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MEMS in SoC 應力所 r90543064 江宏仁. Embedded Systems Copyright 2000, Naresh R. Shanbhag.

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Presentation on theme: "MEMS in SoC 應力所 r90543064 江宏仁. Embedded Systems Copyright 2000, Naresh R. Shanbhag."— Presentation transcript:

1 MEMS in SoC 應力所 r90543064 江宏仁

2 Embedded Systems Copyright 2000, Naresh R. Shanbhag

3 Sensor(MEMS) ->DSP(Circuits, Architectures, OS, Com-piler, Networks -> Actuators (MEMS). mobile/wireless automotive systems(navigation, safety andentertainmentsystems) medical sys-tems(hearing aids) etc. MEMS in SoC

4 Commercial MEMS Products Texas Instruments’ Digital Micromirror Display

5 RF MEMS Applications

6 Cell Phone Components

7 Coupled Resonator System

8 Two Coupled Vertically Driven Resonator

9 MEMS-Enabled Miniature Wireless Transceiver

10 What if you needed,or wanted,adjustable bandwidth or centerfrequency on the input filters? ->Use multiple filters &switches ->Semiconductor/active filters ->Varactor-tuned filters

11 Some RF mems

12 Reconfigurable Antennas

13 Analog IC Design Flow

14 MEMS IC Design Flow

15 The Top Down Design Process for MEMS System architect MEMS, packaging, analog and digital designers IP Custom Level Design New MEMS in New Process Goal: A New MEMS component Semi-Custom Design Existing MEMS in New Process Goal: A Better MEMS component Standard/IP Re-Use Existing MEMS and MEMS Process Making Existing MEMS Available to IC level Designers to Build new systems

16 IP approach

17 Appropriateness  Does the offered MEMS design IP supply exactly what is needed? Portability  How does one move MEMS design IP from development fab to manufacturing fab Yield  How will an IP based MEMS design yield in actual manufacturing and how predictable is this? Reliability  How can one predict the reliability of a MEMS IP design under application specific stresses and challenges. Issues with an IP approach

18 Coupling Effects

19 3D Device Modeling Available in MEMS today *Structural Mechanics (including contact) *Electrostatics & Capacitance Extraction *Thermo-mechanics *Coupled Electro-Thermo-Mechanics (including contact) *Thermal Flow Analysis *Piezoresistive Devices *Electro-Thermal Devices *CFD for Compressible and Incompressible Flow *Electrokinetics and Chemical Transport in Liquids *Damping of complex structures Electrokinetic Switching for Chemical Transport

20 Coventorware from Coventor – http:// www. memcad. com IntelliSuite from Intellisense Inc. – http:// www. intellisense. com MEMS ProCAETool from Tanner Inc. – http:// www. tanner. com MEMScap from MEMScap Inc. – http:// www. memscap. com SOLIDIS from ISE Inc. – http:// www. ise. com Commercially Available Software

21 Layout and process Topography simulation Boundaries, IC process results and Material properties Mesh generation Device simulation System- Level Simulation Outline of the Task Sequence

22 *MEMS will play important role in SoC *MEMS/MST tools exist today. *The Tools can support the design of RF devices and systems. *The Design Process needs to support the integration of MEMS and ASIC subsystems. *ALL players in the design process (Architect, Analog, Digital, MEMS, Package) must communicate. Summary

23 Referenece *Microcosm Technologies www.memcad.com *University of Texas at Arlington Course EE 5349/4328 http://arri.uta.edu/acs/jmireles/MEMSclass/ *UC Irvine http://mems1.inrf.uci.edu/ece119' *berkeley EE143 Microfabrication Technology Fall 2002 Lecture Notes http:// www- inst. eecs. berkeley. edu/~ ee143/


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