1. Silicon Meeting July 10, 2003 Module and Stave Production Status James Fast Fermilab

2. Silicon Meeting July 10, 2003 L1 Module Tooling  Follows closely the L2-5 module tooling design u Assembly fixture the same as 10-10 fixture design s Center and end vacuum pucks altered for smaller sensor size u Bonding and transfer fixture is the same design s Fixture and vacuum grooves scaled down for smaller module size u Flip fixture s Must accommodate bonding of Kapton circuit over full module surface  Most drawings approved for fabrication u Need to adjust Flip fixture to final hybrid HV/GND pad locations  Production fixtures u “Finalize design” dependent on final hybrid sign-off (12/03) u Production schedule to start 1/28/04 u Probably possible to do production earlier s Mechanical aspects of hybrids should be stable earlier

3. Silicon Meeting July 10, 2003 L1 Module Fixture

4. Silicon Meeting July 10, 2003 L1 Electrical Modules  One prototype built (long, long ago) u ELMA sensors u Hybrid aligned by hand and by eye u Kapton HV/GND circuit was not used  To Do List u Verify tooling and procedures with mechanical parts u Assemble single-sensor module for glue irradiation test s Want to use HPK sensor so we have the correct structures & oxides s Will be irradiated at KSU to look for noise or leakage current issues s Final test to certify use of TDR 1100-11 epoxy for use on sensors u Assemble at least 2 electrical modules s Need HPK sensors for these s May need new Kapton flex circuit for HV/GND connection (depends on hybrids) u Develop OGP survey program and database infrastructure s Need above modules with correct fiducials s Need initial output file to write script to massage data for DB s Need to write procedures as programs are developed u Final design and fabrication of Kapton circuits for HV/GND connections

5. Silicon Meeting July 10, 2003 L0 Module Tooling  Flex cable tools u Attach ceramic to cables A and B u Laminate cables B onto cable A with Kapton mesh spacer in between u Current plan is to do this at Fermilab  Sensor sub-assembly tooling u Attach flex to sensor for HV and ground contacts to HV filter u Install HV filter card and connect flex to HV filter u Provide referencing of sensor so it is located for next step  Sensor/flex/hybrid assembly tool u References cables with pins through holes in ears s Dead weights hold cable down on sensor and hybrid u References hybrid with pins to edges of substrate s Vacuum holds hybrid in place u References sensor from edges s Problematic as Kapton is already in place – no good edges s Needs to be integrated with previous fixture for preparing sensor  Bonding tools u Need tooling to hold sensor and hybrid for bonding s Most likely we will use assembly tooling for bonding also

6. Silicon Meeting July 10, 2003 L0 Electrical Modules  Only ELMA sensors available for this  Initial modules used SVX2 HDI’s from Run IIa u Used for initial studies of analog cables  Second round of modules used L1 hybrids (4-chip versions) u Study of noise due to capacitance of analog cables with SVX4 u Study effects of cable spacing u Study noise pickup from support structure  Third generation u Two sets of cable+sensor to the same 10-chip hybrid u Direct comparison of in-house lamination to Dyconex lamination u Includes “jog” in analog cables  First “real” prototypes u Made with 2-chip hybrids and V1 SVX 4 chips u Narrowed ELMA sensor used (to fit in L0A location on structure) u Some difficulties with current draw and noise – under study  Second “real” prototypes u Use 2-chip hybrids with V2 SVX4 chips u Two modules being built with non-cut sensors, 2 cable lengths (for L0B)

7. Silicon Meeting July 10, 2003 Other Issues for Production  Training of additional personnel u Gang assemble – Coincides with shutdown…tech shortages expected u Module assembly (Need second technician to join Jim Wish) u Burn-in (Cecil plus some students to replace Gustavo) u Debugging (hybrids and modules – big void now) u Stave assembly (Done by engineers so far)  Need to emphasize care in handling and cleanliness u Damaged parts cost substantial amounts of manpower debugging and repairing, in addition to lost part $ and value-added costs s Rework of parts will also cause unacceptable slipping in the schedule u Our goal should be <<1% damage in assembly & testing s Requires all involved undergo real training in how to handle Silicon –We cannot expect a priori understanding of the delicacy of Si modules s Requires 110% care – always take the low-risk approach –E.g. using carts to move parts rather than hand carrying them –Always double check (cables on right?, clamps are installed correctly?) s Requires written procedures for everything, followed by everyone –Supervisors and managers need to set a good example s Every part I’ve broken was a result of not following a safe procedure that was developed or not spending time to develop a safe procedure and document it (fortunately most were mechanical parts!)

8. Silicon Meeting July 10, 2003 Other Issues for Production  Storage space u Need to evaluate space in Lab D for sensors and gangs s Less space available with CMS using ~1/3 of the cabinets there u Dry box cabinet designed and prototype paid for by SiDet s Designed with two “extra” shelves at inconvenient heights –Can accommodate Run IIa remnants and IIb prototype modules s Burn-in area needs 8-10 of these cabinets s Lab D needs 1 (2?) for module storage between assembly and bonding –SiDet prototype can be used there s May need 1 or 2 in Lab C for modules waiting to go into staves s Assembly of box nearly complete now s Need to sign-off on cabinets and get them ordered soon u Larger boxes in Lab C can be used for staves & L0 modules s Need to relocate Run IIa test structures and HDIs –Use “extra” shelves in new boxes s Need to evaluate if existing space is sufficient  Need to design fixture/box for storage and testing of staves u Needs to incorporate active cooling  Need “garages” to go over L0 and L1 structures and barrels during assembly and testing in Lab C

9. Silicon Meeting July 10, 2003 Summary  The tooling design for modules is flexible so that we can easily increase production rate. All tooling has been prototyped and performs very well.  Stave assembly tooling has been prototyped successfully. Second prototype, thought to be production tool, has been received. Flatness of tools is still an issue and we are discussing this with the MSU shop.  First production tooling has been ordered (20 cm gang fixtures) and parts have started to arrive.  We are in very good shape with the remaining production tooling designs and are waiting only for final hybrid designs, assembly and testing of electrical prototypes to sign-off.  Main bottleneck has been availability of hybrids and sensors for fabrication of prototype modules.  Testing, debugging etc. needs to ramp up.