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Vittorio Palmieri 1 Cryogenic Operation of Si Detectors: the Lazarus Effect Vittorio Palmieri Laboratorium fuer Hochenergiephysik, Universitaet Bern, Sidlerstrasse 5, 3012 Bern, Switzerland on behalf of the CERN-RD39 Collaboration http://www.cern.ch/RD39
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Vittorio Palmieri 2 Outline Properties of Si at cryogenic temperatures CCE of heavily irradiated Si detectors at cryogenic temperatures: 10 14 n/cm 2 10 15 n/cm 2 Neutralization of induced defects: the Lazarus effect Low cost “ohmic” devices Segmented devices: irradiated DELPHI module (5 10 14 n/cm 2 ) Low mass cooling Conclusions Future trends
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Vittorio Palmieri 3 Properties of Silicon at Cryogenic Temperatures C. Canali et al., Phys. Rev. B 12 (1975) 2265 G. Ottaviani et al, Phys. Rev. B 12 (1975) 3318
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Vittorio Palmieri 4 Radiation Hardness of Silicon at 300 K E. Borchi et al., Nucl. Phys. B (Proc. Suppl.) 61B (1998) 481 The ROSE Collaboration (RD48) Status Report, CERN/LHCC 97-39 1997
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Vittorio Palmieri 5 1.2 10 14 n/cm 2 Irradiated Si Detectors Operated at 4.2 K, 77 K and 195 K Irradiated at room temperature at TAPIRO, ENEA Italy Stored at room temperature and bonded, therefore fully reverse annealed (RA) Material and process: –Al/n+/n/p+/Al1.8 k cm
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Vittorio Palmieri 6 I-V Characteristic 1.2 10 14 n/cm 2 RA
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Vittorio Palmieri 7 M.I.P.s Signal Charge and Timing C. Da Via’ et al., Proc. of the International Conference on GaAs, Nucl. Instr. and Meth. in Phys. Res. A (1998) in press 77 K 50 V
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Vittorio Palmieri 8 Charge Collection Efficiency C. Da Via’ et al., Proc. of the International Conference on GaAs, Nucl. Instr. and Meth. in Phys. Res. A (1998) in press 1.2 10 14 n/cm 2 RA
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Vittorio Palmieri 9 2.2 10 15 n/cm 2 Irradiated Si Detectors Operated at 4.2 K, 77 K and 195 K Irradiated at room temperature at TRIGA, JSI Slovenia Stored at room temperature and bonded therefore fully reverse annealed (RA) Different materials and processes: –Al/n+/n/p+/Al 1.8 k -cm O 2 –Al/n+/n/p+/Al 2.7 k -cm
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Vittorio Palmieri 10 I-V Characteristic 2.2 10 15 n/cm 2 RA
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Vittorio Palmieri 11 M.I.P.s Signal Charge and Timing V.G. Palmieri et al., Nucl. Instr. and Meth. in Phys. Res. A 413 (1998) 475 77 K 250 V
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Vittorio Palmieri 12 Charge Collection Efficiency 2.2 10 15 n/cm 2 RA V.G. Palmieri et al., Nucl. Instr. and Meth. in Phys. Res. A 413 (1998) 475
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Vittorio Palmieri 13 The Lazarus Effect St. John at al., The Bible, New Testament, ~100
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Vittorio Palmieri 14 Radiation Induced Defects in Silicon EcEc EvEv EfEf Electron Traps (Vacancies Related) V 6 very shallow C I C S (B) E c - 0.11eV0.38/cm VO E c - 0.17eV0.63 C I C S (A) E c - 0.17eV0.38 V2(=/-)+Vn E c -0.22eV0.96 V2(-/0)+Vn E c -0.40eV0.96 (Disappears after annealing) Holes Traps (Interstitial Related) C I E v +0.28eV1.5 (disappears after annealing) C I O I E V +0.36eV1.2 (depends on [C s ] and[O I ]) The ROSE Collaboration (RD48) Status Report, CERN/LHCC 98-39 1998
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Vittorio Palmieri 15 The Lazarus Effect
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Vittorio Palmieri 16 The CERN RD39 Collaboration
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Vittorio Palmieri 17 Temperature Dependence Gennaro Ruggiero PRELIMINARY
