1. Laser programmable logic The idea is 20-25 years old, though technology has enabled to manufacture the arrays from 1995 on. In the beginning (IBM 1979) the technique was used to repair memories. The faulty word was burned out and replaced with a reserve line in the memory array.

2. LPGAtechnology Before programming After programming The unnecessary connections are burned in the programming process. The manufacturer is Chip Express (USA). The same technology was used by Lucent Technologies.

3. LPLD/LASICtechnology LPLD – Laser-Processed Logic Device LASIC – Laser-Configured Aplication Specific Integrated Circuit Manufacturer: Clear Logic Vertical Link –decreases considerably the necessary chip area. Compatible with the Altera Flex series of FGPA-s

4. Formation of the connection

5. The laser is too weak - a gap filled with melting metal has not formed between two metals and there is no connection. The laser has suitable capacity – the gap has been formed and it is filled with melting metal. The laser is too strong – the gap filled with melting metal has been formed next to the connection. Capacity of the laser