1. Sensor design and procurement status Mathieu Benoit

2. Advacam Production (Timepix) HV Connection Pad Plans are to insert in the Advacam production 1 or 2 row of Timepix3 compatible Single die sensors, These sensors are to be used in conjunction with the LETI-Timepix3 project. It would be interesting to have the possibility to provide the Sensor HV from the TSV, however for now, a wire-bonding is probably needed to bring the HV to the backside because of the long distance between the dedicated pad and the sensor edge on Timepix3

3. Advacam production (CLICPix) University of Liverpool has provided us with full drawings for 3 type of CLICPix Sensor to be inserted in the Advacam production : CLICPix Prototype (64x64, 1.6 x1.6mm active zone) Quadruple CLICPix (128x128, 3.2x3.2mm active zone) HexakaidecaCLICPix (256x256, 6.4x6.4 mm active zone) The active edge area will be added by Advacam in two flavors, 20 and 50 um edges

4. Micron Production for VeloPix The CLICPix prototype will also be inserted in Micron Velopix production : 2 x 25 Single Chip 2 x 2 Single Chip (could be replaced by quadCLICPix ? )