1. TE-MPE-EM: Subcontracting Raphaël Berberat 29.11.20121

2. Content  Introduction  Our subcontracted method  Audit and validations of subcontractor  Mechanical parts  Internal control and Non conformity  Some practical examples  Summary  Questions 2

3. Introduction  What  PCB  Assembly of electronic cards and crates  Mechanical parts and front panels  Harnesses  Who 2 FSU collaborator  Mohamed El Bouchty  Malik Menasri 1 CERN staff member  Raphaël Berberat  Dedicated tools  An Access database developed and customized for us by a technical student 3 Since January 2012 565 DAI 247 CERN Store request Outsourcing information

4. How we subcontract 4  By splitting all parts of the electronic cards and crates Planning Coordination Assembly subcontractors for electronic cards Components suppliers Clients PCB subcontractors Harness subcontractors Mechanical subcontractors Subcontracting team

5. Why we subcontract in this way  Advantage: KEEP CONTROL on all parts  Components:  Purchase order only to officials suppliers under license with manufacturer  Industrial conditioning  No raw components  Avoid order to brokers  Risk of fake components  No tracability  Provide the assembler with a kitting list with  References  Quantity provided  Derogation for component when needed Confidence in components 5

6.  But sometimes, customers provide us the components 6

7. KEEP CONTROL on all parts  PCB:  2 subcontractors under contracts with CERN 89 companies contacted during the Market Survey 23 answer received 9 technical audit done on the production site of the pre selected company 7 companies qualified for Invitation to Tender  Contract are possible due to the similar type of our PCB production  We provide technical specification for each product  Including Standards and quality controls  We ask for test report and COC  For multilayer PCB, micro section report and test coupon Confidence in PCB 7

8. KEEP CONTROL on all parts  Assembly:  7-9 validated company and under control  Validation of the company during technical audit on production site  Annual audit of the company to follow the equipment and the know how  No contract signed between CERN and Assembler  Too many configuration types of components and cards or crate  Technical specification for assembly  Specification for solder reflow thermal profile  Baking time for PCB and components before production  Process validation before production  Process flow control  Thermal profile proposed by subcontractor 8

9. KEEP CONTROL on all parts ≠ Validated subcontractor + Process validation Confidence in components + Confidence in PCB + 9

10. Audits and validation of subcontractors If you have other contact, they are allways welcome… 10

11. Subcontracting mechanical parts  We work in straight relationship with the team of EN-MME-MS who are doing the same job as us, but in mechanical subcontracting 11

12. Control and non conformity  When we receive a production from our subcontractor:  Check of production report provided by subcontractor  Visual inspection by sampling the production  Validation of production in accordance to IPC-A-610 Rev E standard  And if there is a non conformity detected  Rework of electronic boards and crate directly by the subcontractor  Rework of electronic boards and crate in our workshop  Editing a non conformity in our database  Tracability and Non conformity  Tracability sticker on each boards  Non conformity database 12

13. Non conformity file 13

14. Some example  EDA-02281-V1-0 for BE-RF  Production of 5 PCB and assembly of 4 electronic cards with front panel  Actives components provided by our customer, other components shall be provided by TE-MPE-EM  Some information about this card  PCB of 16 layer:  Tooling cost: 1’230 Euro  Price per PCB: 451.50 Euro  Total price for PCB production: 3’487.50 Euro  Component information:  92 different references  1039 components on boards  Total price for passive components: 100 Euro  Assembly information:  Total price for the assembly process: 4’499 Euro  EDH document generated:  2 DAI  3 Material Requests at CERNstore  1 shipping 14

15. Some example  SEPAM crate for EN/EL  Production of 50 crates  All components shall be provided by TE-MPE-EM  Some information about this crate  2 sub-assemblies:  Total for PCB backplane : 3’772.50 Euro  Price for backplane assembly: 3’208 Euro  Price for PCB distribution card: 523 Euro  Price for distribution card assembly: 1’039 Euro  Price for mechanical parts: 9’040 Euro  Component information:  98 different references  469 components are composing one crate  Price for all components ordered: 63’432 Euro  EDH document generated:  22 DAI,  3 Material Requests  10 shipping of material 15

16. Subcontracting Summary  What  PCB  Assembly of electronic cards and crates  Mechanical parts and front panels  Harnesses  Who  2 FSU collaborators and 1 staff member  Our subcontracted method  All parts seperately  Components purchase to officials distributors  PCB with 2 company under contract  Assembly with 7-9 subcontractors without contract  Audit and validations of subcontractor  First audit  Annual evaluation of each subonctractor  Always looking for new subcontractors  Mechanical parts  In collaboration with EN-MME-MS  Internal control and Non conformity  Optical test on sample for each production  Non conformity database  Some practical examples 16

17. Customer dedicated application  We keep in touch  With our “consultation client” application 17 \\cern.ch\dfs\Services\Electronics\DEM\Public\Consultation_client

18. Questions? Raphaël Berberat 29.11.2012 18