1. Gantry meeting September 2003 Lenny Spiegel, FNAL 1 FNAL Bonding Statistics are shown for the last 17 modules (mini-production). Wire bonding has been done on a dedicated K&S 8090 machine using a 2025 tool. We expect that the change from RMT to Planar pitch adapters will greatly reduce the number of PA repairs. RMT bond pad cleanliness has been an on-going issue. Bonding time does not include inspecting and cleaning bond pads, test pulling every 50 th sensor-to-PA bond, and post inspection of the wire bonds. The total process time should come down to about 30 minutes per module assuming better PA bond pads and much reduced destructive testing. Long times in mini-production summary reflect some problems with the bonding machine. Wire bond skipping is done by modifying K&S files through a PERL script.

2. Gantry meeting September 2003 Lenny Spiegel, FNAL 2 FNAL Bonding Bonds are skipped for pinholes (Idiel) and selected cases of Cac. ARCS testing following bonding revealed no new pinholes (17K bonds).

3. Gantry meeting September 2003 Lenny Spiegel, FNAL 3 FNAL Bonding Sen-to-PA pull test data for odd-numbered modules Units are in grams. RMT PA’s US power adjusted based on results.