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Vittorio Palmieri 18 Voltage Dependence Gennaro Ruggiero PRELIMINARY
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Vittorio Palmieri 19 1.0 10 15 n/cm 2 Irradiated Si “Ohmic Device” Irradiated at room temperature at TRIGA, JSI Slovenia Stored at room temperature and bonded (4min @ 80C = 2weeks at 300C) therefore fully RA Material and process: –Al/n+/n/n+/Al5 k cm ++ + Before irradiation -+ + After irradiation
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Vittorio Palmieri 20 I-V Characteristic Gennaro Ruggiero 1.0 10 15 n/cm 2 RA
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Vittorio Palmieri 21 M.I.P.s Signal Charge and Timing Gennaro Ruggiero 77 K 250 V
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Vittorio Palmieri 22 Charge Collection Efficiency 1.0 10 15 n/cm 2 RA Gennaro Ruggiero PRELIMINARY
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Vittorio Palmieri 23 Liquid Nitrogen Cooling Non-flammable Non-toxic Easy to handle High cooling power Environmentally friendly Available everywhere
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Vittorio Palmieri 24 RD39/COMPASS August Test Beam muon-beam COMPASS -strips telescope RD39 cryostat DELPHI strips
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Vittorio Palmieri 25 DELPHI Module Detectors: Hamamatzu 320 m 5.75 x 3.2 cm 2 3-6 Kohm cm p-side640 strips strip pitch 25 m r-o pitch 50 m n-side640 strips (p-stops) strip pitch 42 m r-o pitch 42 m Electronics:10 x MX6 128 input channels CMOS technology 2.5 MHz speed 1.5 s peaking time s/n degrades by 8.5% for every 100Gy of noise hybrid p-side n-side p-side mx6 V. Chabaud et al., CERN-PPE/95-86, 1995
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Vittorio Palmieri 26 Irradiated (Dead) Detector Peter Chochula and Paula Collins 5 10 14 p/cm 2 NRA Laser Scan
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Vittorio Palmieri 27 Operation in the Cold hybrid p-side n-side mx6 Det 1 non-irr Det 2 5 10 14 p/cm 2 hybrid p-side n-side p-side mx6 beam 77K T hybrid D1 T hybrid D2 T bath Time (s) 2nd module on ! William Hamish Bell and Luca Casagrande Temperature (K)
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Vittorio Palmieri 28 Back from the Dead Luca Casagrande and Paula Collins PRELIMINARY
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Vittorio Palmieri 29 Temperature and Voltage Dependence T V 30V 110K 90V 125K 110K90V PRELIMINARY Luca Casagrande and Paula Collins
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Vittorio Palmieri 30 Liquid Nitrogen Low Mass Cooling Cooling must be taken as an integral part of engineering (not an add-on) Power must be absorbed where it is produced –detector: < 1 µW/cm 2 –read-out: ~ 3 mW/strip Support structures: conduction is negligible if cooling is integrated Vacuum isolation is needed for a reliable low-mass system
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Vittorio Palmieri 31 RD39 Module Tapio Niinikoski
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Vittorio Palmieri 32 Conclusions Cryogenic cooling dramatically improves radiation hardness of silicon detectors After 10 14 n/cm 2 irradiation 100% CCE is achieved with only 50 V detector bias After 10 15 n/cm 2 irradiation a m.i.p., most probable signal of 13000 e, is measured at 200 V detector bias. This corresponds to 50% CCE No difference is found between room temperature and 195 K operation Detectors storage at room temperature slightly affect the results (many months) Cooling needed only during operation Similar results apply to segmented devices
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Vittorio Palmieri 33 Future Trends Low mass cooling system for a full tracker (2 geometry) under construction Ohmic detectors could result in a much cheaper and more reliable solution Need for evaluation of performances of irradiated and non-irradiated FET electronics at cryogenic temperatures
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