1. Thin Film Deposition

2. Types of Thin Films Used in Semiconductor Processing Thermal Oxides Dielectric Layers Epitaxial Layers Polycrystalline Silicon Metal Films

3. Uses for Deposited Films

4. Dielectric Films Used for insulation and passivation Typically deposited via atmospheric pressure CVD, low pressure CVD, and plasma-enhanced CVD Typical films include: –Silicon Dioxide –Silicon Nitride –Low dielectric constant materials –High dielectric constant materials

5. Epitaxy Related to silicon crystal growth Single-crystal semiconductor layer is grown on a single-crystal substrate Homeoepitaxy if grown layer and substrate layer are the same Heteroepitaxy if the grown layer and substrate layer are different Done via: –Chemical Vapor Deposition (CVD) –Molecular Beam Epitaxy (MBE)

6. Lattice Matching Issues in Epitaxy

7. Critical Layer Thickness for Defect- Free Strained Layer Epitaxy

8. Why use Polysilicon?

9. Metal Connections

10. Deposition Requirements

11. Deposition Issues

13. Deposition Issues Are Related to Aspect Ratio of Features

14. Industry Roadmap

15. Deposition Tools

16. Atomospheric Pressure Chemical Vapor Deposition (APCVD) Hardware

17. Improving APCVD Uniformity

18. Steps in a CVD Process

19. Silicon Doping with Arsenic and CVD Film Growth process

20. Silicon APCVD Growth Rates

21. APCVD Modeling

22. Alternative Hardware (Low Pressure CVD – LPCVD)

23. LPCVD vs. APCVD

24. Plasma Enhanced CVD

25. High Density Plasma CVD

26. Physical Vapor Deposition (PVD)

27. PVD

29. DC Sputter Deposition

30. RF Sputter Deposition

31. Benefit of an RF Sputter Deposition Tool

32. Deposition Tools and Conditions for Common Films