1. WP7&8 Progress Report ITS Plenary meeting, 10 June 2014 LG, PK, VM, JR

2. 2 Production of 10 dummy modules (without carbon plate) for development of the stave assembly procedure: DONE & SHIPPED to TORINO OB Module assembly dummy module Bari Torino Conductive carrying case

3. 3 New FPCs delivered (12 pieces) Front view Back view FPCs layer stack up Cover-sheet 50 µm Copper 25 µm Kapton 25 µm Copper 25 µm Modules connection test parts Daisy-chain test pads OB FPCs - Last version: DONE F P C

4. 4 The third balls pick up tool is ready - reference pins - laser drilled holes (Ø 100 µm) - pALPIDE_fs pads layout New balls pick-up tool (pALPIDE_fs) peek foil

5. 5 New dummy modules for gluing test glass slide polyethylene filmtransparent film glass slide 210,6 mm 30,1 mm A A B B Dummy FPCs A - polyethylene film (~ 1 mm) B - transparent film (~ 0,09 mm) Glass slide dimension: 15 mm x 30 mm thickness: ~ 50 µm 2 lines of glue (20 mm x 1 mm) on each glass slide mask Representation of a module cross section glue lines

6. 6 5 dummy transparent modules are ready and will be shipped to Torino New dummy modules for gluing test A - 3 dummy module with polyethylene film B - 2 dummy module with transparent film AB AB

7. 7 12 3 4 Conical reference pins Spherical references (ruby) Alignment point Vacuum inlet (chip) Vacuum inlet (FPC) Vacuum inlet (soldering zone) New jig for the assembly and soldering process: ONGOING AND READY END OF JUNE

8. 8 Next activities Production of new transparent FPCs for the optimization of the gluing mask shape Production of the new alignment and soldering tool Production of 2/3 dummy modules for assembly test (almost 28/42 blank chips needed)

9. Module assembly preparation in Strasbourg 2014/06 Started to adapt/implement the module assembly procedure to the local infrastructure based on the design/procedure of the Bari team Modifications: o Automatic placement with ZEVAC IP500 o Automatic vacuum control (LabVIEW) Planned activities for 2014/Q4 - 2015/Q2 Module assembly o Have the assembly tools/jigs manufactured by mechanics service at IPHC (in industry: 3D “printing”) o Develop and finalize the automated placement procedure o Finalize vacuum control and integrate to the placement framework o Final dummy module assembly: placement, gluing, soldering(method?)

10. Layer stackup: -30µm Al -50µm FR4 -30µm Al Padstack -Hole =0,25mm -Top pad=0,6mm -Bottom pad=0,6mm -Min trace width 0,085mm Still no finish, plating and solder mask. Layout compatible with test (daisy chain) chip 4 differentials pairs with selective copper for measuring the diff. impedance 1) Al PCB with selective copper Nikhef/Utrecht University

11. Preliminary Results/Measurements specifiedMeasured Al Top= Al bottom3028±2 FR45046±2 Selective copper98±1 Outer W/S100 / 100 Middle Outer W/S85 / 100 Middle Inner W/S100/ 115Reflection (Zo=120 ohm) Inner W/S85 / 115Reflection (Zo=150 ohm) 7 out of 8 boards were electrically (ohms) OK short in 8th board => Small dimensions are on limit of the producer technology Measured propagation delay 2.4 ns Expected 2,9ns, based on ε r =4,3 kapton Contacting producer about this.

12. Future work Measurements (eye diagrams and S-parameters) on setup with 1, 4 and 7 x 21cm with Al traces: Developing prototype (june 2014) version with plated holes Final goal: compatibility with Cu/Kapton solution but better X0 Should we continue this? Technology promising! Difference in material wrt Cu/kapton~ 0.2 %X0 4.50 USD/cm 2 for single layer no plated holes encouraging Final cost multilayer with plated holes not yet known X0 improvement for OB marginal wrt Cu/kapton Significant effort+some money required

13. Al PCB with laser ablated holes for spTAB Nikhef/Trieste development with Omni Circuit for spTAB. Excellent quality! Bonding at MIPOT failed: Al was optimal for wire bonding Omni Circuit is willing to develop Change Al Kapton Technology looks promising! Should we continue this development? X0 better than copper/kapton spTAB potentially cheaper than soldering Proven solution (SDD/SSD) Suppliers for large quantities? Considerable effort+some money required Laser soldering seems close to final solution Investment on development of soldering tools ongoing  To be discussed in WP

14. Full scale demo module Exchanging information dimensions soldering tools with Cosimo Verifying position of connectors and components

15. CSN III – 20 Marzo 201215