1. Detector Developments @ DESY for the European XFEL. Heinz Graafsma; Head of FS-DS; DESY-Hamburg AIDA-Workshop; Hamburg; March 2012

2. H. Graafsma | AIDA-Workshop; March 2012| Page 2 Challenge: Different Science Completely new science Fast science 100 fsec “Single shot” science x10 9

3. H. Graafsma | AIDA-Workshop; March 2012| Page 3 E-XFEL Challenge: Time structure = difference with “others” 600  s 99.4 ms 100 ms 220 ns FEL process X-ray photons <100 fs Electron bunch trains; up to 2700 bunches in 600  sec, repeated 10 times per second. Producing 100 fsec X-ray pulses (up to 27 000 bunches per second). 27 000 bunches/s But with 4.5 MHz rep rate

4. H. Graafsma | AIDA-Workshop; March 2012| Page 4 Single shot imaging… K. J. Gaffney and H. N. Chapman, Science 8 June 2007

5. H. Graafsma | AIDA-Workshop; March 2012| Page 5 XFEL Detector requirements 4.5 MHz

6. H. Graafsma | AIDA-Workshop; March 2012| Page 6 The AGIPD Project

7. H. Graafsma | AIDA-Workshop; March 2012| Page 7 The Adaptive Gain Integrating Pixel Detector The AGIPD consortium: PSI/SLS -Villingen: chip design; interconnect and module assembly Universität Bonn: chip design Universität Hamburg: radiation damage tests, “charge explosion” studies; and sensor design DESY: chip design, interface and control electronics, mechanics, cooling; overall coordination Some Facts 6 years development ~ 20 people Some Milestones First 16x16 pixels prototype End 2010 Definition of final designSummer 2011 Production, assembly and test>2013

8. H. Graafsma | AIDA-Workshop; March 2012| Page 8 The Adaptive Gain Integrating Pixel Detector C1 Leakage comp. C2 C3 Discr. Control logic Trim DAC V thr  V ADCmax Analogue encoding Normal Charge sensitive amplifier High dynamic range: Dynamically gain switching system Extremely fast readout (200ns): Analogue pipeline storage

9. H. Graafsma | AIDA-Workshop; March 2012| Page 9 The Adaptive Gain Integrating Pixel Detector C1 Leakage comp. C2 C3 Discr. Control logic Trim DAC V thr  V ADCmax Analogue encoding Readout amp. 3 levels Filter/write amp. Analogue pipeline Filter/write amp. C1Cn High dynamic range: Dynamically gain switching system Extremely fast readout (200ns): Analogue pipeline storage

10. H. Graafsma | AIDA-Workshop; March 2012| Page 10 AGIPD ASIC Sensor ASIC per pixel ASIC periphery Chip output driver Mux HV + - THR DAC SW CTRL Analog Mem CDS RO Amp Calibration circuitry Adaptive gain amplifier 352 analog memory cells … … RO bus (per column) Pixel matrix

11. H. Graafsma | AIDA-Workshop; March 2012| Page 11 Imaging with AGIPD 0.2 prototype

12. H. Graafsma | AIDA-Workshop; March 2012| Page 12 The Adaptive Gain Integrating Pixel Detector Connector to interface HDIBase plate sensor chip wire bond bump bond ~ 2mm ~220 mm 1k x 1k (2k x 2k) 64 x 64 pixels Basic parameters 1 Megapixel detector (1k  1k) 1 Megapixel detector (1k  1k) 200  m  200  m pixels 200  m  200  m pixels Flat detector Flat detector Sensor: Silicon 128 x 512 pixel tiles Sensor: Silicon 128 x 512 pixel tiles Single shot 2D-imaging Single shot 2D-imaging 4.5 MHz frame rate 4.5 MHz frame rate 2  10 4 photons dynamic range 2  10 4 photons dynamic range Adaptive gain switching Adaptive gain switching Single photon sensitivity at 12keV Single photon sensitivity at 12keV Noise  300e Noise  300e Storage depth  350 images Storage depth  350 images Analogue readout between bunch-trains Analogue readout between bunch-trains

13. H. Graafsma | AIDA-Workshop; March 2012| Page 13 Germanium pixel detector > Germanium pros and cons:  High absorption efficiency  Large, high-quality wafers available  But requires cooling, delicate > Sensor production at Canberra  Modification of strip detector technology > Bump bonding at Fraunhofer IZM  Indium bump process required > Readout and mechanics at DESY  Expected ≥ -70°C operation

14. H. Graafsma | AIDA-Workshop; March 2012| Page 14 The DSSC Project

15. H. Graafsma | AIDA-Workshop; March 2012| Page 15 DSSC - DEPMOS Sensor with Signal Compression > MPI-HLL, Munich > Universität Heidelberg > Universität Siegen > Politecnico di Milano > Università di Bergamo > DESY, Hamburg > Hexagonal pixels 200  m pitch combines DEPFET with small area drift detector (scaleable) > DEPFET per pixel > Very low noise (good for soft X-rays) > non linear gain (good for dynamic range) > per pixel ADC > digital storage pipeline

16. H. Graafsma | AIDA-Workshop; March 2012| Page 16 Output voltage as function of charge injected charge DEPMOS Sensor with Signal Compression DEPFET: Electrons are collected in a storage well ⇒Influence current from source to drain source drain gate Fully depleted silicon e-e- Storage well injected charge DSSC

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19. H. Graafsma | AIDA-Workshop; March 2012| Page 19 The PERCIVAL Project

20. H. Graafsma | AIDA-Workshop; March 2012| Page 20 PERCIVAL (Pixelated Energy Resolving CMOS Imager, Versatile and Large) X- X-ray Imaging MAPS for (X)FELs and Synchrotrons > Ongoing development project between DESY and RAL / STFC > Aim: to develop X-ray imager for FLASH, soft X-ray beams at PETRA III, and for the use of CFEL scientists at other facilities > Sensor developed at RAL, Readout developed at DESY (+ ELETTRA)  Only digital information coming off the chip  Readout development build upon / re-use XFEL and AGIPD developments already done on-site Project timeline  First small test sensors in hand ~ mid-2012  Full system by ~ end 2013

21. H. Graafsma | AIDA-Workshop; March 2012| Page 21 PERCIVAL project photodiodes embedded circuitry handling wafer backthinned (~12um) epi Si board e- Primary energy range 250 eV – 1 keV (will work from <200 eV to few keV) 12  m Si sensitive volume with 25  m pixels  4k × 4k pixel sensor 4 sensors in cloverleaf arrangement can make up 64 Mpixel (20cm x 20cm) back-illuminated, back-thinned for uniform QE > 90% 120 Hz frame rate and lower 2-side buttable (space between active pixel edges on the order of 1mm) electronic noise < 15e-, “full well” ~ 20 Me- Multi-gain approach to access full dynamic range, all gains active all the time Aspired performance parameters:

22. H. Graafsma | AIDA-Workshop; March 2012| Page 22 Board : Readout & Control

23. H. Graafsma | AIDA-Workshop; March 2012| Page 23 Summary > Free-Electron-Lasers are driving detector technology developments > Solid-state (silicon+germanium) detectors > 3 projects ongoing at DESY for FELS:  Adaptive Gain Integrating Pixel Detector (AGIPD)  DEPMOS Sensor with Signal Compression (DSSC)  Pixelated Energy Resolving CMOS Imager, Versatile and Large (PERCIVAL) > Advanced technologies like 3D-ASIC integration will be needed in order to fully utilize the FEL capabilities.