1. Feasibility Study Report Nokia Dilbert A-cover assembly Based on 3D files received on 11.09.2009 Version: v0.1

2. 2 General Project name: Customer: PCC Site / Design center: Project type:copy, mfg, Design, R&D, ? Type of Product:e.g. slider / watch Ramp-up: Customer LOM Period / Year / Location Lifetime:# months Customer plant focus: LOM plant focus: Volumes: Total volume Global peak volume Number of sales items / assemblies Needed technologies

3. 3 Feasibility Study Summary Feasibility Study Summary is documented on separate excel –file Copy-paste here a screen shot from Feasibility Study Summary –excel You can also add here a link to the Summary –excel that is stored in project database

4. 4 A-cover assembly – xx xx –xx xx – xx xx General Assy Information #1 A-Cover Gasket uplink mic lower Display window assembly A-cover welded assembly Gasket display Qwerty domesheet assembly Gasket uplink mic upper Qwerty fpc assy

5. 5 A-cover welded assembly – A Cover Bezel xx –A Cover Frame & screw bosses xx – A Cover Support Xx – A Cover Grounding Strip xx Sub Assy #1.1 A-Cover Welded Assembly A-cover grounding strip A-cover frame A-cover support A-cover bezel

6. 6 Part Name: A-cover frame Part 3D Version: 0.040 Material: SUS 304 1/2hard s=0.3mm Weight / Vol.104mm x 58mm x 2.4mm Secondary Operations:Laser Welding Main Technologies:Deep Drawn General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx Thread insert 4pcs

7. 7 Part Name: Qwerty FPC Assy Part 3D Version: 0.000 Material: XXXX Weight / Vol.XXXX Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx Finger Print Sensor

8. 8 Part Name: A-cover bezel Part 3D Version: 0.043 Material: SUS 304 0hard s=0.4mm FinishPolished Weight / Vol.97mm x 59mm x 3.6mm Secondary Operations:PVD,.. Welded to Frame Main Technologies:Deep Drawn General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

9. 9 Part Name: Grounding strip Part 3D Version: 0.021 Material: SUS 301 H s=0.1mm Weight / Vol.34mm x 6.4mm x 0.7mm Secondary Operations:Heat stacked to B Cover (no plating required) Main Technologies:Stamping General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

10. 10 A-cover Support – xx xx –xx xx – xx xx Sub Assy #1.11 A-Cover Support A-cover support plastic A-cover support metal

11. 11 Part Name: A-cover support metal Part 3D Version: 0.022 Material: SUS 304 1/2hard s=0.2mm Weight / Vol.52.4mm x 40.8mm x 2.1mm Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

12. 12 Part Name: A-cover support plastic Part 3D Version: 0.022 Material: LCP Weight / Vol.0.60cm^3 Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

13. 13 Display window assembly – xx xx –xx xx – xx xx Sub Assy #1.2 Display window assembly Acoustic mesh earpiece Capacitive sensor and flex Assy. Window adhesive Window

14. 14 Part Name: Window Part 3D Version: 0.019 Material: XXXX Weight / Vol.2.46cm^3 Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

15. 15 Part Name: Capacitive sensor Part 3D Version: XXXX Material: XXXX Weight / Vol.XXXX Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

16. 16 Part Name: Flex Capacitive Sensor Part 3D Version: XXXX Material: XXXX Weight / Vol.XXXX Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

17. 17 Part Name: Window adhesive Part 3D Version: 0.013 Material: XXXX Weight / Vol.57.1mm x 54.3mm x 0.25mm Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

18. 18 Part Name: Acoustic mesh earpiece Part 3D Version: 0.003 Material: XXXX Weight / Vol.17mm x 5mm x 0.3mm Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx Adhesive Decorative mesh Adhesive Mesh

19. 19 Qwerty domesheet assembly – xx xx –xx xx – xx xx Sub Assy #1.3 Qwerty domesheet assembly Domes Pet layer 1 Pet layer 2 Led reflector pads Thinfilm lightguide Lightguide adhesive

20. 20 Part Name: Led reflector pads Part 3D Version: 0.002 Material: XXXX Weight / Vol.XXXX Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

21. 21 Part Name: Thinfilm lightguide Part 3D Version: 0.011 Material: XXXX Weight / Vol.54.2mm x 41.4mm x 0.2mm Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

22. 22 Part Name: Lightguide adhesive Part 3D Version: 0.010 Material: XXXX Weight / Vol.XXXX Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

23. 23 Part Name: Pet layer 1 Part 3D Version: 0.010 Material: XXXX Weight / Vol.XXXX Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

24. 24 Part Name: Pet layer 2 Part 3D Version: 0.010 Material: XXXX Weight / Vol.XXXX Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

25. 25 Part Name: Domes Part 3D Version: 0.007 Material: XXXX Weight / Vol.XXXX Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx

26. 26 Qwerty FPC assembly Sub Assy #1.4 Qwerty fpc assembly Finger Print Sensor

27. 27 Part Name: Gasket display Part 3D Version: 0.021 Material: XXXX Weight / Vol.55.5mm x 51.8mm x 1.9mm Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx Adhesive Gasket Adhesive Gasket

28. 28 Part Name: Gasket uplink mic lower Part 3D Version: 0.021 Material: XXXX Weight / Vol.7.4mm x 7.2mm x 0.8mm Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx Adhesive Foam

29. 29 Part Name: Gasket uplink mic upper Part 3D Version: 0.021 Material: XXXX Weight / Vol.5mm x 3.2mm x 0.96mm Secondary Operations:XXXX Main Technologies:XXXX General Part Information Major Risks Identified 1.xx 2.xx 3.xx 4.xx 5.xx Foam Adhesive Dust mesh Adhesive

30. 30 Injection Scheme / Gate Locations x hot drops to cold runner, x sub gates per cavity

31. 31 Massive Sections

32. 32 Sharp Edge & Transition

33. 33 Thin / Thickness Areas

34. 34 Slider & Lifter Layout

35. 35 Demoulding Analysis

36. 36 Remarks & Open Issues

37. 37

38. 38