1. The CMS Silicon Strip Tracker Carlo Civinini INFN-Firenze On behalf of the CMS Tracker Collaboration Sixth International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors Carmel Mission Inn, California September 11-15, 2006

2. Pixel Detector Inner Barrel (TIB) Inner Disks (TID) Outer Barrel (TOB) End Caps (TEC) The CMS Silicon Tracker 4 layers in TIB 6 disks in TID 6 layers in TOB 18 disks in TEC S. Mersi 1.2 m 2.7 m

3. 13.09.2006Carlo Civinini INFN-Firenze STD063 Silicon Strip Modules Kapton Bias Circuit Carbon Fiber/Graphite FrameSilicon Sensors Front-End Hybrid Pitch Adapter APV and control chips Kapton tails TIB Module 29 different Module Flavours All single sided sensors  double sided detectors are realized gluing back to back two single sided modules

4. 13.09.2006Carlo Civinini INFN-Firenze STD064 Sensors p on n 6” wafers Inner region: low resistivity 1.5-3.5 k  cm, thin 320  m Outer region: higher resistivity 3.5-7.5 k  cm, thick 500  m Polysilicon resistor Biasing AC-coupled Al readout strips Si orientation Metal overhang on implant strips Single sided 6.136 Thin wafers  6.136 Thin detectors (1 sensor) 18.192 Thick wafers  9.096 Thick detectors (2 sensors) More than 200 m 2 of Silicon Surface 16 Sensor Designs This room is 180 m 2

5. 13.09.2006Carlo Civinini INFN-Firenze STD065 Front-end Electronics APV25 PLL MUX DCU 12 hybrid designs 9.648.128 Strips  electronics channels 75.376 APV chips 26.000.000 Bonds 37 000 analog optical links 3000 km optical fibres Kapton Multilayer Hybrid circuit

6. 13.09.2006Carlo Civinini INFN-Firenze STD066 Front-end Electronics APV25 Radiation tolerant 0.25  m CMOS technology Charge sensitive amplifier with  =50 ns, CR-RC shaper, 192 cell pipeline (4.8  s deep) per channel 128 channels multiplexed to 1 analog output Operation modes: Peak mode (1 sample,  =50 ns); Deconvolution mode (weighted sum of 3 samples,  =25 ns)  High Luminosity MUX 2 APV25 chips outputs onto a single differential line PLL Decodes clock & trigger signals + delay adjusts DCU Slow control data 12 bit ADC (onboard temperatures, leakage current, low voltages) AOH Analog opto-hybrid, converts the front-end analog output current to laser light All functional parameters of these devices can be down/uploaded by mean of I2C bus

7. 13.09.2006Carlo Civinini INFN-Firenze STD067 Module Test The 15232 (+spares) produced modules have been tested to spot possible problems and each strip has been characterized in term of noise, short, open, pinhole etc… Information about module quality has been stored in a production database A large fraction of production has been also thermally stressed before integration on the mechanical structures

8. 13.09.2006Carlo Civinini INFN-Firenze STD068 Module Test TOB noise distribution for 4-chip and 6-chip modules 400V bias (30% production) opens noisy C. Marchettini

9. 13.09.2006Carlo Civinini INFN-Firenze STD069 Module Production Summary Percentage of bad strips on good modules at level of 0.05% - 0.1% Modules produced Good after assembly* Bad*% good TIB/TID3945381013597% TOB543453488698% TEC7228676146794% Total166071591968896% * Sept. 4st 2006 (Includes also module repair) M. Krammer

10. 13.09.2006Carlo Civinini INFN-Firenze STD0610 TIB Integration … how to assemble a piece of Tracker (16 half shells)

11. 13.09.2006Carlo Civinini INFN-Firenze STD0611 TIB Integration Mechanical structure (with cooling pipes and precision ledges) Mount Analog OptoHybrids and Mother Cables Modules installation Tests

12. 13.09.2006Carlo Civinini INFN-Firenze STD0612 Mechanical Structure Temporary fibre Holders Carbon fibre Structural part PT1000 Temperature Probes Cooling pipes Cooling precision Ledges Half shell of half barrel TIB+ or TIB- Depending on the side of the interaction point Plus Minus

13. 13.09.2006Carlo Civinini INFN-Firenze STD0613 AOH and MC Mounting 2 meters long pigtail optical fibres Analog electrical signals from the module Mother Cable: Kapton circuit which provides Modules with power, clock, trigger and I 2 C data Analog Optical Hybrid

14. 13.09.2006Carlo Civinini INFN-Firenze STD0614 Modules Precision Insert Each module has been mounted by hand on the mechanical structure Double sided modules, because of their complexity, need a simple mechanical tool to guide the operator’s hand The precision is anyway defined by the mechanics, no loss of precision or reproducibility in this operation Very rare accidents because of handling…

15. 13.09.2006Carlo Civinini INFN-Firenze STD0615 Tests After each single module has been mounted a fast connectivity test is done (I 2 C bus scan, module identity check) When a string of modules (3) is mounted a deep test is performed: readout timing and optoelectronics optimization then pedestals and noise @ 400V bias

16. 13.09.2006Carlo Civinini INFN-Firenze STD0616 Cumulative noise ADC Counts Layer 4 Backward up noise Distribution Deconvolution 400V bias Opens (0.03%) 2.1 is the cut used During module production Test to flag a noisy strip C. Genta

17. 13.09.2006Carlo Civinini INFN-Firenze STD0617 Full of modules…

18. 13.09.2006Carlo Civinini INFN-Firenze STD0618 Burn in All TIB half shells and TID disks were checked for possible weak components fail and for temperatures and noise behaviour A structure is fully powered and readout during this test. Runs are taken both at room temperature and at cold (C 6 F 14 @ -25 o C and sensors @ -15 o C), peak and deconvolution mode Same sequence as integration: timing and optogain optimization then pedestals and noise run

19. 13.09.2006Carlo Civinini INFN-Firenze STD0619 Burn-in Noise Noise distribution at Burn-in of Layer4 backward up Deconvolution 400V Bias ADC counts A. Venturi M. Vos

20. 13.09.2006Carlo Civinini INFN-Firenze STD0620 Building the TIB+ The TIB half shells are coupled together and then inserted one into the other (4,3,2,1 sequence) to form the barrel T. Lomtadze & A. Basti

21. 13.09.2006Carlo Civinini INFN-Firenze STD0621 TIB+ Seen from the interaction point R. Dell’Orso

22. 13.09.2006Carlo Civinini INFN-Firenze STD0622 Conclusions The CMS Silicon Strip Tracker Collaboration has finished the components production –O(10 5 ) complex objects (modules, electronics boards, mechanical parts, cables, fibres, etc.) tested The integration phase is now well advanced (an O(10 5 ) pieces puzzle) and the different sub- detectors (TIB/TID, TOB, TEC) will be joined together in the coming months Then commissioning and finally Physics…