1. UTB SOI for LER/RDF EECS Min Hee Cho

2. Outline  Introduction  LER (Line Edge Roughness)  RDF (Random Dopant Fluctuation)  Variation  Solution – UTB SOI  Results  Process of UTB  Conclusion

3. Introduction TR (1947) However, So many problems occur!  Process, SCE / fundamental problems LER, RDF etc 3nm Price : less than 1 Nano dollar for each TR  cheaper and smaller 1m size ball

4. What is LER (Line Edge Roughness) The contribution of gate edge roughness to leakage current and variability has been significantly increased with the MOSFETs scaling. Actually surface is very rough. As device shrinks, the roughness of gate edge become problem

5. Variation due to LER The main source of LER : *Polygrain structure at the interface *Thermal annealing process (such as poly reoxidation) * Litho-process 35nm channel length Rms=2nm Correlation length = 20nm Distribution plot 200nm Fundamental problem frequency

6. What is RDF (Random Dopant Fluctuation) * Dopant is particle * Implantation or Diffusion :Each dopant distribute randomly. And we can’t predict its exact place. *Long channel assumption : Doping distribution =continuous * In short channel device  the number of dopants in channel can be different from device to device  affects Vth characteristics Boron implantation and distribution (MC simulation)

7. Lg vs Current variation As Lg decrease, the RDF problem become severer Variation of On-current vs Lg (Bulk Transistor)

8. RDF – SNM in SRAM SRAM : composed of 6 Transistor Size of square : Static noise margin  the larger, the better For example SNM- SRAM Vin Vout Many curves overlap It is very hard to get good properties of SRAM SNM become worse 200 cases 35nm Lg Distribution plot for SNM SNM of SRAM

9. Solution – UTB SOI There are several solution for distribution  change the process (litho, implantation etc)  change the structure (Fin-FET, SOI etc.) In this review, I focus on UTB SOI (Ultra Thin Body Silicon on Insulator)

10. LDD BOX (SiO2) SOI (Si) Gate UTB SOI Raised S/D  reduced Resistance at S/D No S/D Junction leakage Thin SOI (5~10nm)  Fullly Depleted (channel region controlled by only gate tightly)  reduce lateral Field (Drain electric field)  reduce the Short Channel effect (DIBL) SCE is minimized  Even though Gate length reduced, Vt changes very little (Gate length dependece reduced)  LER effect reduced FD SOI (Thin Body)  Undoped Si  reduce RDF effect Intrinsic

11. Results RDF only LER only Distribution improved drastically Distribution plot for Vt

12. SRAM - SNM

13. Process of UTB Substrate (Si) BOX (SiO2) SOI(Si) Wet etch Substrate (Si) BOX (SiO2) SOI(Thick Si) Oxidation SOI(Si) 2nm single crystal Si Good controllability compared to CMP etc. We can use this tech. in FinFET : Thick Fin  oxidation  thin Fin structure 2nm Thin Body

14. Conclusion  As transistor shrinks, the fundamental problems such as (RDF, LER) become problems  UTB SOI can be one of solutions  UTB SOI : reduce lateral field  SCE↓  LER ↓ : FD  undoped Si  RDF ↓  Review process of UTB SOI

15. References “Simulation of Statistical Variability in Nano MOSFETs” Asen Asenov, 2007 VLSI “High Immunity to Threshold Voltage Variability in Undoped Ultra-Thin FDSOI MOSFETs and its Physical Understanding” O. Weber et al, 2008 IEDM “Evaluation of Intrinsic Parameter Fluctuations on 45, 32 and 22nm Technology Node LP N-MOSFETs” B Cheng et al, Solid-State Device Research Conference, 2008 “Intrinsic Parameter Fluctuations in Decananometer MOSFETs Introduced by Gate Line Edge Roughness” Asen Asenov et al., TED 2003 “Impact of SOI Thickness Fluctuation on Threshold Voltage Variation in Ultra-Thin Body SOI MOSFETs” Gen Tsutsui et al, TRANSACTIONS ON NANOTECHNOLOGY 2005

16. Thank you very much See you again! Q&A