Fan motor & mechanical seal Return air assistance damper
System Air Flow
Heater module
Fan motor & mechanical seal
Door inside cover
Return air assistance damper
radiator

10. Vacuum Module Option Vacuum Module (Optional) Vacuum in/out line Gauge
Vacuum pump