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LHeC “shaking hands” meeting Comments on the Tracker Design I. Tsurin Page 1Liverpool December 16th, 2011 Detector granularity Sensor technology Frontend architecture Data Link Powering and cooling
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Decisions, Decisions... R&D, infrastructure ? Physics (process driven) (result driven) Page 2 Alternatively, a variety of ROCs is available for which the sensor geometry could be customised. Wire bonding of objects with different pitch is a common practice. The tracker could be built from available frontend and backend modules Example: Liverpool design of a strip module (4 sections of 22mm long strips with 74.5 um pitch) for the Atlas upgrade
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6-inch wafers (thicknesses range from150um to 600um) produced by Micron in different processes. Device Specs High spatial resolution is the main requirement for the tracking detector Page 3 Top-down design strategy: Physicists should specify granularity of sensors relying on R&D data and MC studies. Liverpool is now committed to measurements of strip detectors with different implant pitch and width and various intermediate strip options.
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(IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 58, NO. 3, JUNE 2011, p1308) Sensor Technology is better in terms of achievable resolution Planar Compared to “p-in-n” detectors: Radiation hardness Compared to “n-in-n” detectors: Advantages of the “n-in-p” process Possibility of back-thinning for low material budget Low manufacturing costs (single-side processing) Easy mechanical handling of the backplane Bulk type does not invert - can be operated under- depleted, - relaxed temperature conditions, - simpler data analysis. Page 4
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because of high resolution requirement Frontend Architecture Analogue ? “Binary” Page 5 Analogue pipeline architecture offers trade-off between data integrity (amplitude information is preserved) and high bandwidth. Limited experience with pixel ROCs (from the lack of available samples :-( Beetle chip is a good platform for strip detectors. It can also operate in the “binary” readout mode.
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Bandwidths of Micro Twisted-Pair Cables and Fusion Spliced SIMM/GRIN Fibre, K.K. Gan, Department of Physics, The Ohio State University Data Up Link Optics ? “Copper” Page 6
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Module control has to dial with short circuits dial with line ruptures Frontend Powering Converters ? Serial Single event burnout causes a permanent short Page 7
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Page 8 Cooling requirements Low voltage: 100mA/chip x 2.5V / 2.5 cm2 1kW/m2 High voltage: 100 A/cm2 x 1000 V 1 kW/m2 (@ -25 deg. C) Convection: ~ 0.5 kW/m2 (@ -25 deg. C) Sensor is cooled through its backplane (suitable for strips) ROC is cooled (current Atlas pixel system) 2.5 kW/m2 3.5 kW (CPT) 20 kW (CST) 4.5 kW (CFT, CBT) 8.5 kW (FST) 5.0 kW (BST) ~ 50 kW in total !
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What if... Savings in the material budget Improved cooling performance Design uniformity and reliability Slot for services Since there is a big asymmetry in in the original design, what are the implications of a narrow gap for ALL highway services brought together ? Page 9
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