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Karolina Danuta Pągowska
Soltan Institute for Nuclear Studies Compositional dependence of damage buildup in Ar - ion bombarded AlxGa1-xN Karolina Danuta Pągowska
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Outline 1. Energy loss of ions in solids, collision cascade 2. Ion implanter 3. FET 4. RBS and channeling 5. Channeling spectra for ion bombarded GaN 6. Multi-step damage accumulation in irradiated crystals 7. Summary
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Energy - Depth – Relation for 1.5 MeV He–ions in Si
Rp = 5.21 µm Depth/ µm
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Energy loss of ions in solids
He ions Ar ions Energy loss He ions Ar ions Ionization dEe/dx Displace- ments dEn/dx Ion velocity ~ (Energy)1/2
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Collision cascade
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Ion implanter Target chamber Wobbler Magnetic lenses Accelerator
Magnetic separator Ion source Extraction
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Ion implantation in compound semiconductors and their heterostructures in usually performed for:
Doping Insulating region formation (patterned implantation) Mask Ion beam Sample
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Field – Effect Transistor (FET)
Si substrate Ion beam Mask
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SOI – Silicon On Insulator
SiO2 Si
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Principles of Rutherford Backscattering Spectrometry
Energy Depth x0 Yield x0 Detector - O - Si 4He, 2 MeV x0 Si SiO2
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Ion channeling
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Defect analysis using ion channeling
Short summary of HRXRD superlattice analysis
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Channeling spectra for ion implanted GaN
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Experiment and simulation
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Distribution of displacement atoms
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Schematic representation of the MSDA model
Structure A Structure B Structure C A B B C Low fluence Stage 1 Medium fluence Stage 2 High fluence Stage 3 a b c
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Simulation multi-step accumulation
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Three-step accumulation
For GaN fd1=6 sig1=0.77 fd2=68.5 sig2=0.0398 x2=12.5 fd3=100 sig3=0.008 x3=400
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Three-step accumulation
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Two-step accumulation
For AlGaN fd1=6 sig1=0.86 fd2=54 sig2=0.015 x2=5
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Two-step accumulation
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For AlN fd1=7 sig1=0.245 fd2=63.5 sig2=0.02 x2=10
Two-step accumulation For AlN fd1=7 sig1=0.245 fd2=63.5 sig2=0.02 x2=10
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Two-step accumulation
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Summary GaN Three-step accumulation AlGaN Two-step accumulation AlN
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Thanks for attention
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