1. chip soldering for ALICE ITS upgrade Xiangming Sun Gangjie Wang

2. outline current approach suggestions from a company study progress

3. current approach laser soldering under intensive study

4. talking with a company about the laser soldering proposal: 1,ball machine soldering 2,heat method

5. ball machine soldering thin solder wire

6. heat method 200 degree

7. before and after chip 2.5um FPC 25um

8. microscope picture

9. making ball on chip

10. making ball on FPC

11. ball in FPC

12. summary gold wire diameter is 50um, which can only make 100um diameter ball. 100um diameter wire is needed to make the proper ball for FPC more test is undergoing